专题典型微加工刻蚀工艺模拟方法及其分析
被引量:3
Simulation Method and Analysis of Typical Micromachining Etching Processes
摘要
在概述微机电系统刻蚀工艺模拟研究进展的基础上,讨论了微表面反应模型法、单元自动控制法、基于刻蚀速率数据库的三维各向异性刻蚀模拟等典型的刻蚀工艺模拟的方法,综合分析了这些方法的特点、应用场合和不足,提出了提高刻蚀工艺模拟精度和效率的技术途径。
出处
《机械制造》
北大核心
2004年第11期23-26,共4页
Machinery
参考文献12
-
1Di Cheng,Kazuo Sato,Mitsuhiro Shikida,et al.Development of quartz etching database and 3 D micromachining simulation system [A].2003 International Symposium on Micromechantronies and Human Science,IEEE,2003,3:281~285
-
2O.Than,S.Buttgenbach.Simulation of anisotropic chemical etching of crystalline silicon using a cellular automata model[J].Sens.Actuators,1994,A45:85-88
-
3Zhenjun Zhu,Chang Liu.Micromachining process simulation using a continuous cellular automata method[J].Journal of Microelectromechanical Systems,2000,9(2):252-261
-
4Rongchun Zhou,Haixia Zhang,Yilong Hao,et al.Simulation of profile evolution in etching-polymerization alternation in DRIE of silicon with SF6/C4F8[A].IEEE,2003,3:161-164
-
5A.Horn,G.Wachutka.Improved step flow model for simulation of orientation-dependent wet etching of silicon[A].The 12th International Conforenceon Solid State Sencors,Actuators and Microsystems,2003,1663-1666
-
6Finch N,He Y,Marchetti J.General MEMS process simulation and its applications[A].The International Society for Optical Engineering,2000,4174(12):217-221
-
7O.Lenhart,E.Bar.Three-dimensional triangle based simulation of etching processes.IEEE,2002,127-130
-
8J.van Suchtelen,K.Sato,E.van Veenendaal,et al.Simula tion of anisotropic wet chemical etching using a physical model.IEEE,1999,332-337
-
9Akira,Shinji Tanaka.Simulation of three-dimentional etch profile of silicon during orientation dependent anisotropic etching.IEEE,1997,418-423
-
10周荣春,张海霞,郝一龙.微加工干法刻蚀工艺模拟工具的研究现状[J].微纳电子技术,2003,40(7):5-7. 被引量:7
二级参考文献16
-
1[1]KOPPELMAN G M.OYSTER, a threedimensional structure simulator for microelectromechanical design[J].Sensors and Actuators, 1989,20:179-185.
-
2[2]OSTERBERG P M, SENTURIA S D. MemBuilder:an automated 3D solid model construction program for microelectromechanical structures[A]. Proc. of the 8th International Conference on Solid-State Sensors and Actuators(Transducers'95) and EuroSensors IX[C] . Stockholm, Sweden:IEEE,1995.21-24.
-
3[3]DEVOE D L, GREEN S B,JUMP J M.Automated solid model extraction for MEMS visualization[A] .Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems(MSM'98)[C].Computational Publications,1998.292-297.
-
4[4]ANANTHAKRISHNAN V. Part-to-art:basis for a systematic geometric design tool for surface micromachined MEMS[D].Toledo,Ohio:Univ. of Toledo,2000.
-
5[5]ANANTHAKRISHNAN V,SARMA R,ANANTHASURESH G K.Systematic mask synthesis for surface micromachined microelectromechanical systems[J]. Journal of Micromechanics and Microegineering(IOP),2003,13:927-941.
-
6[6]GAO F, HONG S Y, SARMA R.Feature model for surface micro-machined MEMS[A]. Proceedings of the 2003ASME Design Engineering Technical Conference[C].Chicago,Illinois,USA:ASME,DETC2003/CIT-48186.
-
7[8]LONG M K. Computer aided mask layout synthesis for anisotropic etch photolithography[D].California,USA:California Institute of Technology, 1999.
-
8[9]LI H. Evolutionary techniques applied to mask-layout synthesis in micro-mechanical-electronic systems(MEMS)[D].Pasadena CA:, California Institute of Technology,1999.
-
9[10]KOESTER D, COWEN A, MAHADEVAN R, et al. PolyMUMPs design handbook revision 8.0[Z]. MEMSCAP,2002.
-
10[1]OLDHAM W G, NEUREUTHER A R, SUNG C, et al. A general simulator for VLSI lithography and etching process: Part ii -- Application to deposition and etching [J].IEEE Trans Electron Devices, 1980, 27: 1455.
共引文献10
-
1朱赤,李伟华,周再发.反应离子刻蚀的模型及仿真[J].中国机械工程,2005,16(z1):255-257.
-
2张鉴,黄庆安.ICP刻蚀技术与模型[J].微纳电子技术,2005,42(6):288-296. 被引量:9
-
3沈海平,达飞鹏.OpenGL在MEMS工艺仿真中的应用研究[J].计算机应用研究,2005,22(12):160-162.
-
4读者调查表[J].中国有线电视,2006(24):2470-2470.
-
5刘峥,江平宇.面向Top-Down设计流的表面微加工掩膜推导方法[J].计算机辅助设计与图形学学报,2007,19(6):798-803. 被引量:2
-
6邵勇,孙来喜,吴卫东,孙卫国.CF_4/Ar/O_2等离子体对熔石英元件的修饰工艺[J].强激光与粒子束,2014,26(3):104-107.
-
7刘兴辉,康大为.《微电子工艺及器件仿真》课程教学方法研究[J].教育教学论坛,2017(1):215-217. 被引量:2
-
8迟茗文,刘峥.面向特征建模方式的微器件表面微加工掩膜推导方法[J].现代机械,2017(2):75-79.
-
9苑伟政,常洪龙,谢建兵.MEMS集成设计与制造技术进展[J].机械工程学报,2023,59(19):176-186. 被引量:6
-
10孙浩骏.光纤光栅传感器的应用及发展[J].中国战略新兴产业,2018(1X):184-184. 被引量:2
同被引文献19
-
1李伟东,张建辉,吴学忠,李圣怡.ICP刻蚀技术在MEMS器件制作中的应用[J].微纳电子技术,2005,42(10):473-476. 被引量:10
-
2周再发,黄庆安,李伟华,王涓,孙岳明.硅各向异性腐蚀模拟的3-D连续CA模型研究[J].仪器仪表学报,2006,27(6):551-555. 被引量:3
-
3正田英介.半导体器件[M].北京:科学出版社,2001.
-
4周兆英,袁松梅.微型机电系统的技术特点及其产业化分析[C]//中国科协2001年学术年会.长春,中国.2001:6-12.
-
5THAN O, BUTTGENBACH S. Simulation of anisotropic chemical etching of crystalline silicon using a cellular automata model [J]. Sensors Actuators, 1994, 45(1): 85-89.
-
6ZHU J Z, LIU C. Micromachining process simulation using a continuous cellular method [ J ]. J Microelectromech Syst, 2000, 9(2): 252-261.
-
7CHENG D, SATO K, SHIKIDA M, et al. Development of quartz etching database and 3-D micromachining simulation system [ C ] // IEEE Proceed Int Symp Micromech & Human Sci. Nagoya, Japan. 2003: 281-285.
-
8LIEBERMAN M A. Analytical solution for capacitive RF sheath [J]. IEEE Trans Plasma Sci, 1988, 16(6) : 638-644.
-
9VAN SUCHTELEN J, SATO K, VAN VEENENDAAL E, et al. Simulation of anisotronpicwet-chemical etching using a physical model [C] // 12th IEEE Int Conf Micro Elec Mechanical Syst. Orlando, FL, USA. 1999.- 332-337.
-
10NEUMANN J V. Theory of self-reproducing automata [M]. Urbana: University of Illinois Press, 1966: 130- 180.
引证文献3
-
1童杏林,罗梦泽,姜德生,刘忠明.一种聚合物微锥阵列的制作工艺研究[J].武汉理工大学学报,2006,28(4):41-43.
-
2蒋文涛,方玉明,俞佳佳,王德波,夏晓娟.MEMS刻蚀工艺仿真模型及研究进展[J].微电子学,2015,45(5):661-665.
-
3Xiaoting Li,Rui Chen,Lei Qu,Xuanmin Zhu,Jing Zhang,Yanrong Wang,Shuhua Wei,Jiang Yan,Yayi Wei.Analysis of Current Research Status of Plasma Etch Process Model[J].Journal of Microelectronic Manufacturing,2018,1(1):21-34.
-
1张鉴,黄庆安.ICP刻蚀技术与模型[J].微纳电子技术,2005,42(6):288-296. 被引量:9
-
2张寿柏,丁桂甫,郭晓芸,沈天慧.微机电系统中的材料和加工[J].上海有色金属,2000,21(3):97-104.
-
3张列刚,肖文杰,杨江平.一种自动测试设备用混合式智能型开关矩阵[J].装备指挥技术学院学报,2002,13(5):81-84. 被引量:1
-
4余协正,叶迎华,沈瑞琪,李创新.过硫酸铵在TMAH体硅刻蚀中的作用[J].微纳电子技术,2012,49(2):134-139. 被引量:1
-
5谭鑫,李文昊,巴音贺希格,齐向东.紫外全息闪耀光栅的制作[J].光学精密工程,2010,18(7):1536-1542. 被引量:10
-
6吴娜,谭鑫,巴音贺希格,唐玉国.闪耀全息光栅离子束刻蚀工艺模拟及实验验证[J].光学精密工程,2012,20(9):1904-1912. 被引量:10
-
7侯立刚,谢通,李茉,吴武臣.IO单元自动排布算法IOAP[J].微电子学,2006,36(4):428-431. 被引量:1
-
8金文惇,项丽萍.470毫米×470毫米特大面积长光栅板的研制[J].光学仪器,1990,12(2):41-45.
-
9侯立刚,李茉,谢通,吴武臣.IO排布对H.264芯片电源网格的优化[J].北京工业大学学报,2006,32(10):865-869.
-
10邹文栋,何兴道,万雄,彭争.显微干涉图象的计算机检测与处理方法[J].江西科学,2003,21(4):284-287.