Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is import...Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.展开更多
Antimony oxychloride Sb8O11Cl2(H2O)6 products with various morphologies including sheaf-like,rhombic-plate,oval leaf-like and quasi-wafer have been successfully synthesized via a mild and facile solution route at room...Antimony oxychloride Sb8O11Cl2(H2O)6 products with various morphologies including sheaf-like,rhombic-plate,oval leaf-like and quasi-wafer have been successfully synthesized via a mild and facile solution route at room temperature.The morphologies and structures of the as-prepared samples were characterized by X-ray powder diffraction(XRD),scanning electron microscopy(SEM) and transmission electron microscopy(TEM).A possible formation mechanism of these structures is proposed according to the experimental results and analysis.展开更多
基金Project supported by the National High Technology Research and Development Program of China(No.2008AA042505)the National Science and Technology Key Project Program(No.2009ZX02011)the Natural Science Foundation of Guangdong Province,China (No.U0734008)
文摘Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.
基金supported by the National Basic Research Program of China (2010CB93470)the National Natural Science Foundation of China (50725208,20973019)
文摘Antimony oxychloride Sb8O11Cl2(H2O)6 products with various morphologies including sheaf-like,rhombic-plate,oval leaf-like and quasi-wafer have been successfully synthesized via a mild and facile solution route at room temperature.The morphologies and structures of the as-prepared samples were characterized by X-ray powder diffraction(XRD),scanning electron microscopy(SEM) and transmission electron microscopy(TEM).A possible formation mechanism of these structures is proposed according to the experimental results and analysis.
