摘要
本文对高密度封装中各结构成分的模型建立及分析作了讨论，根据这些方法编制了相应的程序。应用所编程序对两个封装实例提取出其等效电路网络。最后用ｓｐｉｃｅ程序进行了模拟分析。
Discussions are made about the modeling and analysis of various structural components in high density packaging.Relative programs have been tailored to suit these methods.Using the tailored programs. equivalent circuit netlists have been extracted for two package examples.Finally,Simulation was performed using SPICE program.
出处
《微电子学》
CAS
CSCD
1994年第5期44-48,共5页
Microelectronics
基金
国家自然科学基金
