摘要
采用扫描电镜、光反射率法和电化学方法观测了黄铜在Ｈ２Ｏ２—Ｈ２ＳＯ４系化学抛光过程中的表面形貌、表面光亮度、电位时间曲线、电流时间曲线。结果表明，黄铜的化学抛光包括浸蚀、光亮和过腐蚀三个阶段，同时对黄铜化学抛光机理也进行了探讨。
Chemical polishing of brass was studied in H2O2-H2SO4 based solution through SEM examination of surface morphology,observation of reflectivity and determination of potiential curves.Experimental results show that the polishing process includes the steps of etching,brightening and over-etching.The mechanism are also discussed.
出处
《电镀与涂饰》
CAS
CSCD
1996年第2期11-15,共5页
Electroplating & Finishing
