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Microstructural evolution during containerless rapid solidification of Co-Si alloys
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作者 姚文静 魏炳波 《Chinese Physics B》 SCIE EI CAS CSCD 2003年第11期1272-1282,共11页
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Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys 被引量:3
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作者 XUJinfeng 《Chinese Science Bulletin》 SCIE EI CAS 2004年第21期2242-2247,共6页
The rapid solidification behavior of Co-Sn al- loys was investigated by melt spinning method. The growth morphology of αCo phase in Co-20%Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of column... The rapid solidification behavior of Co-Sn al- loys was investigated by melt spinning method. The growth morphology of αCo phase in Co-20%Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of columnar αCo dendrite forms near the roller side at low cooling rates. This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstruc- ture characterized by the distribution of equiaxed αCo den- drites in γCo3Sn matrix is subsequently produced. For Co-34.2%Sn eutectic alloy, anomalous eutectic forms within the whole range of cooling rates. The increase of cooling rate has two obvious effects on both alloys: one is the microstruc- ture refinement, and the other is that it produces more crys- tal defects to intensify the scattering of free electrons, leading to a remarkable increase of electrical resistivity. Under the condition that the grain boundary reflection coefficient r approaches 1, the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically. 展开更多
关键词 显微结构表征 电阻率 快速凝固法 CO SN 钴锡合金 枝状生长 冷却速度
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Rapid solidification mecha-nism of Ag_(60)Sb_(34)Cu_(6) ternaryalloy in drop tube 被引量:1
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作者 RUANYing WANGNan CAOChongde WEIBingbo 《Chinese Science Bulletin》 SCIE EI CAS 2004年第17期1801-1805,共5页
Droplets of Ag60Sb34Cu6 ternary alloy within the diameter range of 60—800 μm were rapidly solidified by means of drop tube containerless processing, and the solidi- fication mechanism is analyzed. With a decrease in... Droplets of Ag60Sb34Cu6 ternary alloy within the diameter range of 60—800 μm were rapidly solidified by means of drop tube containerless processing, and the solidi- fication mechanism is analyzed. With a decrease in droplet size, the cooling rate increases from 57 to 5.8×104 K/s. The maximum undercooling is determined to be 180 K (0.23TL) and the microstructure of primary ε(Ag3Sb) dendrite refines drastically until homogenous equiaxed dendrite forms. Ex- perimental results indicate that (ε+Ag) pseudobinary eutectic cannot form under high undercooling conditions and the solubility of Ag in primary ε phase increases as undercooling increases. Based on thermal analysis and crystal growth morphology, it is found that this alloy is solidified in two ways corresponding to different undercooling levels. 展开更多
关键词 快速凝固机理 Ag60Sb34Cu6 三重合金 高冷却现象 晶核 银锑铜合金
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