摘要
采用化学镀工艺,在Q235基材表面制备出约2μm的Cu-Sn合金镀层,在650～800℃温度和2MPa压力下对合金镀层试样进行真空扩散焊接试验。利用金相显微镜和扫描电镜对焊缝区进行了显微组织观察和能谱分析,用拉伸试验评价了扩散焊接接头的连接强度,并分析了金属薄板堆积成形方向扩散焊接变形情况。试验结果表明,采用Cu-Sn合金镀层可以显著提高Q235钢扩散焊接接头的性能。
Cu-Sn alloy coating in 2μm thickness was prepared on the surface of low carbon steel Q235 by chemical plating technology, and the vacuum diffusion welding experiments of Q235 with Cu-Sn coating were carried out under the condition of 2 MPa pressure and 650 - 800℃ temperature. The microstructure and chemical composition of the joints were analyzed by means of microscope, SEM and EDX. The bonding strength of the joints was examined by the tensile tests and the hot deformation in the laminating direction of thin metal sheets was investigated.
出处
《焊接》
北大核心
2006年第4期25-28,共4页
Welding & Joining
基金
湖南省杰出中青年基金项目02JJYB009资助。
关键词
化学镀
扩散焊接
分层实体制造
chemical plating, diffusion welding, laminated object manufacturing
