摘要
传统焊接技术使用锡铅焊料,对环境造成严重伤害。文章从环保角度出发,阐述了应用无铅焊料的必然性,并介绍了无铅焊料近几年的发展,指出现阶段无铅焊料离市场要求还有一定差距, 需进一步加强研究与开发。
Conventional soldering technology contaminates environmental using Sn-Pb solder. This paper discusses the inevitability for application of lead-free solders from environment protection. The development of lead-free solder especially in recent years are introduced, the disparity between current developed Lead-free solders and market demands is mentioned.
出处
《电子与封装》
2006年第4期6-9,共4页
Electronics & Packaging
关键词
焊接
无铅焊料
电子组装
Soldering
Lead-free solder
Electronic assembly
