摘要
The validity of a novel, direct and convenient method for micromechanical property measurements by beam bending using a nanoindenter is demonstrated. This method combines a very high load resolution with a nanometric precision in the determination of the microcantilever beam deflection. The method is described clearly. In the deflection of microbeams, the influence of the indenter tip pushing into the top of the microbeams and the curvature across its width must be considered. The measurements were made on single-layer, micro-thick, several kinds of width and length polysilicon beams that were fabricated using conventional integrated circuit (IC) fabrication techniques. The elastic of a polysilicon microcantilever beam will vary linearly with the force and the deformation is thought to be elastic. Furthermore, it suggests that Young modulus of the beam can be determined from the slope of this linear relation. From the load deflection data acquired during bending the mechanical properties of the thin films were determined. Measured Young modulus is 137 GPa with approximately a ±2.9%～±6.3% difference in Young modulus.
The validity of a novel, direct and convenient method for micromechanical property measurements by beam bending using a nanoindenter is demonstrated. This method combines a very high load resolution with a nanometric precision in the determination of the microcantilever beam deflection. The method is described clearly. In the deflection of microbeams, the influence of the indenter tip pushing into the top of the microbeams and the curvature across its width must be considered. The measurements were made on single-layer, micro-thick, several kinds of width and length polysilicon beams that were fabricated using conventional integrated circuit (IC) fabrication techniques. The elastic of a polysilicon microcantilever beam will vary linearly with the force and the deformation is thought to be elastic. Furthermore, it suggests that Young modulus of the beam can be determined from the slope of this linear relation. From the load deflection data acquired during bending the mechanical properties of the thin films were determined. Measured Young modulus is 137 GPa with approximately a ±2.9%～±6.3% difference in Young modulus.
