The development of non-invasive brain-computer interfaces(BCIs)relies on multidisciplinary integration across neuroscience,artificial intelligence,flexible electronics,and systems engineering.Recent advances in deep l...The development of non-invasive brain-computer interfaces(BCIs)relies on multidisciplinary integration across neuroscience,artificial intelligence,flexible electronics,and systems engineering.Recent advances in deep learning have significantly improved the accuracy and robustness of neural signal decoding.Parallel progress in electrode design—particularly through the use of flexible and stretchable materials like nanostructured conductors and novel fabrication strategies—has enhanced wearability and operational stability.Nevertheless,key challenges persist,including individual variability,biocompatibility limitations,and susceptibility to interference in complex environments.Further validation and optimization are needed to address gaps in generalization capability,long-term reliability,and real-world operational robustness.This review systematically examines the representative progress in neural decoding algorithms and flexible bioelectronic platforms over the past decade,highlighting key design principles,material innovations,and integration strategies that are poised to advance non-invasive BCI capabilities.It also discusses the importance of multimodal data fusion,hardware-software co-optimization,and closed-loop control strategies.Furthermore,the review discusses the application potential and associated engineering challenges of this technology in clinical rehabilitation and industrial translation,aiming to provide a reference for advancing non-invasive BCIs toward practical and scalable deployment.展开更多
Textile electronics with extraordinary sensing capabilities holds significant potential in the Artificial Intelligence of Things(AIoT).However,little effort is paid to their mutual advantages of robust interfacial int...Textile electronics with extraordinary sensing capabilities holds significant potential in the Artificial Intelligence of Things(AIoT).However,little effort is paid to their mutual advantages of robust interfacial interactions,ultra-strong mechanical performance,and stability.Herein,we fabricate homogeneous and multifunctional core-shell macrofibers by integrating bridge-functionalized MXene/PEDOT:PSS conductive ink with aligned bacterial cellulose(BC).These resulting macrofibers feature mechanical properties(tensile strength of 433.2 MPa and the Young's modulus of 25.9 GPa),exceptional electrical conductivity(10.05 S cm^(-1))and durable hydrophobicity.Such superior robustness allows for the fabrication of the macrofibers woven into textile-based triboelectric nanogenerator(PKT-TENG)and shows an impressive high-performance of a maximum open-circuit voltage of 272.54 V,short-circuit current of 14.56μA and power density of 86.29 mW m^(-2),which successfully powers commercial electronics.As the proof-of-concept illustration,the macrofibers with durable hydrophobicity and high piezoresistive sensitivity are further employed for precepting diverse liquids that can simultaneously monitor their distinctive motion features via real-time resistance variation on the textile-based array.This work is expected to offer new insights into the design of advanced fibers with ultra-strong mechanical capabilities and high conductivity and provide an avenue for the development of textile electronics for high-performance sensing and intelligent manufacturing.展开更多
The development of multifunctional electromagnetic wave-absorbing materials is essential for next-generation flexible electronics and intelligent protection systems.Herein,a novel three-dimensional porous MXene-based ...The development of multifunctional electromagnetic wave-absorbing materials is essential for next-generation flexible electronics and intelligent protection systems.Herein,a novel three-dimensional porous MXene-based film integrated with metallic nickel nanoparticles(Ni-PMF)is designed and synthesized with the potential to address the urgent need for multifunctional electromagnetic wave-absorbing materials in next-generation intelligent systems.By using polystyrene spheres as sacrificial templates,a hierarchical porous architecture is constructed to prevent MXene nanosheet restacking,extend electromagnetic wave propagation paths,and optimize impedance matching.Simultaneously,uniformly distributed Ni nanoparticles introduce abundant heterogeneous interfaces,enhancing interfacial polarization and magnetic loss,which significantly improve electromagnetic wave attenuation.The Ni-PMF film achieves a minimum reflection loss of–64.7 d B and a broad effective absorption bandwidth of 7.2 GHz,covering the full Ku-band and outperforming most reported MXene thin film absorbers.In addition to superior electromagnetic wave absorption,the film demonstrates excellent electrothermal conversion and flexible strain-sensing capabilities,enabling integrated protection and real-time sensing functions.This multifunctional material offers promising potential for next-generation smart flexible electronic systems.展开更多
Silver bismuth sulfide(AgBiS_(2))has recently attracted increasing attention as a promising environmentally friendly semiconductor for next-generation optoelectronic applications,including photovoltaics and photodetec...Silver bismuth sulfide(AgBiS_(2))has recently attracted increasing attention as a promising environmentally friendly semiconductor for next-generation optoelectronic applications,including photovoltaics and photodetection,due to its favorable energy band structure,strong light absorption,high dielectric constant,and low toxicity.Despite notable advances,research on AgBiS_(2) remains in its early stages,with key challenges related to synthetic control,defect passivation,and device engineering.For example,while the power conversion efficiency of AgBiS_(2)-based solar cells has improved rapidly,the current record efficiency of 10.84%remains far below the theoretical Shockley-Queisser limit(-26%).Similarly,AgBiS_(2)-based photodetectors exhibit detectivities around 10^(12)Jones,lagging behind state-of-the-art materials.This review provides a comprehensive summary of recent advances in the crystal structures,synthetic strategies,optoelectronic properties,and device architectures of AgBiS_(2).We highlight key achievements in solar cells,photodetectors,and thin-film transistors,while critically analyzing the remaining bottlenecks in material synthesis,defect modulation,and charge transport optimization.Finally,the broader application potential of AgBiS_(2) in flexible electronics,infrared imaging,buildingintegrated photovoltaics,photocatalysis,spintronics,and biomedicine is discussed.By offering insights into both current progress and future directions,this review aims to support the development of highperformance,multifunctional AgBiS_(2)-based optoelectronic devices.展开更多
Flexible electronics is gaining prominence in modern technology,particularly in flexible displays,wearable electronics,and biomedical applications.Electrodes,as core components of flexible electronics,demand high cond...Flexible electronics is gaining prominence in modern technology,particularly in flexible displays,wearable electronics,and biomedical applications.Electrodes,as core components of flexible electronics,demand high conductivity,flexibility,and stretchability.However,traditional rigid conductive materials often generate interfacial slip with elastic substrates due to mismatched Young's modulus,adversely affecting device performance.Room-temperature liquid metals(LMs),with their high conductivity and stretchability,have emerged as ideal materials for stable and reliable flexible electronic devices.This review discusses the physical,chemical,and biocompatibility properties of LMs.Additionally,LM-based fabrication strategies including patterning and sintering for flexible electrodes are outlined.Applications in implantable medical devices,wearable electronics,and flexible energy storage are illustrated.Finally,the primary challenges and future research directions in LMs are identified.展开更多
Ultra-thin crystalline silicon stands as a cornerstone material in the foundation of modern micro and nano electronics.Despite the proliferation of various materials including oxide-based,polymer-based,carbon-based,an...Ultra-thin crystalline silicon stands as a cornerstone material in the foundation of modern micro and nano electronics.Despite the proliferation of various materials including oxide-based,polymer-based,carbon-based,and two-dimensional(2D)materials,crystal silicon continues to maintain its stronghold,owing to its superior functionality,scalability,stability,reliability,and uniformity.Nonetheless,the inherent rigidity of the bulk silicon leads to incompatibility with soft tissues,hindering the utilization amid biomedical applications.Because of such issues,decades of research have enabled successful utilization of various techniques to precisely control the thickness and morphology of silicon layers at the scale of several nanometres.This review provides a comprehensive exploration on the features of ultra-thin single crystalline silicon as a semiconducting material,and its role especially among the frontier of advanced bioelectronics.Key processes that enable the transition of rigid silicon to flexible form factors are exhibited,in accordance with their chronological sequence.The inspected stages span both prior and subsequent to transferring the silicon membrane,categorized respectively as on-wafer manufacturing and rigid-to-soft integration.Extensive guidelines to unlock the full potential of flexible electronics are provided through ordered analysis of each manufacturing procedure,the latest findings of biomedical applications,along with practical perspectives for researchers and manufacturers.展开更多
The Cooling Storage Ring(CSR)external-target experiment(CEE)will be the first large-scale nuclear physics experiment at the Heavy Ion Research Facility in Lanzhou(HIRFL).A beam monitor has been developed to monitor th...The Cooling Storage Ring(CSR)external-target experiment(CEE)will be the first large-scale nuclear physics experiment at the Heavy Ion Research Facility in Lanzhou(HIRFL).A beam monitor has been developed to monitor the beam status and to improve the reconstruction resolution of the primary vertex.Custom-designed pixel charge sensors,named TopmetalCEEv1,are employed in the detector to locate the position of each particle.Readout electronics for the beam monitor were designed,including front-end electronics utilizing the Topmetal-CEEv1 sensors,as well as a readout and control unit that communicates with the DAQ,trigger,and clock systems.A series of tests were performed to validate the functionality and performance of the system,including basic electronic verifications and responses toαparticles and heavy-ion beams.The results show that all designed functions of the readout electronics system work well,and this system could be used for beam monitoring in the CEE experiment.展开更多
Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine in...Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine interfaces.Crystalline silicon is one of the most mature and reliable materials for high-performance electronics;however,its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics.Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials,such as transforming them into thin nanomembranes or nanowires.This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics,from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates,and ultimately to shaping silicon nanowires using vapor-liquid-solid or in-plane solid-liquid-solid techniques.We explore the latest developments in Si-based soft electronic devices,with applications in sensors,nanoprobes,robotics,and brain-machine interfaces.Finally,the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics.展开更多
Wearable electronics incorporating proteins for biocompatibility have garnered significant research attention,given their potential applications in biocompatible medical devices,artificial skin,humanoid robots,and oth...Wearable electronics incorporating proteins for biocompatibility have garnered significant research attention,given their potential applications in biocompatible medical devices,artificial skin,humanoid robots,and other fields.However,a notable challenge exists,as many wearable electronics currently lack those essential properties due to issues such as non-biological compatibility,as well as insufficient mechanical and conductive performance.Here,we have developed a hybrid keratin(KE)hydrogel by incorporating a liquid metal(LM,eutectic gallium-indium alloy)to design a wearable electronic device with excellent biocompatibility,enhanced conductivity,and good mechanical properties.The resulting keratin liquid metal(KELM)hydrogel demonstrates favorable mechanical characteristics,including good tensile strength(166 kPa),impressive stretchability(2600%),and long-term stability.Furthermore,it exhibits good conductivity(6.84 S·m^(-1))and sensitivity as a sensing material(gauge factor(GF)=7.03),rendering it suitable for constructing high-performance strain sensors.Notably,the KELM hydrogel-based wearable electronics extend their functionality to monitoring marine inhabitants'health.This innovative application provides new insights for designing the next generation of biomimetic electronic devices,with potential applications in human-machine interfaces,electronic skin,artificial intelligence,and health monitoring.展开更多
High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human...High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human-machine interactions.However,despite the recent advances,the development of three-dimensional(3D)soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity.Here,an advanced 3D laser printing pathway,based on femtosecond laser direct writing(FLDW),is demonstrated for preparing liquid metal(LM)-based any layer HDI soft electronics.FLDW technology,with the characteristics of high spatial resolution and high precision,allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits.High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation.The LM-based HDI circuit featuring high resolution(~1.5μm)and high integration(10-layer electrical interconnection)is achieved for customized soft electronics,including various customized multilayer passive electric components,soft multilayer circuit,and cross-scale multimode sensors.The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.展开更多
The Cooling Storage Ring of the Heavy Ion Research Facility in Lanzhou(HIRFL-CSR)was constructed to study nuclear physics,atomic physics,interdisciplinary science,and related applications.The External Target Facility(...The Cooling Storage Ring of the Heavy Ion Research Facility in Lanzhou(HIRFL-CSR)was constructed to study nuclear physics,atomic physics,interdisciplinary science,and related applications.The External Target Facility(ETF)is located in the main ring of the HIRFL-CSR.The gamma detector of the ETF is built to measure emitted gamma rays with energies below 5 MeV in the center-of-mass frame and is planned to measure light fragments with energies up to 300 MeV.The readout electronics for the gamma detector were designed and commissioned.The readout electronics consist of thirty-two front-end cards,thirty-two readout control units(RCUs),one common readout unit,one synchronization&clock unit,and one sub-trigger unit.By using the real-time peak-detection algorithm implemented in the RCU,the data volume can be significantly reduced.In addition,trigger logic selection algorithms are implemented to improve the selection of useful events and reduce the data size.The test results show that the integral nonlinearity of the readout electronics is less than 1%,and the energy resolution for measuring the 60 Co source is better than 5.5%.This study discusses the design and performance of the readout electronics.展开更多
Mechanically durable transparent electrodes are essential for achieving long-term stability in flexible optoelectronic devices.Furthermore,they are crucial for applications in the fields of energy,display,healthcare,a...Mechanically durable transparent electrodes are essential for achieving long-term stability in flexible optoelectronic devices.Furthermore,they are crucial for applications in the fields of energy,display,healthcare,and soft robotics.Conducting meshes represent a promising alternative to traditional,brittle,metal oxide conductors due to their high electrical conductivity,optical transparency,and enhanced mechanical flexibility.In this paper,we present a simple method for fabricating an ultra-transparent conducting metal oxide mesh electrode using selfcracking-assisted templates.Using this method,we produced an electrode with ultra-transparency(97.39%),high conductance(Rs=21.24Ωsq^(−1)),elevated work function(5.16 eV),and good mechanical stability.We also evaluated the effectiveness of the fabricated electrodes by integrating them into organic photovoltaics,organic light-emitting diodes,and flexible transparent memristor devices for neuromorphic computing,resulting in exceptional device performance.In addition,the unique porous structure of the vanadium-doped indium zinc oxide mesh electrodes provided excellent flexibility,rendering them a promising option for application in flexible optoelectronics.展开更多
This paper introduces the key design aspects of automotive center console instrument systems,including hardware architecture,ergonomics,antenna layout,etc.It elaborates on the application and advantages of various adv...This paper introduces the key design aspects of automotive center console instrument systems,including hardware architecture,ergonomics,antenna layout,etc.It elaborates on the application and advantages of various advanced technologies,such as 3D printing and dual-color injection molding.Additionally,it discusses advancements in structural design,as well as future challenges and the trend of multidisciplinary collaborative innovation.展开更多
The evolution of information technology has propelled the advancement of sensors into a new era,referred to as Sensors 4.0^([1]).This era is characterized by the integration of key technological developments,including...The evolution of information technology has propelled the advancement of sensors into a new era,referred to as Sensors 4.0^([1]).This era is characterized by the integration of key technological developments,including the internet of things(IoT),Industry 4.0,big data,artificial intelligence(AI),robotics,and digital health.These innovations necessitate that sensors become increasingly interconnected and intelligent.The concept of"everything is connected"demands that sensors undertake a broader and more complex range of tasks,a challenge that conventional,bulky devices are ill-equipped to address.展开更多
Disposable devices designed for single and/or multiple reliable measurements over a short duration have attracted considerable interest recently. However, these devices often use non-recyclable and non-biodegradable m...Disposable devices designed for single and/or multiple reliable measurements over a short duration have attracted considerable interest recently. However, these devices often use non-recyclable and non-biodegradable materials and wasteful fabrication methods. Herein, we present ZnO nanowires(NWs) based degradable high-performance UV photodetectors(PDs) on flexible chitosan substrate. Systematic investigations reveal the presented device exhibits excellent photo response, including high responsivity(55 A/W), superior specific detectivity(4×10^(14) jones), and the highest gain(8.5×10~(10)) among the reported state of the art biodegradable PDs. Further, the presented PDs display excellent mechanical flexibility under wide range of bending conditions and thermal stability in the measured temperature range(5–50 ℃).The biodegradability studies performed on the device, in both deionized(DI) water(pH≈6) and PBS solution(pH=7.4),show fast degradability in DI water(20 mins) as compared to PBS(48 h). These results show the potential the presented approach holds for green and cost-effective fabrication of wearable, and disposable sensing systems with reduced adverse environmental impact.展开更多
Flexible pressure sensors show great promise for applications in such fields as electronic skin,healthcare,and intelligent robotics.Traditional capacitive pressure sensors,however,face the problem of low sensitivity,w...Flexible pressure sensors show great promise for applications in such fields as electronic skin,healthcare,and intelligent robotics.Traditional capacitive pressure sensors,however,face the problem of low sensitivity,which limits their wider application.In this paper,a flexible capacitive pressure sensor with microstructured ionization layer is fabricated by a sandwich-type process,with a low-cost and simple process of inverted molding with sandpapers being used to form a thermoplastic polyurethane elastomer ionic film with double-sided microstructure as the dielectric layer of the sensor,with silver nanowires as electrodes.The operating mechanism of this iontronic pressure sensor is analyzed using a graphical method,and the sensor is tested on a pressure platform.The test results show that the sensor has ultrahigh pressure sensitivities of 3.744 and 1.689 kPa^(−1) at low(0-20 kPa)and high(20-800 kPa)pressures,respectively,as well as a rapid response time(100 ms),and it exhibits good stability and repeatability.The sensor can be used for sensitive monitoring of activities such as finger bending,and for facial expression(smile,frown)recognition,as well as speech recognition.展开更多
Stretchable electronics that monitor joint activity and treat diseases based on liquid metal could be used in the development of healthcare applications.Such devices can be seamlessly integrated with human skin.Howeve...Stretchable electronics that monitor joint activity and treat diseases based on liquid metal could be used in the development of healthcare applications.Such devices can be seamlessly integrated with human skin.However,most high-precision microstructures and complex patterns are difficult to fabricate due to the limitations of conventional fabrication solutions,resulting in suboptimal performance under practical conditions.Here,a liquid-metal stretchable system utilizing natural leaf veins was reported as microstructures,which was based on a biomimetic concept and utilized an all-solution process for the preparation of complex microstructures.The systems are ultra-high tensile(800%tensile strain),environmentally stable(20 days)and mechanically durable(300-cycle).The system can accurately recognize the wearer's finger bending level as well as simple gesture signals.At the same time,the system acts as a wearable heater,which can realize the fast heating behavior of heating up to 50℃in 3 min under the human body-safe voltage(1.5 V).The tensile stability is demonstrated by the heterogeneous integration of lasers(405 nm)with the system interconnects for a stretchable and wearable light source.展开更多
Flexible high-temperature electronics is a compliant form of high-temperature electronics to expand the application areas of conventional flexible one.In aerospace applications,electronic devices are not only required...Flexible high-temperature electronics is a compliant form of high-temperature electronics to expand the application areas of conventional flexible one.In aerospace applications,electronic devices are not only required to be deformable but also to be able to withstand extreme temperatures.The disadvantages of current flexible electronics,such as high cost,large differences between components,and even requiring independent debugging,are acceptable.展开更多
Large,3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit...Large,3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit technologies.However,these curved electronics present great challenges to the fabrication processes.Here,we propose a reconfigurable,mask-free,conformal fabrication strategy with a robot-like system,called robotized‘transfer-and-jet’printing,to assemble diverse electronic devices on complex surfaces.This novel method is a ground-breaking advance with the unique capability to integrate rigid chips,flexible electronics,and conformal circuits on complex surfaces.Critically,each process,including transfer printing,inkjet printing,and plasma treating,are mask-free,digitalized,and programmable.The robotization techniques,including measurement,surface reconstruction and localization,and path programming,break through the fundamental constraints of 2D planar microfabrication in the context of geometric shape and size.The transfer printing begins with the laser lift-off of rigid chips or flexible electronics from donor substrates,which are then transferred onto a curved surface via a dexterous robotic palm.Then the robotic electrohydrodynamic printing directly writes submicrometer structures on the curved surface.Their permutation and combination allow versatile conformal microfabrication.Finally,robotized hybrid printing is utilized to successfully fabricate a conformal heater and antenna on a spherical surface and a flexible smart sensing skin on a winged model,where the curved circuit,flexible capacitive and piezoelectric sensor arrays,and rigid digital–analog conversion chips are assembled.Robotized hybrid printing is an innovative printing technology,enabling additive,noncontact and digital microfabrication for 3D curved electronics.展开更多
Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades,thereby fueling the next-generation electronics.In the p...Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades,thereby fueling the next-generation electronics.In the past few decades,the research on flexible electronic devices based on organic materials has witnessed rapid development and substantial achievements,and inorganic semiconductors are also now beginning to shine in the field of flexible electronics.As validated by the latest research,some of the inorganic semiconductors,particularly those at low dimension,unexpectedly exhibited excellent mechanical flexibility on top of superior electrical properties.Herein,we bring together a comprehensive analysis on the recently burgeoning low-dimension inorganic semiconductor materials in flexible electronics,including one-dimensional(1D)inorganic semiconductor nanowires(NWs)and two-dimensional(2D)transition metal dichalcogenides(TMDs).The fundamental electrical properties,optical properties,mechanical properties and strain engineering of materials,and their performance in flexible device applications are discussed in detail.We also propose current challenges and predict future development directions including material synthesis and device fabrication and integration.展开更多
基金the National Natural Science Foundation of China for Distinguished Young Scholars(62325403)the National Natural Science Foundation of China(62504103 and 82002454)+4 种基金the Basic Research Program of Jiangsu(BK20251214)the Natural Science Foundation of Jiangsu Province(BK20230498)the China Postdoctoral Science Foundation under Grant Number 2025T180143 and 2025M770547the Medical Scientific Research Project of Jiangsu Health Commission(ZD2021011)the Jiangsu Funding Program for Excellent Postdoctoral Talent(2024ZB427)。
文摘The development of non-invasive brain-computer interfaces(BCIs)relies on multidisciplinary integration across neuroscience,artificial intelligence,flexible electronics,and systems engineering.Recent advances in deep learning have significantly improved the accuracy and robustness of neural signal decoding.Parallel progress in electrode design—particularly through the use of flexible and stretchable materials like nanostructured conductors and novel fabrication strategies—has enhanced wearability and operational stability.Nevertheless,key challenges persist,including individual variability,biocompatibility limitations,and susceptibility to interference in complex environments.Further validation and optimization are needed to address gaps in generalization capability,long-term reliability,and real-world operational robustness.This review systematically examines the representative progress in neural decoding algorithms and flexible bioelectronic platforms over the past decade,highlighting key design principles,material innovations,and integration strategies that are poised to advance non-invasive BCI capabilities.It also discusses the importance of multimodal data fusion,hardware-software co-optimization,and closed-loop control strategies.Furthermore,the review discusses the application potential and associated engineering challenges of this technology in clinical rehabilitation and industrial translation,aiming to provide a reference for advancing non-invasive BCIs toward practical and scalable deployment.
基金financially supported by the National Natural Science Foundation of China(52473178,52473275)Young Elite Scientists Sponsorship Program by CAST(2022QNRC001)+8 种基金the Program of Introducing Talents of Jiangnan University(1065219032210150)the Postgraduate Research&Practice Innovation Program of Jiangsu Province(KYCX23_2474)the Science and Technology Program of Jiangsu Administration for Market Regulation(KJ2024013)the Wuxi Science and Technology Development Fund Project(K20231042)Funded by Basic Research Program of Jiangsu(BK20251613)the Fundamental Research Funds for the Central Universities(JUSRP202504025)Jiangnan University Student Innovation Program(2025CXZ066)Laboratory of Flexible Electronics Technology,Tsinghua Universitythe Wuxi Taihu Talent Innovation Project(2024)。
文摘Textile electronics with extraordinary sensing capabilities holds significant potential in the Artificial Intelligence of Things(AIoT).However,little effort is paid to their mutual advantages of robust interfacial interactions,ultra-strong mechanical performance,and stability.Herein,we fabricate homogeneous and multifunctional core-shell macrofibers by integrating bridge-functionalized MXene/PEDOT:PSS conductive ink with aligned bacterial cellulose(BC).These resulting macrofibers feature mechanical properties(tensile strength of 433.2 MPa and the Young's modulus of 25.9 GPa),exceptional electrical conductivity(10.05 S cm^(-1))and durable hydrophobicity.Such superior robustness allows for the fabrication of the macrofibers woven into textile-based triboelectric nanogenerator(PKT-TENG)and shows an impressive high-performance of a maximum open-circuit voltage of 272.54 V,short-circuit current of 14.56μA and power density of 86.29 mW m^(-2),which successfully powers commercial electronics.As the proof-of-concept illustration,the macrofibers with durable hydrophobicity and high piezoresistive sensitivity are further employed for precepting diverse liquids that can simultaneously monitor their distinctive motion features via real-time resistance variation on the textile-based array.This work is expected to offer new insights into the design of advanced fibers with ultra-strong mechanical capabilities and high conductivity and provide an avenue for the development of textile electronics for high-performance sensing and intelligent manufacturing.
基金financially supported by the NNSF of China(Grant Nos.12074095,12374392,and 52403351)the Joint Guidance Project of the Natural Science Foundation of Heilongjiang Province(LH2023A012)。
文摘The development of multifunctional electromagnetic wave-absorbing materials is essential for next-generation flexible electronics and intelligent protection systems.Herein,a novel three-dimensional porous MXene-based film integrated with metallic nickel nanoparticles(Ni-PMF)is designed and synthesized with the potential to address the urgent need for multifunctional electromagnetic wave-absorbing materials in next-generation intelligent systems.By using polystyrene spheres as sacrificial templates,a hierarchical porous architecture is constructed to prevent MXene nanosheet restacking,extend electromagnetic wave propagation paths,and optimize impedance matching.Simultaneously,uniformly distributed Ni nanoparticles introduce abundant heterogeneous interfaces,enhancing interfacial polarization and magnetic loss,which significantly improve electromagnetic wave attenuation.The Ni-PMF film achieves a minimum reflection loss of–64.7 d B and a broad effective absorption bandwidth of 7.2 GHz,covering the full Ku-band and outperforming most reported MXene thin film absorbers.In addition to superior electromagnetic wave absorption,the film demonstrates excellent electrothermal conversion and flexible strain-sensing capabilities,enabling integrated protection and real-time sensing functions.This multifunctional material offers promising potential for next-generation smart flexible electronic systems.
基金financially supported by the National Natural Science Foundation of China(52272179,52503356,52325310,52203208,U24A6003)the National Key R&D Program of China(2021YFB3800101)+7 种基金the Young Elite Scientists Sponsorship Program by CAST(YESS20240571)the China Postdoctoral Science Foundation(2025T180052)the Yunnan Provincial Science and Technology Project at Southwest United Graduate School(202302AO370013)the Beijing Nova Program(20230484480)the R&D Fruit Fund(20210001)the Natural Science Foundation of Jiangsu Province(BK20250977)the Natural Science Research Projects of Jiangsu Higher Education Institutions(25KJB430002)the Changzhou City Leading Innovative Talents Introduction and Cultivation Project(Basic Research Innovation Category)(CQ20240103)。
文摘Silver bismuth sulfide(AgBiS_(2))has recently attracted increasing attention as a promising environmentally friendly semiconductor for next-generation optoelectronic applications,including photovoltaics and photodetection,due to its favorable energy band structure,strong light absorption,high dielectric constant,and low toxicity.Despite notable advances,research on AgBiS_(2) remains in its early stages,with key challenges related to synthetic control,defect passivation,and device engineering.For example,while the power conversion efficiency of AgBiS_(2)-based solar cells has improved rapidly,the current record efficiency of 10.84%remains far below the theoretical Shockley-Queisser limit(-26%).Similarly,AgBiS_(2)-based photodetectors exhibit detectivities around 10^(12)Jones,lagging behind state-of-the-art materials.This review provides a comprehensive summary of recent advances in the crystal structures,synthetic strategies,optoelectronic properties,and device architectures of AgBiS_(2).We highlight key achievements in solar cells,photodetectors,and thin-film transistors,while critically analyzing the remaining bottlenecks in material synthesis,defect modulation,and charge transport optimization.Finally,the broader application potential of AgBiS_(2) in flexible electronics,infrared imaging,buildingintegrated photovoltaics,photocatalysis,spintronics,and biomedicine is discussed.By offering insights into both current progress and future directions,this review aims to support the development of highperformance,multifunctional AgBiS_(2)-based optoelectronic devices.
基金supported by the National Key Research and Development Program of China(No.2021YFA1401100)the National Natural Science Foundation of China(Nos.61825403 and 61921005)
文摘Flexible electronics is gaining prominence in modern technology,particularly in flexible displays,wearable electronics,and biomedical applications.Electrodes,as core components of flexible electronics,demand high conductivity,flexibility,and stretchability.However,traditional rigid conductive materials often generate interfacial slip with elastic substrates due to mismatched Young's modulus,adversely affecting device performance.Room-temperature liquid metals(LMs),with their high conductivity and stretchability,have emerged as ideal materials for stable and reliable flexible electronic devices.This review discusses the physical,chemical,and biocompatibility properties of LMs.Additionally,LM-based fabrication strategies including patterning and sintering for flexible electrodes are outlined.Applications in implantable medical devices,wearable electronics,and flexible energy storage are illustrated.Finally,the primary challenges and future research directions in LMs are identified.
基金support received from National Research Foundation of Korea (NRF) Grant funded by the Korea government (MSIT)(RS-2024-00353768)the National Research Foundation of Korea (NRF) Grant funded by the Korea government (MSIT)(RS-2025-02217919)+1 种基金funded by the Yonsei Fellowshipfunded by Lee Youn Jae and the KIST Institutional Program Project No.2E31603-22-140 (KJY).
文摘Ultra-thin crystalline silicon stands as a cornerstone material in the foundation of modern micro and nano electronics.Despite the proliferation of various materials including oxide-based,polymer-based,carbon-based,and two-dimensional(2D)materials,crystal silicon continues to maintain its stronghold,owing to its superior functionality,scalability,stability,reliability,and uniformity.Nonetheless,the inherent rigidity of the bulk silicon leads to incompatibility with soft tissues,hindering the utilization amid biomedical applications.Because of such issues,decades of research have enabled successful utilization of various techniques to precisely control the thickness and morphology of silicon layers at the scale of several nanometres.This review provides a comprehensive exploration on the features of ultra-thin single crystalline silicon as a semiconducting material,and its role especially among the frontier of advanced bioelectronics.Key processes that enable the transition of rigid silicon to flexible form factors are exhibited,in accordance with their chronological sequence.The inspected stages span both prior and subsequent to transferring the silicon membrane,categorized respectively as on-wafer manufacturing and rigid-to-soft integration.Extensive guidelines to unlock the full potential of flexible electronics are provided through ordered analysis of each manufacturing procedure,the latest findings of biomedical applications,along with practical perspectives for researchers and manufacturers.
基金supported by the National Natural Science Foundation of China(Nos.11927901,12105110,U2032209,12275105)the National Key Research and Development Program of China(Nos.2020YFE0202002,2022YFA1602103)the Fundamental Research Funds for the Central Universities(No.CCNU22QN005)。
文摘The Cooling Storage Ring(CSR)external-target experiment(CEE)will be the first large-scale nuclear physics experiment at the Heavy Ion Research Facility in Lanzhou(HIRFL).A beam monitor has been developed to monitor the beam status and to improve the reconstruction resolution of the primary vertex.Custom-designed pixel charge sensors,named TopmetalCEEv1,are employed in the detector to locate the position of each particle.Readout electronics for the beam monitor were designed,including front-end electronics utilizing the Topmetal-CEEv1 sensors,as well as a readout and control unit that communicates with the DAQ,trigger,and clock systems.A series of tests were performed to validate the functionality and performance of the system,including basic electronic verifications and responses toαparticles and heavy-ion beams.The results show that all designed functions of the readout electronics system work well,and this system could be used for beam monitoring in the CEE experiment.
基金the National Natural Science Foundation of China under granted No.62104100National Key Research Program of China under No.92164201+1 种基金National Natural Science Foundation of China for Distinguished Young Scholars under No.62325403National Natural Science Foundation of China under No.61934004.
文摘Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine interfaces.Crystalline silicon is one of the most mature and reliable materials for high-performance electronics;however,its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics.Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials,such as transforming them into thin nanomembranes or nanowires.This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics,from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates,and ultimately to shaping silicon nanowires using vapor-liquid-solid or in-plane solid-liquid-solid techniques.We explore the latest developments in Si-based soft electronic devices,with applications in sensors,nanoprobes,robotics,and brain-machine interfaces.Finally,the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics.
基金supported by the National Natural Science Foundation of China(22176221 and 22273045)the Central Public-interest Scientific Institution Basal Research Fund,Chinese Academy of Fishery Sciences(2024XT09)+1 种基金the Tsinghua University Independent Scientific Research Plan for Young Investigatorthe Tsinghua University Initiative Scientific Research Program。
文摘Wearable electronics incorporating proteins for biocompatibility have garnered significant research attention,given their potential applications in biocompatible medical devices,artificial skin,humanoid robots,and other fields.However,a notable challenge exists,as many wearable electronics currently lack those essential properties due to issues such as non-biological compatibility,as well as insufficient mechanical and conductive performance.Here,we have developed a hybrid keratin(KE)hydrogel by incorporating a liquid metal(LM,eutectic gallium-indium alloy)to design a wearable electronic device with excellent biocompatibility,enhanced conductivity,and good mechanical properties.The resulting keratin liquid metal(KELM)hydrogel demonstrates favorable mechanical characteristics,including good tensile strength(166 kPa),impressive stretchability(2600%),and long-term stability.Furthermore,it exhibits good conductivity(6.84 S·m^(-1))and sensitivity as a sensing material(gauge factor(GF)=7.03),rendering it suitable for constructing high-performance strain sensors.Notably,the KELM hydrogel-based wearable electronics extend their functionality to monitoring marine inhabitants'health.This innovative application provides new insights for designing the next generation of biomimetic electronic devices,with potential applications in human-machine interfaces,electronic skin,artificial intelligence,and health monitoring.
基金supported by the National Science Foundation of China under the Grant Nos.12127806 and 62175195the International Joint Research Laboratory for Micro/Nano Manufacturing and Measurement Technologies。
文摘High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human-machine interactions.However,despite the recent advances,the development of three-dimensional(3D)soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity.Here,an advanced 3D laser printing pathway,based on femtosecond laser direct writing(FLDW),is demonstrated for preparing liquid metal(LM)-based any layer HDI soft electronics.FLDW technology,with the characteristics of high spatial resolution and high precision,allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits.High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation.The LM-based HDI circuit featuring high resolution(~1.5μm)and high integration(10-layer electrical interconnection)is achieved for customized soft electronics,including various customized multilayer passive electric components,soft multilayer circuit,and cross-scale multimode sensors.The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.
基金supported by the National Natural Science Foundation of China (Nos. 12222512, 12375193, U2031206, U1831206, and U2032209)the Scientific Instrument Developing Project of the Chinese Academy of Sciences (GJJSTD20210009)+1 种基金the CAS Pioneer Hundred Talent Programthe CAS Light of West China Program
文摘The Cooling Storage Ring of the Heavy Ion Research Facility in Lanzhou(HIRFL-CSR)was constructed to study nuclear physics,atomic physics,interdisciplinary science,and related applications.The External Target Facility(ETF)is located in the main ring of the HIRFL-CSR.The gamma detector of the ETF is built to measure emitted gamma rays with energies below 5 MeV in the center-of-mass frame and is planned to measure light fragments with energies up to 300 MeV.The readout electronics for the gamma detector were designed and commissioned.The readout electronics consist of thirty-two front-end cards,thirty-two readout control units(RCUs),one common readout unit,one synchronization&clock unit,and one sub-trigger unit.By using the real-time peak-detection algorithm implemented in the RCU,the data volume can be significantly reduced.In addition,trigger logic selection algorithms are implemented to improve the selection of useful events and reduce the data size.The test results show that the integral nonlinearity of the readout electronics is less than 1%,and the energy resolution for measuring the 60 Co source is better than 5.5%.This study discusses the design and performance of the readout electronics.
基金supported by a National Research Foundation of Korea(NRF)grant(No.2016R1A3B 1908249)funded by the Korean government.
文摘Mechanically durable transparent electrodes are essential for achieving long-term stability in flexible optoelectronic devices.Furthermore,they are crucial for applications in the fields of energy,display,healthcare,and soft robotics.Conducting meshes represent a promising alternative to traditional,brittle,metal oxide conductors due to their high electrical conductivity,optical transparency,and enhanced mechanical flexibility.In this paper,we present a simple method for fabricating an ultra-transparent conducting metal oxide mesh electrode using selfcracking-assisted templates.Using this method,we produced an electrode with ultra-transparency(97.39%),high conductance(Rs=21.24Ωsq^(−1)),elevated work function(5.16 eV),and good mechanical stability.We also evaluated the effectiveness of the fabricated electrodes by integrating them into organic photovoltaics,organic light-emitting diodes,and flexible transparent memristor devices for neuromorphic computing,resulting in exceptional device performance.In addition,the unique porous structure of the vanadium-doped indium zinc oxide mesh electrodes provided excellent flexibility,rendering them a promising option for application in flexible optoelectronics.
文摘This paper introduces the key design aspects of automotive center console instrument systems,including hardware architecture,ergonomics,antenna layout,etc.It elaborates on the application and advantages of various advanced technologies,such as 3D printing and dual-color injection molding.Additionally,it discusses advancements in structural design,as well as future challenges and the trend of multidisciplinary collaborative innovation.
文摘The evolution of information technology has propelled the advancement of sensors into a new era,referred to as Sensors 4.0^([1]).This era is characterized by the integration of key technological developments,including the internet of things(IoT),Industry 4.0,big data,artificial intelligence(AI),robotics,and digital health.These innovations necessitate that sensors become increasingly interconnected and intelligent.The concept of"everything is connected"demands that sensors undertake a broader and more complex range of tasks,a challenge that conventional,bulky devices are ill-equipped to address.
基金supported in part by Engineering and Physical Science Research Council (EPSRC) through Engineering Fellowship (EP/R029644/1)Hetero-print Programme Grant (EP/R03480X/1)European Commission through grant references (H2020-MSCAITN2019-861166)。
文摘Disposable devices designed for single and/or multiple reliable measurements over a short duration have attracted considerable interest recently. However, these devices often use non-recyclable and non-biodegradable materials and wasteful fabrication methods. Herein, we present ZnO nanowires(NWs) based degradable high-performance UV photodetectors(PDs) on flexible chitosan substrate. Systematic investigations reveal the presented device exhibits excellent photo response, including high responsivity(55 A/W), superior specific detectivity(4×10^(14) jones), and the highest gain(8.5×10~(10)) among the reported state of the art biodegradable PDs. Further, the presented PDs display excellent mechanical flexibility under wide range of bending conditions and thermal stability in the measured temperature range(5–50 ℃).The biodegradability studies performed on the device, in both deionized(DI) water(pH≈6) and PBS solution(pH=7.4),show fast degradability in DI water(20 mins) as compared to PBS(48 h). These results show the potential the presented approach holds for green and cost-effective fabrication of wearable, and disposable sensing systems with reduced adverse environmental impact.
基金supported by the Youth Project of the National Natural Science Foundation of China(Grant No.52105594)the Youth Project of the Applied Basic Research Program of Shanxi Province(Grant No.20210302124274)+4 种基金the Key Research and Development Program of Shanxi Province(Grant No.202102030201005)the Natural Youth Science Foundation of Shanxi Province(Grant Nos.202103021223005 and 202203021212015)the Fund for Shanxi 1331 Project,the Science and Technology Innovation Plan for Colleges and Universities in Shanxi Province(Grant No.2022L575)the Science and Technology Innovation Project in Higher Schools in Shanxi(Grant No.J2020383)Teaching Reform and Innovation Project of the Education Department of Shanxi Province(Grant No.J20221195).
文摘Flexible pressure sensors show great promise for applications in such fields as electronic skin,healthcare,and intelligent robotics.Traditional capacitive pressure sensors,however,face the problem of low sensitivity,which limits their wider application.In this paper,a flexible capacitive pressure sensor with microstructured ionization layer is fabricated by a sandwich-type process,with a low-cost and simple process of inverted molding with sandpapers being used to form a thermoplastic polyurethane elastomer ionic film with double-sided microstructure as the dielectric layer of the sensor,with silver nanowires as electrodes.The operating mechanism of this iontronic pressure sensor is analyzed using a graphical method,and the sensor is tested on a pressure platform.The test results show that the sensor has ultrahigh pressure sensitivities of 3.744 and 1.689 kPa^(−1) at low(0-20 kPa)and high(20-800 kPa)pressures,respectively,as well as a rapid response time(100 ms),and it exhibits good stability and repeatability.The sensor can be used for sensitive monitoring of activities such as finger bending,and for facial expression(smile,frown)recognition,as well as speech recognition.
基金financially supported by the National Key Research and Development Program of China(No.2021YFA1401100)the National Natural Science Foundation of China(Nos.61825403 and 61921005)。
文摘Stretchable electronics that monitor joint activity and treat diseases based on liquid metal could be used in the development of healthcare applications.Such devices can be seamlessly integrated with human skin.However,most high-precision microstructures and complex patterns are difficult to fabricate due to the limitations of conventional fabrication solutions,resulting in suboptimal performance under practical conditions.Here,a liquid-metal stretchable system utilizing natural leaf veins was reported as microstructures,which was based on a biomimetic concept and utilized an all-solution process for the preparation of complex microstructures.The systems are ultra-high tensile(800%tensile strain),environmentally stable(20 days)and mechanically durable(300-cycle).The system can accurately recognize the wearer's finger bending level as well as simple gesture signals.At the same time,the system acts as a wearable heater,which can realize the fast heating behavior of heating up to 50℃in 3 min under the human body-safe voltage(1.5 V).The tensile stability is demonstrated by the heterogeneous integration of lasers(405 nm)with the system interconnects for a stretchable and wearable light source.
基金financially supported by the National Key R&D Program of China (No.2021YFB3200700)the National Natural Science Foundation of China (Nos.52205593 and 51925503)Xplorer Prize (2020-1036)。
文摘Flexible high-temperature electronics is a compliant form of high-temperature electronics to expand the application areas of conventional flexible one.In aerospace applications,electronic devices are not only required to be deformable but also to be able to withstand extreme temperatures.The disadvantages of current flexible electronics,such as high cost,large differences between components,and even requiring independent debugging,are acceptable.
基金The authors acknowledge support from the National Nat-ural Science Foundation of China(51635007,51925503,51705179)Natural Science Foundation of Hubei Province of China(2020CFA028).
文摘Large,3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit technologies.However,these curved electronics present great challenges to the fabrication processes.Here,we propose a reconfigurable,mask-free,conformal fabrication strategy with a robot-like system,called robotized‘transfer-and-jet’printing,to assemble diverse electronic devices on complex surfaces.This novel method is a ground-breaking advance with the unique capability to integrate rigid chips,flexible electronics,and conformal circuits on complex surfaces.Critically,each process,including transfer printing,inkjet printing,and plasma treating,are mask-free,digitalized,and programmable.The robotization techniques,including measurement,surface reconstruction and localization,and path programming,break through the fundamental constraints of 2D planar microfabrication in the context of geometric shape and size.The transfer printing begins with the laser lift-off of rigid chips or flexible electronics from donor substrates,which are then transferred onto a curved surface via a dexterous robotic palm.Then the robotic electrohydrodynamic printing directly writes submicrometer structures on the curved surface.Their permutation and combination allow versatile conformal microfabrication.Finally,robotized hybrid printing is utilized to successfully fabricate a conformal heater and antenna on a spherical surface and a flexible smart sensing skin on a winged model,where the curved circuit,flexible capacitive and piezoelectric sensor arrays,and rigid digital–analog conversion chips are assembled.Robotized hybrid printing is an innovative printing technology,enabling additive,noncontact and digital microfabrication for 3D curved electronics.
基金supported by the Natural Science Foundation of China(No.51902101)Natural Science Foundation of Jiangsu Province(No.BK20201381)+1 种基金Science Foundation of Nanjing University of Posts and Telecommunications(No.NY219144)Postgraduate Research&Practice Innovation Program of Jiangsu Province(No.SJCX22_0254).
文摘Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades,thereby fueling the next-generation electronics.In the past few decades,the research on flexible electronic devices based on organic materials has witnessed rapid development and substantial achievements,and inorganic semiconductors are also now beginning to shine in the field of flexible electronics.As validated by the latest research,some of the inorganic semiconductors,particularly those at low dimension,unexpectedly exhibited excellent mechanical flexibility on top of superior electrical properties.Herein,we bring together a comprehensive analysis on the recently burgeoning low-dimension inorganic semiconductor materials in flexible electronics,including one-dimensional(1D)inorganic semiconductor nanowires(NWs)and two-dimensional(2D)transition metal dichalcogenides(TMDs).The fundamental electrical properties,optical properties,mechanical properties and strain engineering of materials,and their performance in flexible device applications are discussed in detail.We also propose current challenges and predict future development directions including material synthesis and device fabrication and integration.
