摘要
在综述半导体生产线投料策略研究现状的基础上,提出了半导体生产线投料策略的系统动力学模型,并以半导体生产线简化模型为例,给出了半导体生产线投料方法的计算流程,进行了半导体生产线投料仿真实验,仿真结果表明,基于系统动力学的半导体生产线投料策略有改进半导体生产线性能的潜力。
Based on the summarization of state-of the-art release policies, the system dynamics model for solving release policies for the semiconductor wafer fahs was proposed. Meanwhile, the calculation flow of the proposed method was given. Based on the proposed method, the release rate is easily calculated if the input parameters and the goal are set. A simplified semiconductor wafer lab model was used to verify the proposed method＇s validity. It can be seen from the simulation results that the system dynamics based release polity has the potentiality to improve the performance of the semiconductor wafer labs.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2006年第23期2507-2511,共5页
China Mechanical Engineering
基金
国家自然科学基金资助项目(70531020
60374005)
国家重点基础研究发展计划资助项目(2002CB312202)
关键词
半导体生产线
投料策略
系统动力学
仿真
semiconductor wafer tab
release policy
system dynamics
simulation
