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Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys 被引量:3

Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys
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摘要 The rapid solidification behavior of Co-Sn al- loys was investigated by melt spinning method. The growth morphology of αCo phase in Co-20%Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of columnar αCo dendrite forms near the roller side at low cooling rates. This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstruc- ture characterized by the distribution of equiaxed αCo den- drites in γCo3Sn matrix is subsequently produced. For Co-34.2%Sn eutectic alloy, anomalous eutectic forms within the whole range of cooling rates. The increase of cooling rate has two obvious effects on both alloys: one is the microstruc- ture refinement, and the other is that it produces more crys- tal defects to intensify the scattering of free electrons, leading to a remarkable increase of electrical resistivity. Under the condition that the grain boundary reflection coefficient r approaches 1, the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically. The rapid solidification behavior of Co-Sn al- loys was investigated by melt spinning method. The growth morphology of αCo phase in Co-20%Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of columnar αCo dendrite forms near the roller side at low cooling rates. This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstruc- ture characterized by the distribution of equiaxed αCo den- drites in γCo3Sn matrix is subsequently produced. For Co-34.2%Sn eutectic alloy, anomalous eutectic forms within the whole range of cooling rates. The increase of cooling rate has two obvious effects on both alloys: one is the microstruc- ture refinement, and the other is that it produces more crys- tal defects to intensify the scattering of free electrons, leading to a remarkable increase of electrical resistivity. Under the condition that the grain boundary reflection coefficient r approaches 1, the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically.
作者 XUJinfeng
出处 《Chinese Science Bulletin》 SCIE EI CAS 2004年第21期2242-2247,共6页
关键词 显微结构表征 电阻率 快速凝固法 CO SN 钴锡合金 枝状生长 冷却速度 rapid solidification, dendritic growth, eutectic growth, electrical resistivity.
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  • 1Chongde Cao,Nan Wang,Bingbo Wei.Containerless rapid solidification of undercooled Cu-Co peritectic alloys[J].Science in China Series A: Mathematics.2000(12)
  • 2A. Munitz,R. Abbaschian.Two-melt separation in supercooled Cu-Co alloys solidifying in a drop-tube[J].Journal of Materials Science.1991(23)
  • 3Chongde Cao,Xiaoyu Lu,Bingbo Wei.Peritectic solidification under high undercooling conditions[J].Chinese Science Bulletin,1999,44(14):1338-1343. 被引量:11

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