摘要
接触电阻是表征双极板性能的重要参数,然而由于接触电阻难于直接测量,许多研究中仅限于测量体积电阻,即本体电阻和接触电阻之和。通过电导池法测量得到双极板的本体电阻,而通过铜电极法得到了不同压力下的体电阻,结合这两套实验装置,分别得到了本体电阻和接触电阻。在考察不同因素对接触电阻的影响中发现,较低接触压力下接触电阻随着压力的增大迅速降低,而较高接触压力时接触电阻随着压力的增大下降缓慢。另外,改变接触方向对测试结果的影响较小。
Contact resistance is an important parameter for application of bipolar plates. However, we are limited to measure volume resistivity, sum of bulk resistivity and contact resistivity, since contact resistivity cannot be measured directly. In this paper, combined with Cu-plate equipment and Hg-cell measurement, the bulk resistance and contact resistance were obtained respectively. In discussion with the relationship between contact resistance and compaction pressure, we found that contact resistance decreases quickly in lower compaction pressure. On the contrary,in higher compaction pressure the velocity changes slow. In addition, changing contact angle has little effect on contact resistance.
出处
《电源技术》
CAS
CSCD
北大核心
2005年第9期599-601,共3页
Chinese Journal of Power Sources
基金
天津市科技发展计划项目(033183111)
