摘要
塑料薄膜的激光切割和打孔看似微不足道,但将该工艺引入到制袋工艺中,制袋质量和包装功能将能进一步优化,企业的市场竞争力将进一步提升。介绍了激光技术应用于塑料薄膜的切割和打孔的原理和优势,回顾了激光技术在薄膜加工中的研究进展,并展望了激光技术在软包装应用中的广阔前景。
Laser cutting and perforation of polymer film seems to be a trivial task, but when this process is incorporated into flexible package manufacturing, it provides many possibilities to further optimize the quality of packaging and to further upgrade the competitive power of flexible package companies. The principles and advantages of laser cutting and perforation of thin film plastics were introduced. The research advance of laser technology applied to film processing was reviewed and the future application was put forward.
出处
《包装工程》
CAS
CSCD
北大核心
2006年第2期76-78,共3页
Packaging Engineering
关键词
激光加工
塑料薄膜
激光切割
激光打孔
软包装
laser processing
polymer film
laser cutting
laser perforation
flexible package
