摘要
探讨了Mg阴极和Ag阴极的真空蒸镀工艺,Mg蒸镀电流在85A左右时压强开始迅速上升,但Mg原子并未被蒸镀到基底上。随着压强值迅速下降至约上升前的压强值2.6×10-3Pa时,Mg原子开始被蒸镀到玻璃基底上,这与Ag等其他金属阴极材料的蒸镀过程有很大不同。研究还发现热处理可以使Mg薄膜更加致密,表面粗糙度降低,附着力增加。
The vacuum evaporation of Mg and Ag cathodes was presented. The pressure increases rapidly when the evaporation current of Mg cathode is about 85A, but Mg atoms are not evaporated to the glass substrate. As the pressure value approximately drops to the value before increasing, that is, 2.6 × 10^-3Pa, Mg atoms begin to be evaporated to the glass substrate, which is quite different from the evaporation process of other metals such as Ag. Studies show that heat treatment makes the Mg thin film denser, the surface roughness reduced and the adhesion force increased.
出处
《半导体技术》
CAS
CSCD
北大核心
2006年第10期743-746,共4页
Semiconductor Technology
基金
国家自然科学基金(50372038)
陕西省教育厅产业化基金项目(06CJ23)
