摘要
本文采用ＴＬＰ－１８型激光热常数仪和岛津ＴＭＡ—３０热分析仪研究了温度对等静压ＳｉＣ换热器材料的导热系数和热膨胀系数的影响，并对影响ＳｉＣ抗热震性能的各因素进行了分析．研究表明，等静压ＳｉＣ材料的导热系数随着温度的升高而降低（２９３Ｔ１４７３Ｋ）；而其热膨胀系数却随着温度的升高而增大（２９３Ｔ１２７３Ｋ）．这为高温ＳｉＣ换热器的设计和使用提供了科学依据．
The effect of temperature on thermal conductivity and linear expansion of SiC materials made by iso-static pressing process was studied by using the thermal constant instrument (TLP-18) with laser flash method and thermomechanical analysis (TMA-30). A theoretical analysis of thermal shock factors for the silicon carbide was studied. The experimental results show that, its coefficient of linear expansion is proportional to temperature (293<T<1273K); but its thermal conductivity is inversely proportional to temperature (293< T<1473K). These results provide a datum for designing and using SiC heat exchangers under high temperature conditions.
出处
《无机材料学报》
SCIE
EI
CAS
CSCD
北大核心
1996年第2期343-347,共5页
Journal of Inorganic Materials
基金
国家自然科学基金
关键词
导热系数
热膨胀系数
换热器
碳化硅陶瓷
thermal conductivity,coefficient of linear expansion,SiC ceramic materials,heat exchanger under high temperature
