摘要
介绍了应用一种新的高密度组装技术来降低X波段有源阵列雷达的成本、重量及体积。文中介绍的组件使用了多层AlN基板、倒装单片微波集成电路芯片(MMIC)、共面波导传输线及无需焊接的用于互连的毛钮扣。论述了设计优化、组件结构与组装技术以及测试结果。
A new high-density package design has been used to reduce the cost, weight, and size of X-band active phased array radars. The package uses multilayer aluminum nitride (AIN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnections. This paper discusses the design tradeoffs, the package construction and assembly, and test results.
出处
《电子机械工程》
2004年第3期13-21,26,共10页
Electro-Mechanical Engineering
