摘要
作者用Ｘ－衍射研究了热处理对Ｎｉ－Ｍｏ－Ｐ合金镀层的结构和性质的影响。热处理温度升高镀层硬度增加，这与镀层中Ｎｉ_３Ｐ的形成有关。晶态Ｎｉ－Ｍｏ－Ｐ合金镀层的电阻率先随热处理温度的升高而升高，在约５００℃时达最大值，而后下降；对非晶态Ｎｉ－Ｍｏ－Ｐ合金镀层的电阻率，随热处理温度的升高而降低，在６００℃后几乎与热处理温度无关。
It was investigated that the effect of heat treatment on the structure and propertys of electroless-plated Ni-Mo-P alloy films using X-ray diffraction (XRD). Hardness of these films increased with increasing heat-treatment temperature which showed to be related to the formation of Ni3P phase in films.The resistivity for crystallized Ni-Mo-P alloy films increased with increasing heat-treatment temperature. reached maxinum at about 500℃,and then decreased.And the resistivity for amorphous films decreased with increasing heat-treatment temperature and finally reached a low constant value when heat-treatment temperature was above 600℃.
出处
《晓庄学院自然科学学报》
CAS
1994年第1期65-69,共5页
Journal of Natural Science of Hunan Normal University
关键词
化学镀
NI-MO-P合金
热处理
电阻率
electroless plating
Ni-Mo-P alloy
heat-treatment:hardness
resistivity
