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AMLCD基板玻璃切割条件的选择 被引量:9

SELECTION OF SCRIBING PARAMETER FOR AMLCD GLASS SUBSTRATE
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摘要 介绍了AMLCD基板玻璃切割刀轮的规格、物理参数、研磨方式,研究了研磨方式与切痕、刀轮角度与切割深度、刀轮角度与Lateral crack的比率之间的关系。研究发现在同样的切割条件下使用犁地研磨的刀轮的切痕状况最好;刀轮的角度越小,切割的深度越大,产生Lateral crack的临界压力值越小。由于切割深度可以由加大刀轮的下压量和增大切割压力来获得,因此在刀轮的选择上应首先考虑刀轮角度对Lateral crack的影响。 In this paper, specification, parameter and grinding way of scribing wheel for AMLCD glass substrates scribing is introduced. The relationships between cutting trace and grinding way, scribing depth and wheel top angle, probability of lateral crack generation and wheel top angle are investigated. It has been found that the cutting trace generated by furrow grinding wheel is the best. The smaller the wheel top angle is, the deeper crack will be cut and the smaller critical pressure will be need for lateral crack generated. When scribing wheel selected, what must be taking into account first is the influence of wheel top angle to lateral crack, as the deeper crack also can be generated by large pressure.
出处 《陕西科技大学学报(自然科学版)》 2005年第4期103-107,共5页 Journal of Shaanxi University of Science & Technology
基金 陕西省教育厅资助项目(03JK161)
关键词 有源矩阵液晶显示器 切割刀轮 划线深度 AMLCD scribing wheel scribing depths
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参考文献5

  • 1张麦丽,王秀峰,张方辉,刘建峰.液晶显示器用隔垫物的研究现状与最新进展[J].液晶与显示,2004,19(1):24-29. 被引量:10
  • 2Toshihiko Ono, Yoko Ishida. Cuttability of AMICD Glass Substrates[J]. SID International Symposium Digest of Technical Papers, 2002,(33) :45~47.
  • 3T. Murata, S. Miwa, H. Yamasaki , et al. Suitable Scribing Conditions for AMLCD Glass Substrates[J]. SID International Symposium Digest of Technical Papers, 2003, (34) :374~377.
  • 4Toshihiko Ono,Kohichi Tanaka. Effect of scribe-wheel dimensions on the cutting of AMLCD glass substrates[J]. J. Soc. Inf. Display,2001, (9) :87~93.
  • 5李玉江,刘淑妹.大面积显示器封装工艺探讨[J].液晶与显示,2003,18(1):54-57. 被引量:3

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