摘要
以一款T/R组件中的实用控制电路为对象,研究了基于多层陶瓷电路基板的MC M结构设计。针对高速信号的MCM多层基板布线技术及多层陶瓷基板的制作技术,研制出具有高速电路性能的实用化MCM组件,其体积和重量大幅度减少,基板层数达到12层,最小线宽/线间距0.2mm,组装密度57%。
This paper introduces the design and fabrication of a practical high speed multi-signal controller made of MCM-C. Structure design, wiring design and the fabrication of substrate, which all based on multi-layer ceramic substrate are presented. As a result, the ceramic substrate consists of 12 layers with the minimum line width less than 0.2 mm, and the assemable density reached 57%.
出处
《半导体技术》
CAS
CSCD
北大核心
2006年第5期385-386,389,共3页
Semiconductor Technology
基金
总装备军事预研项目(41323020106)
