摘要
电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。
The trends toward miniaturization,lightweighting,unmanned operation,and integration in electronic information systems necessitate continuous reductions in size,weight,and power consumption(SWaP,Size,Weight and Power)for electronic packaging.Traditional microelectronic packaging materials based on kovar alloy,aluminum alloy,and high-silicon aluminum struggle to simultaneously satisfy the requirements of large-span thermal matching,excellent brazing and laser welding performance,high thermal conductivity,high specific stiffness,high specific strength,and good manufacturability,thereby failing to adapt to SWaP demands.Functionally graded aluminum matrix composites(FGAMCs),which integrate the advantages of aluminum alloys with advanced composites such as aluminum-silicon and aluminum carbide-silicon,possess not only characteristics of large-span thermal matching and high thermal conductivity but also fine processing and excellent laser welding process performance.These materials have emerged as promising candidates for next-generation microelectronic packaging materials.This paper reviewed the advantages,preparation methods,and packaging applications of FGAMC,summarized the existing issues in the preparation and application of these materials,and outlines potential directions for future research directions.
作者
方杰
刘彦强
杨志宇
樊建中
刁恩泽
崔西会
黎康杰
彭颐豫
张坤
孔欣
杨博
FANG Jie;LIU Yanqiang;YANG Zhiyu;FAN Jianzhong;DIAO Enze;CUI Xihui;LI Kangjie;PENG Yiyu;ZHANG Kun;KONG Xin;YANG Bo(General Research Institute for Nonferrous Metals,Beijing 100088,China;The 29th Research Institute of China Electronics Technology Group Corporation,Chengdu 610036,China;Grinm Metal Composites(Beijing)Co.,Ltd.,Beijing 101400,China)
出处
《有色金属(中英文)》
北大核心
2025年第8期1295-1305,共11页
Nonferrous Metals
基金
国家重点研发计划-先进结构与复合材料专项(2022YFB3705705)。
关键词
先进金属基复合材料
功能梯度材料
铝基复合材料
电子封装
研究应用进展
advanced metal matrix composites
functionally graded materials(FGMs)
aluminum matrix composite
electronic packaging
research and application progress
