Ultra-thin crystalline silicon stands as a cornerstone material in the foundation of modern micro and nano electronics.Despite the proliferation of various materials including oxide-based,polymer-based,carbon-based,an...Ultra-thin crystalline silicon stands as a cornerstone material in the foundation of modern micro and nano electronics.Despite the proliferation of various materials including oxide-based,polymer-based,carbon-based,and two-dimensional(2D)materials,crystal silicon continues to maintain its stronghold,owing to its superior functionality,scalability,stability,reliability,and uniformity.Nonetheless,the inherent rigidity of the bulk silicon leads to incompatibility with soft tissues,hindering the utilization amid biomedical applications.Because of such issues,decades of research have enabled successful utilization of various techniques to precisely control the thickness and morphology of silicon layers at the scale of several nanometres.This review provides a comprehensive exploration on the features of ultra-thin single crystalline silicon as a semiconducting material,and its role especially among the frontier of advanced bioelectronics.Key processes that enable the transition of rigid silicon to flexible form factors are exhibited,in accordance with their chronological sequence.The inspected stages span both prior and subsequent to transferring the silicon membrane,categorized respectively as on-wafer manufacturing and rigid-to-soft integration.Extensive guidelines to unlock the full potential of flexible electronics are provided through ordered analysis of each manufacturing procedure,the latest findings of biomedical applications,along with practical perspectives for researchers and manufacturers.展开更多
The Cooling Storage Ring(CSR)external-target experiment(CEE)will be the first large-scale nuclear physics experiment at the Heavy Ion Research Facility in Lanzhou(HIRFL).A beam monitor has been developed to monitor th...The Cooling Storage Ring(CSR)external-target experiment(CEE)will be the first large-scale nuclear physics experiment at the Heavy Ion Research Facility in Lanzhou(HIRFL).A beam monitor has been developed to monitor the beam status and to improve the reconstruction resolution of the primary vertex.Custom-designed pixel charge sensors,named TopmetalCEEv1,are employed in the detector to locate the position of each particle.Readout electronics for the beam monitor were designed,including front-end electronics utilizing the Topmetal-CEEv1 sensors,as well as a readout and control unit that communicates with the DAQ,trigger,and clock systems.A series of tests were performed to validate the functionality and performance of the system,including basic electronic verifications and responses toαparticles and heavy-ion beams.The results show that all designed functions of the readout electronics system work well,and this system could be used for beam monitoring in the CEE experiment.展开更多
Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine in...Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine interfaces.Crystalline silicon is one of the most mature and reliable materials for high-performance electronics;however,its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics.Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials,such as transforming them into thin nanomembranes or nanowires.This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics,from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates,and ultimately to shaping silicon nanowires using vapor-liquid-solid or in-plane solid-liquid-solid techniques.We explore the latest developments in Si-based soft electronic devices,with applications in sensors,nanoprobes,robotics,and brain-machine interfaces.Finally,the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics.展开更多
Wearable electronics incorporating proteins for biocompatibility have garnered significant research attention,given their potential applications in biocompatible medical devices,artificial skin,humanoid robots,and oth...Wearable electronics incorporating proteins for biocompatibility have garnered significant research attention,given their potential applications in biocompatible medical devices,artificial skin,humanoid robots,and other fields.However,a notable challenge exists,as many wearable electronics currently lack those essential properties due to issues such as non-biological compatibility,as well as insufficient mechanical and conductive performance.Here,we have developed a hybrid keratin(KE)hydrogel by incorporating a liquid metal(LM,eutectic gallium-indium alloy)to design a wearable electronic device with excellent biocompatibility,enhanced conductivity,and good mechanical properties.The resulting keratin liquid metal(KELM)hydrogel demonstrates favorable mechanical characteristics,including good tensile strength(166 kPa),impressive stretchability(2600%),and long-term stability.Furthermore,it exhibits good conductivity(6.84 S·m^(-1))and sensitivity as a sensing material(gauge factor(GF)=7.03),rendering it suitable for constructing high-performance strain sensors.Notably,the KELM hydrogel-based wearable electronics extend their functionality to monitoring marine inhabitants'health.This innovative application provides new insights for designing the next generation of biomimetic electronic devices,with potential applications in human-machine interfaces,electronic skin,artificial intelligence,and health monitoring.展开更多
High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human...High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human-machine interactions.However,despite the recent advances,the development of three-dimensional(3D)soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity.Here,an advanced 3D laser printing pathway,based on femtosecond laser direct writing(FLDW),is demonstrated for preparing liquid metal(LM)-based any layer HDI soft electronics.FLDW technology,with the characteristics of high spatial resolution and high precision,allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits.High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation.The LM-based HDI circuit featuring high resolution(~1.5μm)and high integration(10-layer electrical interconnection)is achieved for customized soft electronics,including various customized multilayer passive electric components,soft multilayer circuit,and cross-scale multimode sensors.The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.展开更多
The Cooling Storage Ring of the Heavy Ion Research Facility in Lanzhou(HIRFL-CSR)was constructed to study nuclear physics,atomic physics,interdisciplinary science,and related applications.The External Target Facility(...The Cooling Storage Ring of the Heavy Ion Research Facility in Lanzhou(HIRFL-CSR)was constructed to study nuclear physics,atomic physics,interdisciplinary science,and related applications.The External Target Facility(ETF)is located in the main ring of the HIRFL-CSR.The gamma detector of the ETF is built to measure emitted gamma rays with energies below 5 MeV in the center-of-mass frame and is planned to measure light fragments with energies up to 300 MeV.The readout electronics for the gamma detector were designed and commissioned.The readout electronics consist of thirty-two front-end cards,thirty-two readout control units(RCUs),one common readout unit,one synchronization&clock unit,and one sub-trigger unit.By using the real-time peak-detection algorithm implemented in the RCU,the data volume can be significantly reduced.In addition,trigger logic selection algorithms are implemented to improve the selection of useful events and reduce the data size.The test results show that the integral nonlinearity of the readout electronics is less than 1%,and the energy resolution for measuring the 60 Co source is better than 5.5%.This study discusses the design and performance of the readout electronics.展开更多
Mechanically durable transparent electrodes are essential for achieving long-term stability in flexible optoelectronic devices.Furthermore,they are crucial for applications in the fields of energy,display,healthcare,a...Mechanically durable transparent electrodes are essential for achieving long-term stability in flexible optoelectronic devices.Furthermore,they are crucial for applications in the fields of energy,display,healthcare,and soft robotics.Conducting meshes represent a promising alternative to traditional,brittle,metal oxide conductors due to their high electrical conductivity,optical transparency,and enhanced mechanical flexibility.In this paper,we present a simple method for fabricating an ultra-transparent conducting metal oxide mesh electrode using selfcracking-assisted templates.Using this method,we produced an electrode with ultra-transparency(97.39%),high conductance(Rs=21.24Ωsq^(−1)),elevated work function(5.16 eV),and good mechanical stability.We also evaluated the effectiveness of the fabricated electrodes by integrating them into organic photovoltaics,organic light-emitting diodes,and flexible transparent memristor devices for neuromorphic computing,resulting in exceptional device performance.In addition,the unique porous structure of the vanadium-doped indium zinc oxide mesh electrodes provided excellent flexibility,rendering them a promising option for application in flexible optoelectronics.展开更多
This paper introduces the key design aspects of automotive center console instrument systems,including hardware architecture,ergonomics,antenna layout,etc.It elaborates on the application and advantages of various adv...This paper introduces the key design aspects of automotive center console instrument systems,including hardware architecture,ergonomics,antenna layout,etc.It elaborates on the application and advantages of various advanced technologies,such as 3D printing and dual-color injection molding.Additionally,it discusses advancements in structural design,as well as future challenges and the trend of multidisciplinary collaborative innovation.展开更多
The evolution of information technology has propelled the advancement of sensors into a new era,referred to as Sensors 4.0^([1]).This era is characterized by the integration of key technological developments,including...The evolution of information technology has propelled the advancement of sensors into a new era,referred to as Sensors 4.0^([1]).This era is characterized by the integration of key technological developments,including the internet of things(IoT),Industry 4.0,big data,artificial intelligence(AI),robotics,and digital health.These innovations necessitate that sensors become increasingly interconnected and intelligent.The concept of"everything is connected"demands that sensors undertake a broader and more complex range of tasks,a challenge that conventional,bulky devices are ill-equipped to address.展开更多
Flexible pressure sensors show great promise for applications in such fields as electronic skin,healthcare,and intelligent robotics.Traditional capacitive pressure sensors,however,face the problem of low sensitivity,w...Flexible pressure sensors show great promise for applications in such fields as electronic skin,healthcare,and intelligent robotics.Traditional capacitive pressure sensors,however,face the problem of low sensitivity,which limits their wider application.In this paper,a flexible capacitive pressure sensor with microstructured ionization layer is fabricated by a sandwich-type process,with a low-cost and simple process of inverted molding with sandpapers being used to form a thermoplastic polyurethane elastomer ionic film with double-sided microstructure as the dielectric layer of the sensor,with silver nanowires as electrodes.The operating mechanism of this iontronic pressure sensor is analyzed using a graphical method,and the sensor is tested on a pressure platform.The test results show that the sensor has ultrahigh pressure sensitivities of 3.744 and 1.689 kPa^(−1) at low(0-20 kPa)and high(20-800 kPa)pressures,respectively,as well as a rapid response time(100 ms),and it exhibits good stability and repeatability.The sensor can be used for sensitive monitoring of activities such as finger bending,and for facial expression(smile,frown)recognition,as well as speech recognition.展开更多
Stretchable electronics that monitor joint activity and treat diseases based on liquid metal could be used in the development of healthcare applications.Such devices can be seamlessly integrated with human skin.Howeve...Stretchable electronics that monitor joint activity and treat diseases based on liquid metal could be used in the development of healthcare applications.Such devices can be seamlessly integrated with human skin.However,most high-precision microstructures and complex patterns are difficult to fabricate due to the limitations of conventional fabrication solutions,resulting in suboptimal performance under practical conditions.Here,a liquid-metal stretchable system utilizing natural leaf veins was reported as microstructures,which was based on a biomimetic concept and utilized an all-solution process for the preparation of complex microstructures.The systems are ultra-high tensile(800%tensile strain),environmentally stable(20 days)and mechanically durable(300-cycle).The system can accurately recognize the wearer's finger bending level as well as simple gesture signals.At the same time,the system acts as a wearable heater,which can realize the fast heating behavior of heating up to 50℃in 3 min under the human body-safe voltage(1.5 V).The tensile stability is demonstrated by the heterogeneous integration of lasers(405 nm)with the system interconnects for a stretchable and wearable light source.展开更多
Flexible electronics offer a multitude of advantages,such as flexibility,lightweight property,portability,and high durability.These unique properties allow for seamless applications to curved and soft surfaces,leading...Flexible electronics offer a multitude of advantages,such as flexibility,lightweight property,portability,and high durability.These unique properties allow for seamless applications to curved and soft surfaces,leading to extensive utilization across a wide range of fields in consumer electronics.These applications,for example,span integrated circuits,solar cells,batteries,wearable devices,bio-implants,soft robotics,and biomimetic applications.Recently,flexible electronic devices have been developed using a variety of materials such as organic,carbon-based,and inorganic semiconducting materials.Silicon(Si)owing to its mature fabrication process,excellent electrical,optical,thermal properties,and cost efficiency,remains a compelling material choice for flexible electronics.Consequently,the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays.The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain,thereby enhancing flexibility while preserving its exceptional properties.This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications.展开更多
In this study,wearable triboelectric nanogenerators comprising bar-printed polyvinylidene fluoride(PVDF)films incorporated with cobalt-based metal-organic framework(Co-MOF)were developed.The enhanced output performanc...In this study,wearable triboelectric nanogenerators comprising bar-printed polyvinylidene fluoride(PVDF)films incorporated with cobalt-based metal-organic framework(Co-MOF)were developed.The enhanced output performance of the TENGs was attributed to the phase transition of PVDF from a-crystals toβ-crystals,as facilitated by the incorporation of the MOF.The synthesis conditions,including metal ion,concentration,and particle size of the MOF,were optimized to increase open-circuit voltage(VOC)and open-circuit current(I_(SC))of PVDF-based TENGs.In addition to high operational stability,mechanical robustness,and long-term reliability,the developed TENG consisting of PVDF incorporated with Co-MOF(Co-MOF@PVDF)achieved a VOC of 194 V and an I_(SC)of 18.8μA.Furthermore,the feasibility of self-powered mobile electronics was demonstrated by integrating the developed wearable TENG with rectifier and control units to power a global positioning system(GPS)device.The local position of the user in real-time through GPS was displayed on a mobile interface,powered by the battery charged through friction-induced electricity generation.展开更多
Electronic textiles hold the merits of high conformability with the human body and natural surrounding,possessing large market demand and wide application foreground in smart wearable and portable devices.However,thei...Electronic textiles hold the merits of high conformability with the human body and natural surrounding,possessing large market demand and wide application foreground in smart wearable and portable devices.However,their further application is largely hindered by the shortage of flexible and stable power sources with multifunctional designability.Herein,a free-standing ZnHCF@CF electrode(ZnHCF grown on carbon nanotube fiber)with good mechanical deformability and high electrochemical performance for aqueous fiber-shaped calcium ion battery(FCIB)is reported.Benefiting from the unique Ca^(2+)/H^(+)co-insertion mechanism,the ZnHCF@CF cathode can exhibit great ion storage capability within a broadened voltage window.By pairing with a polyaniline(PANI)@CF anode,a ZnHCF@CF//PANI@CF FCIB is successfully fabricated,which exhibits a desirable volumetric energy density of 43.2mWh cm^(-3)and maintains superior electrochemical properties under different deformations.Moreover,the high-energy FCIB can be harmoniously integrated with a fiber-shaped strain sensor(FSS)to achieve real-time physiological monitoring on knees during long-running,exhibiting great promise for the practical application of electronic textiles.展开更多
Owing to the unique characteristics of ultra-thin body and nanoscale sensitivity volume,MoS_(2)-based field-effect tran-sistors(FETs)are regarded as optimal components for radiation-hardened integrated circuits(ICs),w...Owing to the unique characteristics of ultra-thin body and nanoscale sensitivity volume,MoS_(2)-based field-effect tran-sistors(FETs)are regarded as optimal components for radiation-hardened integrated circuits(ICs),which is exponentially grow-ing demanded especially in the fields of space exploration and the nuclear industry.Many researches on MoS_(2)-based radiation tolerance electronics focused on the total ionizing dose(TID)effect,while few works concerned the displacement damage(DD)effects,which is more challenging to measure and more crucial for practical applications.We first conducted measurements to assess the DD effects of MoS_(2) FETs,and then presented the stopping and ranges of ions in matter(SRIM)simulation to analysis the DD degradation mechanism in MoS_(2) electronics.The monolayer MoS_(2)-based FETs exhibit DD radiation tolerance up to 1.56×1013 MeV/g,which is at least two order of magnitude than that in conventional radiation hardened ICs.The exceptional DD radiation tolerance will significantly enhance the deployment of MoS_(2) integrated circuits in environments characterized by high-energy solar and cosmic radiation exposure.展开更多
Disposable devices designed for single and/or multiple reliable measurements over a short duration have attracted considerable interest recently. However, these devices often use non-recyclable and non-biodegradable m...Disposable devices designed for single and/or multiple reliable measurements over a short duration have attracted considerable interest recently. However, these devices often use non-recyclable and non-biodegradable materials and wasteful fabrication methods. Herein, we present ZnO nanowires(NWs) based degradable high-performance UV photodetectors(PDs) on flexible chitosan substrate. Systematic investigations reveal the presented device exhibits excellent photo response, including high responsivity(55 A/W), superior specific detectivity(4×10^(14) jones), and the highest gain(8.5×10~(10)) among the reported state of the art biodegradable PDs. Further, the presented PDs display excellent mechanical flexibility under wide range of bending conditions and thermal stability in the measured temperature range(5–50 ℃).The biodegradability studies performed on the device, in both deionized(DI) water(pH≈6) and PBS solution(pH=7.4),show fast degradability in DI water(20 mins) as compared to PBS(48 h). These results show the potential the presented approach holds for green and cost-effective fabrication of wearable, and disposable sensing systems with reduced adverse environmental impact.展开更多
Flexible high-temperature electronics is a compliant form of high-temperature electronics to expand the application areas of conventional flexible one.In aerospace applications,electronic devices are not only required...Flexible high-temperature electronics is a compliant form of high-temperature electronics to expand the application areas of conventional flexible one.In aerospace applications,electronic devices are not only required to be deformable but also to be able to withstand extreme temperatures.The disadvantages of current flexible electronics,such as high cost,large differences between components,and even requiring independent debugging,are acceptable.展开更多
Large,3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit...Large,3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit technologies.However,these curved electronics present great challenges to the fabrication processes.Here,we propose a reconfigurable,mask-free,conformal fabrication strategy with a robot-like system,called robotized‘transfer-and-jet’printing,to assemble diverse electronic devices on complex surfaces.This novel method is a ground-breaking advance with the unique capability to integrate rigid chips,flexible electronics,and conformal circuits on complex surfaces.Critically,each process,including transfer printing,inkjet printing,and plasma treating,are mask-free,digitalized,and programmable.The robotization techniques,including measurement,surface reconstruction and localization,and path programming,break through the fundamental constraints of 2D planar microfabrication in the context of geometric shape and size.The transfer printing begins with the laser lift-off of rigid chips or flexible electronics from donor substrates,which are then transferred onto a curved surface via a dexterous robotic palm.Then the robotic electrohydrodynamic printing directly writes submicrometer structures on the curved surface.Their permutation and combination allow versatile conformal microfabrication.Finally,robotized hybrid printing is utilized to successfully fabricate a conformal heater and antenna on a spherical surface and a flexible smart sensing skin on a winged model,where the curved circuit,flexible capacitive and piezoelectric sensor arrays,and rigid digital–analog conversion chips are assembled.Robotized hybrid printing is an innovative printing technology,enabling additive,noncontact and digital microfabrication for 3D curved electronics.展开更多
Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades,thereby fueling the next-generation electronics.In the p...Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades,thereby fueling the next-generation electronics.In the past few decades,the research on flexible electronic devices based on organic materials has witnessed rapid development and substantial achievements,and inorganic semiconductors are also now beginning to shine in the field of flexible electronics.As validated by the latest research,some of the inorganic semiconductors,particularly those at low dimension,unexpectedly exhibited excellent mechanical flexibility on top of superior electrical properties.Herein,we bring together a comprehensive analysis on the recently burgeoning low-dimension inorganic semiconductor materials in flexible electronics,including one-dimensional(1D)inorganic semiconductor nanowires(NWs)and two-dimensional(2D)transition metal dichalcogenides(TMDs).The fundamental electrical properties,optical properties,mechanical properties and strain engineering of materials,and their performance in flexible device applications are discussed in detail.We also propose current challenges and predict future development directions including material synthesis and device fabrication and integration.展开更多
The readout electronics for a prototype soft X-ray spectrometer based on silicon drift detector(SDD),for precisely measuring the energy and arrival time of X-ray photons is presented in this paper.The system mainly co...The readout electronics for a prototype soft X-ray spectrometer based on silicon drift detector(SDD),for precisely measuring the energy and arrival time of X-ray photons is presented in this paper.The system mainly consists of two parts,i.e.,an analog electronics section(including a pre-amplifier,a signal shaper and filter,a constant fraction timing circuit,and a peak hold circuit)and a digital electronics section(including an ADC and a TDC).Test results with X-ray sources show that an energy dynamic range of 1-10 keV with an integral nonlinearity of less than 0.1%can be achieved,and the energy resolution is better than 160 eV @ 5.9 keV FWHM.Using a waveform generator,test results also indicate that time resolution of the electronics system is about 3.7 ns,which is much less than the transit time spread of SDD(<100 ns)and satisfies the requirements of future applications.展开更多
基金support received from National Research Foundation of Korea (NRF) Grant funded by the Korea government (MSIT)(RS-2024-00353768)the National Research Foundation of Korea (NRF) Grant funded by the Korea government (MSIT)(RS-2025-02217919)+1 种基金funded by the Yonsei Fellowshipfunded by Lee Youn Jae and the KIST Institutional Program Project No.2E31603-22-140 (KJY).
文摘Ultra-thin crystalline silicon stands as a cornerstone material in the foundation of modern micro and nano electronics.Despite the proliferation of various materials including oxide-based,polymer-based,carbon-based,and two-dimensional(2D)materials,crystal silicon continues to maintain its stronghold,owing to its superior functionality,scalability,stability,reliability,and uniformity.Nonetheless,the inherent rigidity of the bulk silicon leads to incompatibility with soft tissues,hindering the utilization amid biomedical applications.Because of such issues,decades of research have enabled successful utilization of various techniques to precisely control the thickness and morphology of silicon layers at the scale of several nanometres.This review provides a comprehensive exploration on the features of ultra-thin single crystalline silicon as a semiconducting material,and its role especially among the frontier of advanced bioelectronics.Key processes that enable the transition of rigid silicon to flexible form factors are exhibited,in accordance with their chronological sequence.The inspected stages span both prior and subsequent to transferring the silicon membrane,categorized respectively as on-wafer manufacturing and rigid-to-soft integration.Extensive guidelines to unlock the full potential of flexible electronics are provided through ordered analysis of each manufacturing procedure,the latest findings of biomedical applications,along with practical perspectives for researchers and manufacturers.
基金supported by the National Natural Science Foundation of China(Nos.11927901,12105110,U2032209,12275105)the National Key Research and Development Program of China(Nos.2020YFE0202002,2022YFA1602103)the Fundamental Research Funds for the Central Universities(No.CCNU22QN005)。
文摘The Cooling Storage Ring(CSR)external-target experiment(CEE)will be the first large-scale nuclear physics experiment at the Heavy Ion Research Facility in Lanzhou(HIRFL).A beam monitor has been developed to monitor the beam status and to improve the reconstruction resolution of the primary vertex.Custom-designed pixel charge sensors,named TopmetalCEEv1,are employed in the detector to locate the position of each particle.Readout electronics for the beam monitor were designed,including front-end electronics utilizing the Topmetal-CEEv1 sensors,as well as a readout and control unit that communicates with the DAQ,trigger,and clock systems.A series of tests were performed to validate the functionality and performance of the system,including basic electronic verifications and responses toαparticles and heavy-ion beams.The results show that all designed functions of the readout electronics system work well,and this system could be used for beam monitoring in the CEE experiment.
基金the National Natural Science Foundation of China under granted No.62104100National Key Research Program of China under No.92164201+1 种基金National Natural Science Foundation of China for Distinguished Young Scholars under No.62325403National Natural Science Foundation of China under No.61934004.
文摘Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine interfaces.Crystalline silicon is one of the most mature and reliable materials for high-performance electronics;however,its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics.Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials,such as transforming them into thin nanomembranes or nanowires.This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics,from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates,and ultimately to shaping silicon nanowires using vapor-liquid-solid or in-plane solid-liquid-solid techniques.We explore the latest developments in Si-based soft electronic devices,with applications in sensors,nanoprobes,robotics,and brain-machine interfaces.Finally,the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics.
基金supported by the National Natural Science Foundation of China(22176221 and 22273045)the Central Public-interest Scientific Institution Basal Research Fund,Chinese Academy of Fishery Sciences(2024XT09)+1 种基金the Tsinghua University Independent Scientific Research Plan for Young Investigatorthe Tsinghua University Initiative Scientific Research Program。
文摘Wearable electronics incorporating proteins for biocompatibility have garnered significant research attention,given their potential applications in biocompatible medical devices,artificial skin,humanoid robots,and other fields.However,a notable challenge exists,as many wearable electronics currently lack those essential properties due to issues such as non-biological compatibility,as well as insufficient mechanical and conductive performance.Here,we have developed a hybrid keratin(KE)hydrogel by incorporating a liquid metal(LM,eutectic gallium-indium alloy)to design a wearable electronic device with excellent biocompatibility,enhanced conductivity,and good mechanical properties.The resulting keratin liquid metal(KELM)hydrogel demonstrates favorable mechanical characteristics,including good tensile strength(166 kPa),impressive stretchability(2600%),and long-term stability.Furthermore,it exhibits good conductivity(6.84 S·m^(-1))and sensitivity as a sensing material(gauge factor(GF)=7.03),rendering it suitable for constructing high-performance strain sensors.Notably,the KELM hydrogel-based wearable electronics extend their functionality to monitoring marine inhabitants'health.This innovative application provides new insights for designing the next generation of biomimetic electronic devices,with potential applications in human-machine interfaces,electronic skin,artificial intelligence,and health monitoring.
基金supported by the National Science Foundation of China under the Grant Nos.12127806 and 62175195the International Joint Research Laboratory for Micro/Nano Manufacturing and Measurement Technologies。
文摘High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human-machine interactions.However,despite the recent advances,the development of three-dimensional(3D)soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity.Here,an advanced 3D laser printing pathway,based on femtosecond laser direct writing(FLDW),is demonstrated for preparing liquid metal(LM)-based any layer HDI soft electronics.FLDW technology,with the characteristics of high spatial resolution and high precision,allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits.High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation.The LM-based HDI circuit featuring high resolution(~1.5μm)and high integration(10-layer electrical interconnection)is achieved for customized soft electronics,including various customized multilayer passive electric components,soft multilayer circuit,and cross-scale multimode sensors.The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.
基金supported by the National Natural Science Foundation of China (Nos. 12222512, 12375193, U2031206, U1831206, and U2032209)the Scientific Instrument Developing Project of the Chinese Academy of Sciences (GJJSTD20210009)+1 种基金the CAS Pioneer Hundred Talent Programthe CAS Light of West China Program
文摘The Cooling Storage Ring of the Heavy Ion Research Facility in Lanzhou(HIRFL-CSR)was constructed to study nuclear physics,atomic physics,interdisciplinary science,and related applications.The External Target Facility(ETF)is located in the main ring of the HIRFL-CSR.The gamma detector of the ETF is built to measure emitted gamma rays with energies below 5 MeV in the center-of-mass frame and is planned to measure light fragments with energies up to 300 MeV.The readout electronics for the gamma detector were designed and commissioned.The readout electronics consist of thirty-two front-end cards,thirty-two readout control units(RCUs),one common readout unit,one synchronization&clock unit,and one sub-trigger unit.By using the real-time peak-detection algorithm implemented in the RCU,the data volume can be significantly reduced.In addition,trigger logic selection algorithms are implemented to improve the selection of useful events and reduce the data size.The test results show that the integral nonlinearity of the readout electronics is less than 1%,and the energy resolution for measuring the 60 Co source is better than 5.5%.This study discusses the design and performance of the readout electronics.
基金supported by a National Research Foundation of Korea(NRF)grant(No.2016R1A3B 1908249)funded by the Korean government.
文摘Mechanically durable transparent electrodes are essential for achieving long-term stability in flexible optoelectronic devices.Furthermore,they are crucial for applications in the fields of energy,display,healthcare,and soft robotics.Conducting meshes represent a promising alternative to traditional,brittle,metal oxide conductors due to their high electrical conductivity,optical transparency,and enhanced mechanical flexibility.In this paper,we present a simple method for fabricating an ultra-transparent conducting metal oxide mesh electrode using selfcracking-assisted templates.Using this method,we produced an electrode with ultra-transparency(97.39%),high conductance(Rs=21.24Ωsq^(−1)),elevated work function(5.16 eV),and good mechanical stability.We also evaluated the effectiveness of the fabricated electrodes by integrating them into organic photovoltaics,organic light-emitting diodes,and flexible transparent memristor devices for neuromorphic computing,resulting in exceptional device performance.In addition,the unique porous structure of the vanadium-doped indium zinc oxide mesh electrodes provided excellent flexibility,rendering them a promising option for application in flexible optoelectronics.
文摘This paper introduces the key design aspects of automotive center console instrument systems,including hardware architecture,ergonomics,antenna layout,etc.It elaborates on the application and advantages of various advanced technologies,such as 3D printing and dual-color injection molding.Additionally,it discusses advancements in structural design,as well as future challenges and the trend of multidisciplinary collaborative innovation.
文摘The evolution of information technology has propelled the advancement of sensors into a new era,referred to as Sensors 4.0^([1]).This era is characterized by the integration of key technological developments,including the internet of things(IoT),Industry 4.0,big data,artificial intelligence(AI),robotics,and digital health.These innovations necessitate that sensors become increasingly interconnected and intelligent.The concept of"everything is connected"demands that sensors undertake a broader and more complex range of tasks,a challenge that conventional,bulky devices are ill-equipped to address.
基金supported by the Youth Project of the National Natural Science Foundation of China(Grant No.52105594)the Youth Project of the Applied Basic Research Program of Shanxi Province(Grant No.20210302124274)+4 种基金the Key Research and Development Program of Shanxi Province(Grant No.202102030201005)the Natural Youth Science Foundation of Shanxi Province(Grant Nos.202103021223005 and 202203021212015)the Fund for Shanxi 1331 Project,the Science and Technology Innovation Plan for Colleges and Universities in Shanxi Province(Grant No.2022L575)the Science and Technology Innovation Project in Higher Schools in Shanxi(Grant No.J2020383)Teaching Reform and Innovation Project of the Education Department of Shanxi Province(Grant No.J20221195).
文摘Flexible pressure sensors show great promise for applications in such fields as electronic skin,healthcare,and intelligent robotics.Traditional capacitive pressure sensors,however,face the problem of low sensitivity,which limits their wider application.In this paper,a flexible capacitive pressure sensor with microstructured ionization layer is fabricated by a sandwich-type process,with a low-cost and simple process of inverted molding with sandpapers being used to form a thermoplastic polyurethane elastomer ionic film with double-sided microstructure as the dielectric layer of the sensor,with silver nanowires as electrodes.The operating mechanism of this iontronic pressure sensor is analyzed using a graphical method,and the sensor is tested on a pressure platform.The test results show that the sensor has ultrahigh pressure sensitivities of 3.744 and 1.689 kPa^(−1) at low(0-20 kPa)and high(20-800 kPa)pressures,respectively,as well as a rapid response time(100 ms),and it exhibits good stability and repeatability.The sensor can be used for sensitive monitoring of activities such as finger bending,and for facial expression(smile,frown)recognition,as well as speech recognition.
基金financially supported by the National Key Research and Development Program of China(No.2021YFA1401100)the National Natural Science Foundation of China(Nos.61825403 and 61921005)。
文摘Stretchable electronics that monitor joint activity and treat diseases based on liquid metal could be used in the development of healthcare applications.Such devices can be seamlessly integrated with human skin.However,most high-precision microstructures and complex patterns are difficult to fabricate due to the limitations of conventional fabrication solutions,resulting in suboptimal performance under practical conditions.Here,a liquid-metal stretchable system utilizing natural leaf veins was reported as microstructures,which was based on a biomimetic concept and utilized an all-solution process for the preparation of complex microstructures.The systems are ultra-high tensile(800%tensile strain),environmentally stable(20 days)and mechanically durable(300-cycle).The system can accurately recognize the wearer's finger bending level as well as simple gesture signals.At the same time,the system acts as a wearable heater,which can realize the fast heating behavior of heating up to 50℃in 3 min under the human body-safe voltage(1.5 V).The tensile stability is demonstrated by the heterogeneous integration of lasers(405 nm)with the system interconnects for a stretchable and wearable light source.
基金supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. RS-2024-00353768)the Yonsei Fellowship, funded by Lee Youn Jae. This study was funded by the KIST Institutional Program Project No. 2E31603-22-140 (K J Y). S M W acknowledges the support by National Research Foundation of Korea (NRF) grant funded by the Korea government (Grant Nos. NRF-2021R1C1C1009410, NRF2022R1A4A3032913 and RS-2024-00411904)
文摘Flexible electronics offer a multitude of advantages,such as flexibility,lightweight property,portability,and high durability.These unique properties allow for seamless applications to curved and soft surfaces,leading to extensive utilization across a wide range of fields in consumer electronics.These applications,for example,span integrated circuits,solar cells,batteries,wearable devices,bio-implants,soft robotics,and biomimetic applications.Recently,flexible electronic devices have been developed using a variety of materials such as organic,carbon-based,and inorganic semiconducting materials.Silicon(Si)owing to its mature fabrication process,excellent electrical,optical,thermal properties,and cost efficiency,remains a compelling material choice for flexible electronics.Consequently,the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays.The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain,thereby enhancing flexibility while preserving its exceptional properties.This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications.
基金supported by the National Research Foundation of Korea(NRF)grant funded by the Korean government(MSIT)(NRF-2021R1A2C2012855)
文摘In this study,wearable triboelectric nanogenerators comprising bar-printed polyvinylidene fluoride(PVDF)films incorporated with cobalt-based metal-organic framework(Co-MOF)were developed.The enhanced output performance of the TENGs was attributed to the phase transition of PVDF from a-crystals toβ-crystals,as facilitated by the incorporation of the MOF.The synthesis conditions,including metal ion,concentration,and particle size of the MOF,were optimized to increase open-circuit voltage(VOC)and open-circuit current(I_(SC))of PVDF-based TENGs.In addition to high operational stability,mechanical robustness,and long-term reliability,the developed TENG consisting of PVDF incorporated with Co-MOF(Co-MOF@PVDF)achieved a VOC of 194 V and an I_(SC)of 18.8μA.Furthermore,the feasibility of self-powered mobile electronics was demonstrated by integrating the developed wearable TENG with rectifier and control units to power a global positioning system(GPS)device.The local position of the user in real-time through GPS was displayed on a mobile interface,powered by the battery charged through friction-induced electricity generation.
基金partially supported by the Natural Science Foundation of Liaoning Province(2023-MS-115)the Large Instrument and Equipment Open Foundation of Dalian University of Technology+1 种基金the National Natural Science Foundation of China(22308261)funding from the Fundamental Research Funds for the Central Universities,conducted at Tongji University。
文摘Electronic textiles hold the merits of high conformability with the human body and natural surrounding,possessing large market demand and wide application foreground in smart wearable and portable devices.However,their further application is largely hindered by the shortage of flexible and stable power sources with multifunctional designability.Herein,a free-standing ZnHCF@CF electrode(ZnHCF grown on carbon nanotube fiber)with good mechanical deformability and high electrochemical performance for aqueous fiber-shaped calcium ion battery(FCIB)is reported.Benefiting from the unique Ca^(2+)/H^(+)co-insertion mechanism,the ZnHCF@CF cathode can exhibit great ion storage capability within a broadened voltage window.By pairing with a polyaniline(PANI)@CF anode,a ZnHCF@CF//PANI@CF FCIB is successfully fabricated,which exhibits a desirable volumetric energy density of 43.2mWh cm^(-3)and maintains superior electrochemical properties under different deformations.Moreover,the high-energy FCIB can be harmoniously integrated with a fiber-shaped strain sensor(FSS)to achieve real-time physiological monitoring on knees during long-running,exhibiting great promise for the practical application of electronic textiles.
基金supported by the National Natural Science Foundation of China (Grant No.62301247)the Fundamental Research Funds for the Central Universities (Grant No.2024300427)+4 种基金the Natural Science Foundation of Jiangsu Province (Grant No.BK20230778)the Key Research and Development Program of Jiangsu Province (Grant No.BK20232009)the Innovation Leading Talent Foundation of Suzhou (Grant No.ZXL2023164)Guangdong Major Project of Basic Research (Grant No.2021B0301030003)Jihua Laboratory (Project No.X210141TL210).
文摘Owing to the unique characteristics of ultra-thin body and nanoscale sensitivity volume,MoS_(2)-based field-effect tran-sistors(FETs)are regarded as optimal components for radiation-hardened integrated circuits(ICs),which is exponentially grow-ing demanded especially in the fields of space exploration and the nuclear industry.Many researches on MoS_(2)-based radiation tolerance electronics focused on the total ionizing dose(TID)effect,while few works concerned the displacement damage(DD)effects,which is more challenging to measure and more crucial for practical applications.We first conducted measurements to assess the DD effects of MoS_(2) FETs,and then presented the stopping and ranges of ions in matter(SRIM)simulation to analysis the DD degradation mechanism in MoS_(2) electronics.The monolayer MoS_(2)-based FETs exhibit DD radiation tolerance up to 1.56×1013 MeV/g,which is at least two order of magnitude than that in conventional radiation hardened ICs.The exceptional DD radiation tolerance will significantly enhance the deployment of MoS_(2) integrated circuits in environments characterized by high-energy solar and cosmic radiation exposure.
基金supported in part by Engineering and Physical Science Research Council (EPSRC) through Engineering Fellowship (EP/R029644/1)Hetero-print Programme Grant (EP/R03480X/1)European Commission through grant references (H2020-MSCAITN2019-861166)。
文摘Disposable devices designed for single and/or multiple reliable measurements over a short duration have attracted considerable interest recently. However, these devices often use non-recyclable and non-biodegradable materials and wasteful fabrication methods. Herein, we present ZnO nanowires(NWs) based degradable high-performance UV photodetectors(PDs) on flexible chitosan substrate. Systematic investigations reveal the presented device exhibits excellent photo response, including high responsivity(55 A/W), superior specific detectivity(4×10^(14) jones), and the highest gain(8.5×10~(10)) among the reported state of the art biodegradable PDs. Further, the presented PDs display excellent mechanical flexibility under wide range of bending conditions and thermal stability in the measured temperature range(5–50 ℃).The biodegradability studies performed on the device, in both deionized(DI) water(pH≈6) and PBS solution(pH=7.4),show fast degradability in DI water(20 mins) as compared to PBS(48 h). These results show the potential the presented approach holds for green and cost-effective fabrication of wearable, and disposable sensing systems with reduced adverse environmental impact.
基金financially supported by the National Key R&D Program of China (No.2021YFB3200700)the National Natural Science Foundation of China (Nos.52205593 and 51925503)Xplorer Prize (2020-1036)。
文摘Flexible high-temperature electronics is a compliant form of high-temperature electronics to expand the application areas of conventional flexible one.In aerospace applications,electronic devices are not only required to be deformable but also to be able to withstand extreme temperatures.The disadvantages of current flexible electronics,such as high cost,large differences between components,and even requiring independent debugging,are acceptable.
基金The authors acknowledge support from the National Nat-ural Science Foundation of China(51635007,51925503,51705179)Natural Science Foundation of Hubei Province of China(2020CFA028).
文摘Large,3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit technologies.However,these curved electronics present great challenges to the fabrication processes.Here,we propose a reconfigurable,mask-free,conformal fabrication strategy with a robot-like system,called robotized‘transfer-and-jet’printing,to assemble diverse electronic devices on complex surfaces.This novel method is a ground-breaking advance with the unique capability to integrate rigid chips,flexible electronics,and conformal circuits on complex surfaces.Critically,each process,including transfer printing,inkjet printing,and plasma treating,are mask-free,digitalized,and programmable.The robotization techniques,including measurement,surface reconstruction and localization,and path programming,break through the fundamental constraints of 2D planar microfabrication in the context of geometric shape and size.The transfer printing begins with the laser lift-off of rigid chips or flexible electronics from donor substrates,which are then transferred onto a curved surface via a dexterous robotic palm.Then the robotic electrohydrodynamic printing directly writes submicrometer structures on the curved surface.Their permutation and combination allow versatile conformal microfabrication.Finally,robotized hybrid printing is utilized to successfully fabricate a conformal heater and antenna on a spherical surface and a flexible smart sensing skin on a winged model,where the curved circuit,flexible capacitive and piezoelectric sensor arrays,and rigid digital–analog conversion chips are assembled.Robotized hybrid printing is an innovative printing technology,enabling additive,noncontact and digital microfabrication for 3D curved electronics.
基金supported by the Natural Science Foundation of China(No.51902101)Natural Science Foundation of Jiangsu Province(No.BK20201381)+1 种基金Science Foundation of Nanjing University of Posts and Telecommunications(No.NY219144)Postgraduate Research&Practice Innovation Program of Jiangsu Province(No.SJCX22_0254).
文摘Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades,thereby fueling the next-generation electronics.In the past few decades,the research on flexible electronic devices based on organic materials has witnessed rapid development and substantial achievements,and inorganic semiconductors are also now beginning to shine in the field of flexible electronics.As validated by the latest research,some of the inorganic semiconductors,particularly those at low dimension,unexpectedly exhibited excellent mechanical flexibility on top of superior electrical properties.Herein,we bring together a comprehensive analysis on the recently burgeoning low-dimension inorganic semiconductor materials in flexible electronics,including one-dimensional(1D)inorganic semiconductor nanowires(NWs)and two-dimensional(2D)transition metal dichalcogenides(TMDs).The fundamental electrical properties,optical properties,mechanical properties and strain engineering of materials,and their performance in flexible device applications are discussed in detail.We also propose current challenges and predict future development directions including material synthesis and device fabrication and integration.
基金supported by the National Natural Science Foundation of China(Grant No.11205154)
文摘The readout electronics for a prototype soft X-ray spectrometer based on silicon drift detector(SDD),for precisely measuring the energy and arrival time of X-ray photons is presented in this paper.The system mainly consists of two parts,i.e.,an analog electronics section(including a pre-amplifier,a signal shaper and filter,a constant fraction timing circuit,and a peak hold circuit)and a digital electronics section(including an ADC and a TDC).Test results with X-ray sources show that an energy dynamic range of 1-10 keV with an integral nonlinearity of less than 0.1%can be achieved,and the energy resolution is better than 160 eV @ 5.9 keV FWHM.Using a waveform generator,test results also indicate that time resolution of the electronics system is about 3.7 ns,which is much less than the transit time spread of SDD(<100 ns)and satisfies the requirements of future applications.
