摘要
以表面加工多晶硅悬臂梁为例分析了MEMS器件在振动环境下的可靠性。将悬臂梁看作一个质量分布参数系统,采用梁的线性弯曲振动方程,运用数学物理方法计算出悬臂梁在振动载荷下的位移响应和应力分布,依据半导体测试国家标准,对典型的实例进行了具体分析,得到了不同尺寸梁的最大位移和最大应力。其结果可为预测悬臂梁的断裂失效和粘附失效提供理论基础,为悬臂梁的设计提供参考。
The MEMS reliability of a surface micromachined polysilicon cantilever under vibration is investigated. The linear bending vibrating equation is adopted to provide the distribution of the cantilever＇s displacement and stress through the mathematic-physical method. The greatest displacements and stresses of the cantilevers with various dimensions are presented. The result shows that distribution of displacement and stress of the cantilever will theoretically benefit to the prediction of stiction or fracture failure and the design of MEMS.
出处
《微纳电子技术》
CAS
2005年第9期420-424,共5页
Micronanoelectronic Technology
基金
电子元器件可靠性物理及其应用技术国家级重点实验室基金资助项目(51433030105JWD601)
关键词
振动
悬臂梁
位移
应力
可靠性
失效
vibration
cantilever
displacement
stress
reliability
failure
