High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-...High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
We develop an integrated integrating sphere cold atom clock(ISCAC), which mainly consists of physical package,laser system, microwave source, and electronics.This compact system is more stable and reliable than the pr...We develop an integrated integrating sphere cold atom clock(ISCAC), which mainly consists of physical package,laser system, microwave source, and electronics.This compact system is more stable and reliable than the previous version.The experimental results show that the short term frequency stability of 5.4×10^-13τ-1/2 and 2.9× 10^-15 at 1-day integrating time are achieved.展开更多
Packages in Chinese cross talk are the origin of cross talk humor.By using the literature investigation method,the paper find the effect of humor when create the packages and unpack the packages,which is the process t...Packages in Chinese cross talk are the origin of cross talk humor.By using the literature investigation method,the paper find the effect of humor when create the packages and unpack the packages,which is the process that audiences construct mental spaces and create mappings between mental spaces,but the detail process of mental spaces and the mappings of mental spaces is uncertain.Thus,the paper uses literature investigation and illustration as the main research methods.This paper means to make a better understanding of the humor of cross talk and can help to create more humor discourse.展开更多
As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrati...As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself,as the case for system-on-package(SoP),has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining,let alone improving,reliability and performance.The fundamental signal,power,and thermal integrity issues are discussed in detail,along with published techniques from around the industry to mitigate these issues in SoP applications.展开更多
The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which ...The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which not only provides the optical gain which is absent from native Si substrates and enables complete photonic functionalities on chip,but also improves the system performance through advanced heterogeneous integrated packaging.This paper reviews recent progress of silicon-based optoelectronic heterogeneous integration in high performance optical interconnection.The research status,development trend and application of ultra-low loss optical waveguides,high-speed detectors,high-speed modulators,lasers and 2D,2.5D,3D and monolithic integration are focused on.展开更多
Photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize optics.Building on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the ...Photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize optics.Building on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the manufacturing of PICs has made remarkable progress.However,the packaging of PICs has often become a major barrier impeding their scalable deployment owing to their tight optical alignment tolerance,and hence,the requirement for specialty packaging instruments.Two-photon lithography(TPL),a laser direct-write three-dimensional(3-D)patterning technique with deep subwavelength resolution,has emerged as a promising solution for integrated photonics packaging.This study provides an overview of the technology,emphasizing the latest advances in TPL-enabled packaging schemes and their prospects for adoption in the mainstream photonic industry.展开更多
The Owen’s T function is presented in four new ways, one of them as a series similar to the Euler’s arctangent series divided by 2π, which is its majorant series. All possibilities enable numerically stable ...The Owen’s T function is presented in four new ways, one of them as a series similar to the Euler’s arctangent series divided by 2π, which is its majorant series. All possibilities enable numerically stable and fast convergent computation of the bivariate normal integral with simple recursion. When tested computation on a random sample of one million parameter triplets with uniformly distributed components and using double precision arithmetic, the maximum absolute error was 3.45 × 10<sup>-</sup><sup>16</sup>. In additional testing, focusing on cases with correlation coefficients close to one in absolute value, when the computation may be very sensitive to small rounding errors, the accuracy was retained. In rare potentially critical cases, a simple adjustment to the computation procedure was performed—one potentially critical computation was replaced with two equivalent non-critical ones. All new series are suitable for vector and high-precision computation, assuming they are supplemented with appropriate efficient and accurate computation of the arctangent and standard normal cumulative distribution functions. They are implemented by the R package Phi2rho, available on CRAN. Its functions allow vector arguments and are ready to work with the Rmpfr package, which enables the use of arbitrary precision instead of double precision numbers. A special test with up to 1024-bit precision computation is also presented.展开更多
在国家人工智能战略背景下,包装设计教育面临智能化转型的迫切需求。本研究系统探索了自然语言处理(Natural Language Processing,NLP)与大语言模型(Large Language Models,LLMs)、机器视觉技术、机器听觉技术、知识管理系统和智能体技...在国家人工智能战略背景下,包装设计教育面临智能化转型的迫切需求。本研究系统探索了自然语言处理(Natural Language Processing,NLP)与大语言模型(Large Language Models,LLMs)、机器视觉技术、机器听觉技术、知识管理系统和智能体技术五大人工智能技术赋能“包装设计”课程教学改革的创新路径。NLP与LLMs能处理教学沟通语义,为教学场景中理解、评价、描述等节点赋能;机器视觉技术能解析形态特征完成包装设计中的要素提取,为对比研究、学生作品量化评价提供数据支撑;机器听觉技术能捕获情感反馈,获取日常沟通和对话中的资讯,为师生交流和知识萃取提供技术工具;知识管理系统支撑决策,辅助系统归档知识、快捷检索;智能体技术实现环境交互体验提升。基于多模态智能融合的教学模式,不仅丰富了教学内容和形式,也提升了学生的技术敏感度和技术认知。该教学改革创新路径为人工智能赋能“包装设计”课程教学改革系统化地构建了一个基础框架。展开更多
基金Fok Ying Tung Education Foundation(No.91058)the Natural Science Foundation of High Education Institutions of Jiangsu Province(No.08KJD470004)Qing Lan Project of Jiangsu Province of 2008
文摘High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
基金Project supported by the Youth Innovation Promotion Association of the Chinese Academy of Sciences the National Natural Science Foundation of China(Grant Nos.61875215,61727821,and 11604353)
文摘We develop an integrated integrating sphere cold atom clock(ISCAC), which mainly consists of physical package,laser system, microwave source, and electronics.This compact system is more stable and reliable than the previous version.The experimental results show that the short term frequency stability of 5.4×10^-13τ-1/2 and 2.9× 10^-15 at 1-day integrating time are achieved.
文摘Packages in Chinese cross talk are the origin of cross talk humor.By using the literature investigation method,the paper find the effect of humor when create the packages and unpack the packages,which is the process that audiences construct mental spaces and create mappings between mental spaces,but the detail process of mental spaces and the mappings of mental spaces is uncertain.Thus,the paper uses literature investigation and illustration as the main research methods.This paper means to make a better understanding of the humor of cross talk and can help to create more humor discourse.
文摘As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself,as the case for system-on-package(SoP),has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining,let alone improving,reliability and performance.The fundamental signal,power,and thermal integrity issues are discussed in detail,along with published techniques from around the industry to mitigate these issues in SoP applications.
基金Project supported in part by the National Key Research and Development Program of China(Grant No.2021YFB2206504)the National Natural Science Foundation of China(Grant No.62235017)the China Postdoctoral Science Foundation(Grant No.2021M703125).
文摘The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which not only provides the optical gain which is absent from native Si substrates and enables complete photonic functionalities on chip,but also improves the system performance through advanced heterogeneous integrated packaging.This paper reviews recent progress of silicon-based optoelectronic heterogeneous integration in high performance optical interconnection.The research status,development trend and application of ultra-low loss optical waveguides,high-speed detectors,high-speed modulators,lasers and 2D,2.5D,3D and monolithic integration are focused on.
基金S.Y.and Q.D.acknowledge funding support from the National Key R&D Program of China 2021ZD0109904the Key Research Project of Zhejiang Lab No.2022PH0AC03.C.R.M.acknowledges the funding support provided by the Fulbright Program.
文摘Photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize optics.Building on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the manufacturing of PICs has made remarkable progress.However,the packaging of PICs has often become a major barrier impeding their scalable deployment owing to their tight optical alignment tolerance,and hence,the requirement for specialty packaging instruments.Two-photon lithography(TPL),a laser direct-write three-dimensional(3-D)patterning technique with deep subwavelength resolution,has emerged as a promising solution for integrated photonics packaging.This study provides an overview of the technology,emphasizing the latest advances in TPL-enabled packaging schemes and their prospects for adoption in the mainstream photonic industry.
文摘The Owen’s T function is presented in four new ways, one of them as a series similar to the Euler’s arctangent series divided by 2π, which is its majorant series. All possibilities enable numerically stable and fast convergent computation of the bivariate normal integral with simple recursion. When tested computation on a random sample of one million parameter triplets with uniformly distributed components and using double precision arithmetic, the maximum absolute error was 3.45 × 10<sup>-</sup><sup>16</sup>. In additional testing, focusing on cases with correlation coefficients close to one in absolute value, when the computation may be very sensitive to small rounding errors, the accuracy was retained. In rare potentially critical cases, a simple adjustment to the computation procedure was performed—one potentially critical computation was replaced with two equivalent non-critical ones. All new series are suitable for vector and high-precision computation, assuming they are supplemented with appropriate efficient and accurate computation of the arctangent and standard normal cumulative distribution functions. They are implemented by the R package Phi2rho, available on CRAN. Its functions allow vector arguments and are ready to work with the Rmpfr package, which enables the use of arbitrary precision instead of double precision numbers. A special test with up to 1024-bit precision computation is also presented.
文摘在国家人工智能战略背景下,包装设计教育面临智能化转型的迫切需求。本研究系统探索了自然语言处理(Natural Language Processing,NLP)与大语言模型(Large Language Models,LLMs)、机器视觉技术、机器听觉技术、知识管理系统和智能体技术五大人工智能技术赋能“包装设计”课程教学改革的创新路径。NLP与LLMs能处理教学沟通语义,为教学场景中理解、评价、描述等节点赋能;机器视觉技术能解析形态特征完成包装设计中的要素提取,为对比研究、学生作品量化评价提供数据支撑;机器听觉技术能捕获情感反馈,获取日常沟通和对话中的资讯,为师生交流和知识萃取提供技术工具;知识管理系统支撑决策,辅助系统归档知识、快捷检索;智能体技术实现环境交互体验提升。基于多模态智能融合的教学模式,不仅丰富了教学内容和形式,也提升了学生的技术敏感度和技术认知。该教学改革创新路径为人工智能赋能“包装设计”课程教学改革系统化地构建了一个基础框架。
