摘要
为了能更好地选择电子、电器和通讯产品的镀金层的电气接触表面的高可靠质量和最优化成本,就必须清楚金镀层表面的特征和特性。同时,还应该考虑金镀层表面的使用条件、使用环境、功能和腐蚀机理及抗腐蚀性保护等具体问题。
Electronic contact must has the best reliability of quality and the least production cost in electronics industry, electrical equipment and communication products. We must understand specific property and characteristic of gold plating clearly. At the same time, we should think of the factors and natural conditions of use, function and corrosion mechanism and anticorrosive problem of gold plating.
出处
《电子工艺技术》
2005年第6期362-364,369,共4页
Electronics Process Technology
关键词
金镀层
腐蚀机理
抗腐蚀
Gold plating
Corrosion mechanism
Anticorrosion
