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Structural regulation and interface engineering in silicon-based anodes for high-energy-density lithium-ion batteries:A comprehensive review
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作者 Xin Xiao Jinping Xu +9 位作者 Cheng Zhang Meina Huang Yijun Miao Junjun Yao Xin Lin Shize Geng Taiyu Lyu Yifei Wu Dechao Wang Zhifeng Zheng 《Journal of Energy Chemistry》 2026年第2期327-364,I0009,共39页
Silicon(Si)-based anodes have emerged as promising candidates for the next-generation lithium-ion batteries(LIBs)due to their high theoretical capacity(4200 mAh g^(-1)).However,their further application is hindered by... Silicon(Si)-based anodes have emerged as promising candidates for the next-generation lithium-ion batteries(LIBs)due to their high theoretical capacity(4200 mAh g^(-1)).However,their further application is hindered by critical challenges,including severe volume expansion(~300%),formation of unstable solid electrolyte interphase(SEI),and inherently low conductivity.While extensive research has sought to alleviate the substantial internal stress caused by volume expansion through the rational design of Si-based anode structures,the underlying mechanisms that govern these improvements remain insufficiently understood,leaving significant gaps in mechanical and interface electrical failure.To build a comprehensive understanding relationship between structural design and performance enhancement of Si-based anodes,this review first analyzes the characteristics of various Sibased anode structures and their associated internal stresses.Subsequently,it summarizes effective strategies to optimize the performance of Si-based anodes,including doping design,novel electrolyte design,and fu nctional binder design.Additionally,we assess emerging technologies with high commercial potential for structural design and interfacial modification,such as porous carbon carriers,chemical vapor deposition(CVD),spray granulation,and pre-lithiation.Finally,this work provides perspectives on the structural design of Si-based anodes.Overall,this review systematically summarizes modification strategies for Si-based anodes through structural regulation and interface engineering,thereby providing a foundation for advanced structural and interfacial design. 展开更多
关键词 Lithium-ion batteries silicon-based anodes Structural engineering Solid electrolyte interphase Chemical vapor deposition Pre-lithiation
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Carbon-based economy and silicon-based economy under sustainable development goals:Classification,evolutionary trajectories,and coordinated development path
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作者 XU Shu-sheng YANG Yun-feng 《Ecological Economy》 2026年第1期83-100,共18页
This research discusses the core concepts,evolutionary trajectories,inherent differences and intrinsic interconnections between carbon-based and silicon-based life forms.On this basis,we further analyze the potential ... This research discusses the core concepts,evolutionary trajectories,inherent differences and intrinsic interconnections between carbon-based and silicon-based life forms.On this basis,we further analyze the potential risks brought by the unbalanced development of carbon and silicon economies.Then we point out a critical reality:although silicon-based life still depends on the assistance of carbon-based life for its evolution at present,the unconstrained growth of the silicon-based economy may ultimately undermine the survival and development of carbon-based economies and carbon-based life itself.We also give the solutions under our new theory,using the revenue and time saved from the silicon-based economy to subsidize the carbon-based economy,and producing more ecological products.The study proposes 6 strategic recommendations:(1)human society should establish a carbon-based life community;(2)environmental institutions produce more essential ecological products for the community,not only for human life;(3)all stakeholders take advantage of silicon-based life while also restricting its unlimited development;(4)countries and industries give full play to the positive role of the silicon-based economy in climate change mitigation and carbon-based life health;(5)relevant governance bodies enable AI to Participate in politics,assist in formulating policies and implement them fairly.(6)regions and economic entities develop diverse carbon-based economies based on the non-monetary trading system. 展开更多
关键词 climate change sustainable development goals(SDGs) ecological security artificial intelligence(AI) carbon-based economy silicon-based economy
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中频可重构收发SiP电路设计
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作者 孙超 徐思远 +1 位作者 范童修 林逸群 《电子元件与材料》 北大核心 2026年第1期120-125,共6页
在高灵敏度、高性能的射频系统中,中频电路具有不可或缺的作用。目前SiP技术主要围绕三维堆叠封装高密度集成,使微波电路具备完整的系统功能,更加着眼于产品的小型化、轻量化、批量化,这不可避免地导致了更长的研发周期和更为复杂的工... 在高灵敏度、高性能的射频系统中,中频电路具有不可或缺的作用。目前SiP技术主要围绕三维堆叠封装高密度集成,使微波电路具备完整的系统功能,更加着眼于产品的小型化、轻量化、批量化,这不可避免地导致了更长的研发周期和更为复杂的工艺步骤。结合SIP技术和中频收发组件的电路特点,本文提出了一种可快速验证的中频可重构收发SIP电路,其优势在于可靠性高、研发成本低、开发周期短、尺寸灵活便于集成,适用于将成熟电路快速小型化或数量较少的低成本定制化产品以及新型电路的快速验证。在仿真的基础上完成了实物验证,并对首批次30件产品的增益数据进行了整理,数据表明,该种架构SiP的一致性和稳定性能够满足批量产品的需求。目前该款中频SiP已应用于实际工程,后续计划在X频段采用类似设计,进一步研究金丝匹配在X波段的适用性。 展开更多
关键词 射频 收发电路 sip 中频可重构技术
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基于SIPS模型的出版播客传播策略
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作者 王丽丽 林炳樱 《浙江理工大学学报(社会科学版)》 2026年第1期42-49,共8页
随着播客兴起带来的听觉回归,出版行业正经历显著的音频化转向,探究出版播客的传播策略已成为出版传播领域的核心议题。引入用户消费行为领域的SIPS模型,基于“共鸣、确认、参与、共享与扩散”四个阶段,深入剖析用户接触出版播客过程中... 随着播客兴起带来的听觉回归,出版行业正经历显著的音频化转向,探究出版播客的传播策略已成为出版传播领域的核心议题。引入用户消费行为领域的SIPS模型,基于“共鸣、确认、参与、共享与扩散”四个阶段,深入剖析用户接触出版播客过程中的心理与行为机制。在此基础上,构建出版播客的传播策略:通过创新优质内容、打造准社会关系以及结合热点话题输出价值的方式触发用户共鸣;借助意见领袖、细分用户画像和强化IP标识的途径推动用户认同转化;通过搭建多渠道互动平台、用户参与内容创作以及延伸线下消费服务的方式提高用户参与度;发挥口碑效应,通过跨平台传播、及时响应用户反馈、培养用户中的意见领袖实现二次传播。该研究不仅验证了SIPS模型在出版音频传播情境中的适用性与解释力,更从用户心理与行为视角,为优化出版播客传播提供了理论参照与实践路径。 展开更多
关键词 (sipS)模型 出版播客 出版机构 传播策略 用户行为机制
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Bridge Layer-Enabled Silicon-Based Photoanode With High Photocurrent Density for Efficient and Stable Water Splitting
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作者 Shuyang Peng Di Liu +5 位作者 Zhiqin Ying Keyu An Chunfa Liu Weng Fai Ip Kin Ho Lo Hui Pan 《Carbon Energy》 2025年第8期60-68,共9页
Photoelectrochemical(PEC)water splitting holds significant promise for sustainable energy harvesting that enables efficient conversion of solar energy into green hydrogen.Nevertheless,achievement of high performance i... Photoelectrochemical(PEC)water splitting holds significant promise for sustainable energy harvesting that enables efficient conversion of solar energy into green hydrogen.Nevertheless,achievement of high performance is often limited by charge carrier recombination,resulting in unsatisfactory saturation current densities.To address this challenge,we present a novel strategy for achieving ultrahigh current density by incorporating a bridge layer between the Si substrate and the NiOOH cocatalyst in this paper.The optimal photoanode(TCO/n-p-Si/TCO/Ni)shows a remarkably low onset potential of 0.92 V vs.a reversible hydrogen electrode and a high saturation current density of 39.6 mA·cm^(-2),which is about 92.7%of the theoretical maximum(42.7 mA·cm^(-2)).In addition,the photoanode demonstrates stable operation for 60 h.Our systematic characterizations and calculations demonstrate that the bridge layer facilitates charge transfer,enhances catalytic performance,and provides corrosion protection to the underlying substrate.Notably,the integration of this photoanode into a PEC device for overall water splitting leads to a reduction of the onset potential.These findings provide a viable pathway for fabricating highperformance industrial photoelectrodes by integrating a substrate and a cocatalyst via a transparent and conductive bridge layer. 展开更多
关键词 bridge layer high current density photoelectrochemical water splitting silicon-based photoelectrode
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双层堆叠SIP封装工艺在隔离DC/DC变换器中的应用
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作者 王玉宝 宋义雄 《电讯技术》 北大核心 2026年第1期148-151,共4页
随着电子设备的小型化和高功率密度的发展,传统板级封装的隔离DC/DC变换器面临体积较大、散热效率低、集成度不足等瓶颈。针对传统封装工艺的局限性,提出了一种双层堆叠的系统级封装方案,利用再布线层技术,通过多次塑封、研磨等方法,将... 随着电子设备的小型化和高功率密度的发展,传统板级封装的隔离DC/DC变换器面临体积较大、散热效率低、集成度不足等瓶颈。针对传统封装工艺的局限性,提出了一种双层堆叠的系统级封装方案,利用再布线层技术,通过多次塑封、研磨等方法,将控制芯片、功率芯片、磁性元件等关键器件集成,形成双层堆叠结构。试验样品测试结果表明,封装尺寸仅为7 mm×7 mm×5.09 mm,功率密度达到328 W/in 3(1 in≈2.54 cm)。相较于传统双层板级封装尺寸(12.7 mm×12.7 mm×10.8 mm),封装面积缩小了69.6%,体积缩小了85.7%,功率密度提高了近6倍,满载效率最高可达82.9%。该方案为实现隔离DC/DC变换器小型化集成提供了一种解决思路。 展开更多
关键词 隔离DC/DC变换器 双层堆叠 sip封装
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L频段双通道高集成度变频SiP模块设计
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作者 杜泽保 孔小雪 +1 位作者 王晓庆 张树鹏 《电子技术应用》 2026年第1期48-52,共5页
为了适应系统轻量化、小型化、集成化的需求,基于3D堆叠技术实现了一款高集成度L频段双通道变频SiP模块。该SiP模块采用多层有机复合基板堆叠,集成了两路变频通道、频率源和微控制器,采用陶瓷管壳气密封装,尺寸仅为21 mm×16 mm... 为了适应系统轻量化、小型化、集成化的需求,基于3D堆叠技术实现了一款高集成度L频段双通道变频SiP模块。该SiP模块采用多层有机复合基板堆叠,集成了两路变频通道、频率源和微控制器,采用陶瓷管壳气密封装,尺寸仅为21 mm×16 mm×4.3 mm。测试结果表明,该模块具有43.5 dB的典型变频增益,增益平坦度小于0.7 dB,带外杂散抑制大于60 dBc,通道间隔离度大于50 dB,满足系统使用要求。 展开更多
关键词 3D堆叠 sip模块 变频 复合基板
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基于SiP模组的射频前端收发子阵列设计
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作者 袁胜伟 张宇 郑光华 《火控雷达技术》 2026年第1期77-86,共10页
基于SiP技术的波束赋形TR收发芯片设计了射频前端收发子阵列方案;该收发子阵列工作频段宽,主要用于X频段二维相控阵射频前端收发阵面集成模块化;配合散热性良好的复合材料围框及封装[1],使用硅基半导体系统级封装(SiP)模组芯片和高频混... 基于SiP技术的波束赋形TR收发芯片设计了射频前端收发子阵列方案;该收发子阵列工作频段宽,主要用于X频段二维相控阵射频前端收发阵面集成模块化;配合散热性良好的复合材料围框及封装[1],使用硅基半导体系统级封装(SiP)模组芯片和高频混压板层垂直互连设计[2];TR收发芯片贴装于高频混压板,其采用倒装栅格阵列(FC-LGA)方式进行射频/低频连接,实现高密度互连;TR收发芯片天线公共端的层间垂直互连设计方案,将信号低插入损耗传输至阵面天线阵元,芯片间垂直互连隔离设计和封装金属壳体隔离腔设计,也保证了阵元间隔离度;此射频前端收发子阵列由16颗TR收发芯片组成,每颗TR收发芯片对4路X频段射频信号分时收发和幅相控制,通过波束解算控制使16颗TR收发芯片协同工作,经功分合成网络形成射频前端收发子阵列接收和发射方向图[13];每颗SiP模组芯片尺寸为:10.2mm×10.2mm×0.76mm,接收单通道噪声系数为2.3dB,发射单通道连续波输出功率大于28.0dBm。 展开更多
关键词 sip TR FC-LGA 射频前端收发子阵列 方向图
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基于三维气密陶瓷封装的毫米波射频前端SiP设计
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作者 王志轩 周丽 李志友 《计算机测量与控制》 2026年第3期223-230,241,共9页
基于三维气密陶瓷封装技术,以提升集成密度与信号传输性能,实现射频前端系统级封装(SiP)小型化为目的,开展了一项毫米波射频前端SiP的设计与实现研究;采用三维直接镀铜(DPC)陶瓷基板与单片微波集成电路(MMIC)进行三维堆叠设计,并使用陶... 基于三维气密陶瓷封装技术,以提升集成密度与信号传输性能,实现射频前端系统级封装(SiP)小型化为目的,开展了一项毫米波射频前端SiP的设计与实现研究;采用三维直接镀铜(DPC)陶瓷基板与单片微波集成电路(MMIC)进行三维堆叠设计,并使用陶瓷通孔与铜柱构建类同轴传输结构,实现了射频信号的垂直互连,显著提升了射频前端SiP的集成密度和信号传输效率;通过详细的射频性能分析与关键参数计算,验证了该结构在毫米波频段的有效性;测试结果显示,在工作频段内,发射输出功率为21~22 dBm,接收增益为25~26 dB,接收噪声系数小于3.2 dB,电压驻波比小于2.3,拥有6 bit移相功能(步进5.625°)和6 bit衰减功能(步进0.5 dB),射频前端SiP尺寸仅12 mm×12 mm×4 mm。 展开更多
关键词 三维气密封装 DPC陶瓷基板 射频前端sip 陶瓷通孔 类同轴传输
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基于SiP技术的雷达频率源的研制
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作者 王玉江 陈朕 +2 位作者 蹇雨芮 李广 张博 《舰船电子对抗》 2026年第1期115-120,共6页
雷达导引头作为弹载武器进行精确识别打击目标的核心系统,对其抗干扰能力提出了更高的要求。雷达频率源作为雷达导引头系统的核心组件,其产生的超宽带跳频信号对雷达系统的抗干扰能力具有决定性影响。使用基于系统级封装(SiP)技术的封... 雷达导引头作为弹载武器进行精确识别打击目标的核心系统,对其抗干扰能力提出了更高的要求。雷达频率源作为雷达导引头系统的核心组件,其产生的超宽带跳频信号对雷达系统的抗干扰能力具有决定性影响。使用基于系统级封装(SiP)技术的封装器件,运用超宽带电路设计方法,采用新型印制板(PCB)架构和有效串扰隔离屏蔽技术,设计了一种小型化、通用化、低成本、高性能的雷达频率源,其输出信号范围覆盖Ka全频段,有效提高了雷达导引头的抗干扰能力。通过实验测试,该雷达频率源输出的Ka跳频信号范围可达20~40 GHz,相位噪声优于-80 dBc/Hz@1 kHz,跳频锁定时间优于50μs,杂散可达50 dBc,完全满足设计指标要求。 展开更多
关键词 频率源 系统级封装(sip)技术 超宽带电路设计 新型印制板架构 电磁兼容性设计
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基于SIPS模型的大学生阅读推广研究
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作者 肖丹 刘亚晴 孟月 《江苏科技信息》 2025年第8期51-56,共6页
文章引入用户消费行为模型——SIPS,研究如何更好地进行阅读推广活动来从根本上改善当代大学生的阅读现状,提升当代大学生的综合阅读素养,更进一步迈向实现全民阅读、建设学习型社会。文章使用文献检索、网络调查、问卷调查以及案例分... 文章引入用户消费行为模型——SIPS,研究如何更好地进行阅读推广活动来从根本上改善当代大学生的阅读现状,提升当代大学生的综合阅读素养,更进一步迈向实现全民阅读、建设学习型社会。文章使用文献检索、网络调查、问卷调查以及案例分析等方法,对当代大学生阅读现状进行调研,分析总结当代大学生的阅读现状,包括阅读目的性、功利性强,阅读内容消遣化,阅读层次浅层化,阅读意识不足,参与阅读推广活动积极性较低。在此基础上,文章结合SIPS模型提出大学生阅读推广策略,包括激起当代大学生的情感共鸣,消除当代大学生的不信任感,提高当代大学生的参与度,实现阅读推广活动的共享和扩散。 展开更多
关键词 sipS模型 阅读推广大学生 阅读现状
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微波3D-SiP模组的关键工艺方法研究
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作者 廖雯 张威 +2 位作者 文鹏 吉垚 张磊 《压电与声光》 北大核心 2025年第5期852-856,共5页
本文介绍了一种微波3D-SiP模组的工艺设计方法。该模组内部采用4种焊接材料和1种粘接材料,基于通用气密封HTCC管壳进行三维堆叠,实现了立体组装的产品小型化。同时,通过理论仿真与产品加工工艺相结合,分别对影响模组装配质量的键合、电... 本文介绍了一种微波3D-SiP模组的工艺设计方法。该模组内部采用4种焊接材料和1种粘接材料,基于通用气密封HTCC管壳进行三维堆叠,实现了立体组装的产品小型化。同时,通过理论仿真与产品加工工艺相结合,分别对影响模组装配质量的键合、电路板入壳和批量植球3项关键工艺进行研究。研究表明,该模组采用的工艺方法具有标准化、通用化、可靠性高的工艺特点。 展开更多
关键词 微波3D-sip模组 三维堆叠 仿真 金丝键合 植球工艺
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Regulating the Solvation Structure of Li^(+) Enables Chemical Prelithiation of Silicon-Based Anodes Toward High-Energy Lithium-Ion Batteries 被引量:12
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作者 Wenjie He Hai Xu +5 位作者 Zhijie Chen Jiang Long Jing Zhang Jiangmin Jiang Hui Dou Xiaogang Zhang 《Nano-Micro Letters》 SCIE EI CAS CSCD 2023年第7期293-305,共13页
The solvation structure of Li^(+) in chemical prelithiation reagent plays a key role in improving the low initial Coulombic efficiency(ICE) and poor cycle performance of silicon-based materials. Never theless, the che... The solvation structure of Li^(+) in chemical prelithiation reagent plays a key role in improving the low initial Coulombic efficiency(ICE) and poor cycle performance of silicon-based materials. Never theless, the chemical prelithiation agent is difficult to dope active Li^(+) in silicon-based anodes because of their low working voltage and sluggish Li^(+) diffusion rate. By selecting the lithium–arene complex reagent with 4-methylbiphenyl as an anion ligand and 2-methyltetrahydrofuran as a solvent, the as-prepared micro-sized Si O/C anode can achieve an ICE of nearly 100%. Interestingly, the best prelithium efficiency does not correspond to the lowest redox half-potential(E_(1/2)), and the prelithiation efficiency is determined by the specific influencing factors(E_(1/2), Li^(+) concentration, desolvation energy, and ion diffusion path). In addition, molecular dynamics simulations demonstrate that the ideal prelithiation efficiency can be achieved by choosing appropriate anion ligand and solvent to regulate the solvation structure of Li^(+). Furthermore, the positive effect of prelithiation on cycle performance has been verified by using an in-situ electrochemical dilatometry and solid electrolyte interphase film characterizations. 展开更多
关键词 Lithium-ion batteries silicon-based anodes Prelithiation Molecular dynamics simulations Solvation structure
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一种射频SiP模组链路快速验证方法研究 被引量:1
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作者 崔梦琦 余怀强 +2 位作者 张磊 王玺 代春玥 《压电与声光》 北大核心 2025年第1期108-112,共5页
针对射频SiP模组设计周期长、成本高、兼容性差等问题,提出了一种射频SiP模组链路快速验证方法。该方法将射频SiP模组内的射频器件分装于不同积木块中,再将积木块拼接形成有目标电路功能的验证链路。通过对该链路进行测试,可快速验证射... 针对射频SiP模组设计周期长、成本高、兼容性差等问题,提出了一种射频SiP模组链路快速验证方法。该方法将射频SiP模组内的射频器件分装于不同积木块中,再将积木块拼接形成有目标电路功能的验证链路。通过对该链路进行测试,可快速验证射频SiP模组设计是否达标。为实现积木块间良好互连,设计了高频连接桥压接结构。测试结果经去嵌计算,得到18 GHz内插入损耗最大值为1.34 dB。通过搭建与测试二次变频射频SiP模组链路,表明该方法具备低损耗、可重构、可复用等特性,对射频SiP模组快速设计具有重要的工程意义。 展开更多
关键词 射频sip 快速验证 高频连接桥 可重构 可复用
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基于SIP合胞体探讨疏肝健脾法促进功能性消化不良胃肠动力的作用机制 被引量:1
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作者 毛兰芳 刘俊宏 +4 位作者 张晶 牛媛媛 杜晓娟 李正菊 汪龙德 《辽宁中医杂志》 北大核心 2025年第7期5-8,I0002,共5页
SIP合胞体是维持正常胃肠动力的关键,功能性消化不良(FD)胃肠动力障碍与SIP合胞体中ICC-ANO1/PDGFRα+细胞-SK3途径的失衡有关。肝失疏泄、脾胃升降失常是FD发病的基本病机,疏肝健脾法是治疗FD的重要治法。前期研究发现疏肝健脾法改善F... SIP合胞体是维持正常胃肠动力的关键,功能性消化不良(FD)胃肠动力障碍与SIP合胞体中ICC-ANO1/PDGFRα+细胞-SK3途径的失衡有关。肝失疏泄、脾胃升降失常是FD发病的基本病机,疏肝健脾法是治疗FD的重要治法。前期研究发现疏肝健脾法改善FD胃肠动力与其调节胃肠肌电活动和脑肠肽释放有关,但是否通过调控SIP合胞体以干预FD目前尚不明确。因此我们提出:“疏肝健脾法通过ICC-ANO1/PDGFRα+细胞-SK3途径调控SIP合胞体促进FD胃肠动力”的科学假说。基于ICC-ANO1/PDGFRα+细胞-SK3途径,采用细胞学、分子生物学和全细胞膜片钳等方法,探讨疏肝健脾法中药含药血清对ICC/PDGFRα+细胞的影响;建立FD胃肠动力障碍大鼠模型,明确疏肝健脾法的干预作用,采用分子生物学和电生理技术验证疏肝健脾法调控SIP合胞体改善FD胃肠动力障碍及其作用机制。 展开更多
关键词 功能性消化不良 胃肠动力 sip合胞体 疏肝健脾 作用机制
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想象、情感、消费:SIPS模型视域下IP文学作品改编广播剧的用户心理分析——以猫耳FM平台广播剧为例
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作者 冷凇 郭雨潇 《广播电视网络》 2025年第4期41-45,共5页
猫耳FM构造了一种独特的“声音景观”,可以提高受众听觉体验的沉浸性。本文阐述了广播剧发挥声音叙事魅力、网文IP改编、构建声音想象方面的表现,针对猫耳FM平台广播剧的用户心理,基于SIPS模型进行分析,揭示小众爱好的个体如何与社群相... 猫耳FM构造了一种独特的“声音景观”,可以提高受众听觉体验的沉浸性。本文阐述了广播剧发挥声音叙事魅力、网文IP改编、构建声音想象方面的表现,针对猫耳FM平台广播剧的用户心理,基于SIPS模型进行分析,揭示小众爱好的个体如何与社群相连。研究发现,猫耳FM会有针对性地选择网文主题,通过声音激发想象,触动用户情感,使爱好二次元的人群实现与社群的情感共鸣,在弹幕互动的过程中实现自我认同。另外,猫耳FM开通多重营利渠道,以音频付费、奖励机制、周边售卖等多种形式开展线下活动,实现纵向发展和“出圈”的平衡。 展开更多
关键词 sipS模型 IP文学作品改编 广播剧 声音景观
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3D heterogeneous integration of wideband RF chips using silicon-based adapter board technology 被引量:4
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作者 Wang Yong Wei Wei +4 位作者 Yang Dong Sun Biao Zhang Xingwen Zhang Youming Huang Fengyi 《Journal of Southeast University(English Edition)》 EI CAS 2021年第1期8-13,共6页
An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapt... An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB. 展开更多
关键词 silicon-based adapter board frequency mixing frequency multiplier multi-function chip
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Silicon-based optoelectronic heterogeneous integration for optical interconnection 被引量:2
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作者 李乐良 李贵柯 +5 位作者 张钊 刘剑 吴南健 王开友 祁楠 刘力源 《Chinese Physics B》 SCIE EI CAS CSCD 2024年第2期1-9,共9页
The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which ... The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which not only provides the optical gain which is absent from native Si substrates and enables complete photonic functionalities on chip,but also improves the system performance through advanced heterogeneous integrated packaging.This paper reviews recent progress of silicon-based optoelectronic heterogeneous integration in high performance optical interconnection.The research status,development trend and application of ultra-low loss optical waveguides,high-speed detectors,high-speed modulators,lasers and 2D,2.5D,3D and monolithic integration are focused on. 展开更多
关键词 silicon-based heterogeneous integration heterogeneous integrated materials heterogeneous integrated packaging optical interconnection
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Multifunctional silicon-based light emitting device in standard complementary metal oxide semiconductor technology 被引量:2
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作者 王伟 黄北举 +1 位作者 董赞 陈弘达 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第1期677-683,共7页
A three-terminal silicon-based light emitting device is proposed and fabricated in standard 0.35 μm complementary metal-oxide-semiconductor technology. This device is capable of versatile working modes: it can emit ... A three-terminal silicon-based light emitting device is proposed and fabricated in standard 0.35 μm complementary metal-oxide-semiconductor technology. This device is capable of versatile working modes: it can emit visible to near infra-red (NIR) light (the spectrum ranges from 500 nm to 1000 nm) in reverse bias avalanche breakdown mode with working voltage between 8.35 V-12 V and emit NIR light (the spectrum ranges from 900 nm to 1300 nm) in the forward injection mode with working voltage below 2 V. An apparent modulation effect on the light intensity from the polysilicon gate is observed in the forward injection mode. Furthermore, when the gate oxide is broken down, NIR light is emitted from the polysilicon/oxide/silicon structure. Optoelectronic characteristics of the device working in different modes are measured and compared. The mechanisms behind these different emissions are explored. 展开更多
关键词 optoelectronic integrated circuit complementary metal-oxide-semiconductor technology silicon-based light emitting device ELECTROLUMINESCENCE
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Micro-Mechanism of Silicon-Based Waveguide Surface Smoothing in Hydrogen Annealing 被引量:1
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作者 段倩倩 任馨宇 +5 位作者 菅傲群 张辉 冀健龙 张强 张文栋 桑胜波 《Chinese Physics Letters》 SCIE CAS CSCD 2016年第12期110-114,共5页
The micro-mechanism of the silicon-based waveguide surface smoothing is investigated systematically to explore the effects of silicon-hydrogen bonds on high-temperature hydrogen annealing waveguides. The effect of sil... The micro-mechanism of the silicon-based waveguide surface smoothing is investigated systematically to explore the effects of silicon-hydrogen bonds on high-temperature hydrogen annealing waveguides. The effect of silicon- hydrogen bonds on the surface migration movement of silicon atoms and the waveguide surface topography are revealed. The micro-migration from an upper state to a lower state of silicon atoms is driven by silicon- hydrogen bonding, which is the key to ameliorate the rough surface morphology of the silicon-based waveguide. The process of hydrogen annealing is experimentally validated based on the simulated parameters. The surface roughness declines from 1.523nm to 0.461 nm. 展开更多
关键词 of on Micro-Mechanism of silicon-based Waveguide Surface Smoothing in Hydrogen Annealing in IS
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