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高性能覆铜板用聚苯醚/环氧树脂体系 被引量:4

Polyphenylene Ether/Epoxy Resin Used for High Performance Copper Clad Laminate
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摘要 简要介绍了高性能覆铜板对基材的性能要求及聚苯醚和环氧树脂分别作为覆铜板基材的优缺点;PPE/EP是具有最高上临界温度的体系,详细讨论了PPE的分子量和用量、相容剂以及改性PPE对PPE/EP体系相容性的影响。采用PPE/EP体系制得的覆铜板(如RG-200)比传统的FR-4覆铜板的介电性能和耐热性能均有大幅度的提高。 It briefly introduced the requirement of high performance copper clad laminate (CCL) for matrix resin, as well as the advantages and disadvantages of polyphenylene ether (PPE) and epoxy resins(EP) respectively used for the matrix resion of CCL. PPE/EP system exhibits an upper critical solution temperature (UCST) behavior. It discussed in detail the influencing effects of the molecular weight and the use amount of PPE, compatilizer and the modified PPE on the compatibility of PPE/EP system. The dielectric properties and heat resistance of the CCL (RG-200) prepared by PPE/EP system are much better than those of the conventional CCL (FR-4).
出处 《塑料科技》 CAS 北大核心 2006年第2期1-4,共4页 Plastics Science and Technology
关键词 聚苯醚 环氧树脂 覆铜板 介电性能 Polyphenylene ether Epoxy Copper clad laminate Dielectric properties
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参考文献25

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共引文献40

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