摘要
利用光学显微镜、透射电子显微镜、X射线衍射仪和显微硬度计，研究了非晶态镍磷合金镀层晶化过程及镀层的组织和性能。结果表明：200～260℃口热，镀层的局部区域已发生晶化；280℃热处理后晶化过程加快；400℃热处理后晶化完全；500℃加热处理后晶粒开始长大。表明非晶态Ni—P合金的晶化在200～400％温度范围内进行，晶化过程中，弥散析出的Ni3P相具有调幅结构。大量高硬度的Ni3P相弥散析出，使镀层硬度大大提高。
The crystallized process of Ni-P alloy and its structure and property were studied with optical microscopy, TEM, XRD and hardness apparatus. The result shows that part of deposit has crystallized when heating at 200 -260℃ ; the process of crystallization is accelerated after heat treatment at 280℃ and it completes when heating at 400℃ ; the grain of crystallization is coarsened when heat treatment temperature is at 500℃ or above. The amplitude modulation structure emerges at the process of crystallization. The hardness of chemical Ni-P alloy coating is increased drastically due to dispersion of Ni3P phase.
出处
《表面技术》
EI
CAS
CSCD
2006年第1期50-52,共3页
Surface Technology
关键词
化学镀
镀镍磷舍金
晶化
合金镀层
Chemical plating
Ni-P alloy plating
Crystallization
Alloy coating
