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半导体生产后工序设备的自动化改造方案 被引量:4

Scheme on Automatic Reconstruction in the Later Working Procedure of Semiconductor Production
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摘要 针对国内半导体生产后工序设备中的焊机一人一机手动的现状,提出对手动焊机改造的方案,重点分析图像识别系统可以利用的两种方法,即硬件型图像处理系统和软件型图像处理系统,并结合实际情况选择采用后一种方法。同时具体设计了自动焊机的硬件系统和软件系统。该方案可以实现在原有设备基础上,用少量的资金,将原有的设备改造成自动设备,大大提高了人均生产率和产品的合格率。 In semiconductor production, there is one person operating one machine by hands in the later process of bonder. According to this situation, in this paper, the reconstruction proposal is brought forward, and two schemes that can be used are analyzed with emphasis, that is,the hardware image processing system and the software image processing system. Compared with these two schemes,decide to adopt the latter combining with the actual condition. At the same time, the hardware system and software system of automatic bonder are specifically designed. This scheme cart be realized to automatic reconstruction on the hose of the present equipments with little cost,and the proposed design can considerably improve the productivity and up- to - standard efficiency of products.
出处 《计算机技术与发展》 2006年第6期65-67,共3页 Computer Technology and Development
基金 广东省教育厅自然科学基金(Z03021)
关键词 自动焊机 图像处理系统 硬件构成 软件设计 automatic bonder image processing system hardware construction software design
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