摘要
本文介绍了用于多元红外探测器封装的微型杜瓦瓶的三种结构形式，并分析了其漏热、电学性能和工艺性，通过比较对今后我国红外探测器封装技术作出预测。
In this paper three types of electrode lead of the compact dewar for packing multi-element infrared detectors are presente, and each type of the elec-trode lead of dewar is analyzed in three aspects of heat leaking, electric character-istics and technique realizability. The history of dewar development in China is reviewed and the prospect is predicted.
关键词
红外探测器
杜瓦瓶
结构分析
Infrared detector Dewar Structure analysis
