Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of sold...Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.展开更多
Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by com...Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips.展开更多
Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,an...Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.展开更多
In the post-Moore era,advanced packaging is becoming more critical to meet the everlasting demands of elec-tronic products with smaller size,more powerful performance and lower cost.In this paper,developments in advan...In the post-Moore era,advanced packaging is becoming more critical to meet the everlasting demands of elec-tronic products with smaller size,more powerful performance and lower cost.In this paper,developments in advanced packaging have been discussed,such as 3D IC packaging,fan-out packaging,and chiplet packaging.Insights on the major advantages and challenges have also been briefly introduced.Our prospects about the solu-tions to some fundamental issues in sustainable development of advanced packaging have also been elucidated.The critical aspects and opportunities lie in standardization,co-design tools,new handling technologies,as well as multi-scale modeling and simulation.展开更多
Electronic packaging is an essential branch of electronic engineering that aims to protect electronic,microelec-tronic,and nanoelectronic systems from environmental conditions.The design of electronic packaging is hig...Electronic packaging is an essential branch of electronic engineering that aims to protect electronic,microelec-tronic,and nanoelectronic systems from environmental conditions.The design of electronic packaging is highly complex and requires the consideration of multi-physics phenomena,such as thermal transport,electromagnetic fields,and mechanical stress.This review presents a comprehensive overview of the multiphysics coupling of electric,magnetic,thermal,mechanical,and fluid fields,which are crucial for assessing the performance and reliability of electronic devices.The recent advancements in multi-scale simulation techniques are also system-atically summarized,such as finite element methods at the macroscopic scale,molecular dynamics and density functional theory at the microscopic scale,and particularly machine learning methods for bridging different scales.Additionally,we illustrate how these methods can be applied to study various aspects of electronic pack-aging,such as material properties,interfacial failure,thermal management,electromigration,and stress analysis.The challenges and the potential applications of multi-scale simulation techniques in electronic packaging are also highlighted.Further,some future directions for multi-scale simulation techniques in electronic packaging are concluded for further investigation.展开更多
电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与...电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。展开更多
An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct ch...An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.展开更多
基金financially supported by the National Natural Science Foundation of China(No.52075072)the Provincial Applied Basic Research Program of Liaoning Provincial Department of Science and Technology(No.2023JH2/101300181)the Key R&D Program of Shandong Province,China(No.2022CXGC020408)。
文摘Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.
基金the National Natural Science Foundation of China(62174170)the Natural Science Foundation of Guangdong Province(2024A1515010123)+4 种基金the Shenzhen Science and Technology Program(20220807020526001)the Strategic Priority Research Program of the Chinese Academy of Sciences(XDB0670000)the Shenzhen Science and Technology Program(KJZD20230923114708018,KJZD20230923114710022)the Talent Support Project of Guangdong(2021TX06C101)the Shenzhen Basic Research(JCYJ20210324115406019).
文摘Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips.
基金financially supported by National Natural Science Foundation of China(No.U2241223)Pre-Research Foundation of China(No.909010203-202).
文摘Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.
基金funded by National Natural Science Foundation of China(62274122 and 62004144)Guangdong Basic and Applied Basic Research Foundation(2021A1515010651)Hubei Provincial Natural Science Foundation of China(2020CFA032).
文摘In the post-Moore era,advanced packaging is becoming more critical to meet the everlasting demands of elec-tronic products with smaller size,more powerful performance and lower cost.In this paper,developments in advanced packaging have been discussed,such as 3D IC packaging,fan-out packaging,and chiplet packaging.Insights on the major advantages and challenges have also been briefly introduced.Our prospects about the solu-tions to some fundamental issues in sustainable development of advanced packaging have also been elucidated.The critical aspects and opportunities lie in standardization,co-design tools,new handling technologies,as well as multi-scale modeling and simulation.
基金supported by the National Natural Science Foundation of China(U2241244).
文摘Electronic packaging is an essential branch of electronic engineering that aims to protect electronic,microelec-tronic,and nanoelectronic systems from environmental conditions.The design of electronic packaging is highly complex and requires the consideration of multi-physics phenomena,such as thermal transport,electromagnetic fields,and mechanical stress.This review presents a comprehensive overview of the multiphysics coupling of electric,magnetic,thermal,mechanical,and fluid fields,which are crucial for assessing the performance and reliability of electronic devices.The recent advancements in multi-scale simulation techniques are also system-atically summarized,such as finite element methods at the macroscopic scale,molecular dynamics and density functional theory at the microscopic scale,and particularly machine learning methods for bridging different scales.Additionally,we illustrate how these methods can be applied to study various aspects of electronic pack-aging,such as material properties,interfacial failure,thermal management,electromigration,and stress analysis.The challenges and the potential applications of multi-scale simulation techniques in electronic packaging are also highlighted.Further,some future directions for multi-scale simulation techniques in electronic packaging are concluded for further investigation.
文摘电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。
基金supported by the National Natural Science Foundation of China(No.61076071)
文摘An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.
