Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper ...Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.展开更多
In order to impart electrical conductivity to the magnesium alloy micro-arc oxidation(MAO)coating,the electroless copper plating was performed.Effects of plating temperature and complexing agent concentration on the p...In order to impart electrical conductivity to the magnesium alloy micro-arc oxidation(MAO)coating,the electroless copper plating was performed.Effects of plating temperature and complexing agent concentration on the properties of the electroless copper plating layers were studied by measuring their microstructure,corrosion resistance and electrical conductivity.It was found that the optimized plating temperature was 60°C,and the most suitable value of the complexing agent concentration was 30 g/L.Under this condition,a complete and dense plating layer could be obtained.The formation mechanism of the plating layer on magnesium alloy MAO coating was analyzed.A three-stage model of the plating process was proposed.The square resistance of the plated specimen was finally reduced to 0.03Ω/□after the third stage.Through electroless copper plating,the MAO coated sample obtained excellent electrical conductivity without significantly reducing its corrosion resistance.展开更多
In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore ...In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.展开更多
The amount of Cu coating by chemical plating was investigated based on quadratic regression orthogonal experimental design being adapted to the variation law of temperature, pH value and Ni2+ concentration, and the re...The amount of Cu coating by chemical plating was investigated based on quadratic regression orthogonal experimental design being adapted to the variation law of temperature, pH value and Ni2+ concentration, and the relevant regression equation was expressed as y=2.1609+0.5295×10-3T2-0.0342P2-0.0265N2+0.0023TP+0.0020TH+0.0199PN-0.0959T+0.3814P-0.2073N. The results showed that the deposition rate augmented with the increasing in temperature, pH value and Ni2+ concentration. The experimental parameters of the optimal coating were temperature 75 °C, pH value 8.5 and Ni2+ concentration 1.2 g/L. The electrochemical tests indicated that the cycle stability increased from 60.66% to 75.58%, indicating that the treated alloy exhibited better corrosion resistance.展开更多
The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry cur...The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry curves and anodic polarization curves. Three different oxidation peaks occur at the potentials of -0.62 V (Peak 1), -0.40 V (Peak 2) and -0.17 V (Peak 3) in the anode oxidation process of THPED-containing solution. The reaction at Peak 1, a main oxidation reaction, is the irreversible reaction of adsorbed HCHO with hydrogen evolution. The reaction at Peak 2, a secondary oxidation reaction, is the quasi-reversible reaction of adsorbed HCHO without hydrogen evolution. The reaction at Peak 3 is the irreversible oxidation of anode copper. The current density of Peak 1 increases gradually, that of Peak 2 remains constant and that of Peak 3 decreases with the increase of HCHO concentration. The current density of Peak 3 increases with the increase of THPED concentration and the complexation of THPED promotes the dissolution of anode copper.展开更多
The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was s...The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively, 2,2＇-bipyridyl and PEG as double stabilizers, the Mo powders are coated with copper successfully with little Cu20 contained, at the same time, Mo-Cu composite powders with copper content of 15 - 85 wt% can be obtained. The optimal values of pH, temperature and HCHO concentration are 12 -13, 60 -65 ℃ and 22 -26 mL/L, respectively.展开更多
Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulf...Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.展开更多
Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction pa...Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.展开更多
A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it ...A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it was dipped directly into PdCl_2 solution instead of the conventional SnCl_2 sensitization followed by PdCl_2 activation. Experimental results showed that the Pd 2+ ions from PdCl_2 solution were coordinated to the amino groups on the glass surface resulting in the formation of N-Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N-Pd complexes were reduced to Pd 0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM-modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.展开更多
A copper coating was deposited by electroless plating on the surfaces of urea-formaldehyde microcap- sules containing paraffin （UFP） particles. This composite microcapsule structure had low infrared OR） emissivity ...A copper coating was deposited by electroless plating on the surfaces of urea-formaldehyde microcap- sules containing paraffin （UFP） particles. This composite microcapsule structure had low infrared OR） emissivity and maintained a constant temperature, and could be used in IR stealth applications. The eiectroless copper layer formation and its micro-appearance, and the effect of the copper layer on the IR emissivity and thermal properties of the composite microcapsules were investigated. The IR emissivity of the composite microcapsules at wavelengths of 1-14 μm gradually decreased with increasing copper mass on the surface. After formation of an integrated copper layer, the rate of IR emissivity decrease was lower. This is because the copper coating improves the surface conductivity of the UFP; a high conductivity results in high reflectivity, which leads to a decrease in IR emissivity. The lowest IR emissivity achieved was 0.68. The phase-change enthalpy of the composite microcapsules decreased with increasing amount of copper coated on the surface because of the high density of copper. When the mass increase of the UFP after electroless copper plating was about 300%, the composite microcapsules had low IR emissivity （about 0.8） and a high phase-change enthalpy （80J/g）.展开更多
A procedure of low temperature solid-phase sintering（LTSS） was carried out to fabricate sintered metal fibrous media（SMFM） with high specific surface area.Stainless steel fibers which were produced by cutting proc...A procedure of low temperature solid-phase sintering（LTSS） was carried out to fabricate sintered metal fibrous media（SMFM） with high specific surface area.Stainless steel fibers which were produced by cutting process were first plated with a coarse copper coating layer by electroless plating process.A low-temperature sintering process was then completed at about 800 °C for 1 h under the protection of hydrogen atmosphere.The results show that a novel SMFM with complex surface morphology and high specific surface area（0.2 m2/g） can be obtained in this way.The effect of sintering temperature on the surface morphology and specific surface area of SMFM was studied by means of scanning electron microscopy and Brunauer-Emmett-Teller.The damage of micro-structure during the sintering process mainly contributed to the loss of specific surface area of SMFM and the optimal sintering temperature was 800 °C.展开更多
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u...Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.展开更多
Achieving high performances of high thermal conductivity and low thermal expansion remains a great challenge. In this study,we have designed and synthesized the ScF_(3)@Cu core-shell composites through a general elect...Achieving high performances of high thermal conductivity and low thermal expansion remains a great challenge. In this study,we have designed and synthesized the ScF_(3)@Cu core-shell composites through a general electroless plating method to coat Cu on the surface of negative thermal expansion particles of ScF_(3). A spatially continuous copper network structure is formed in the present core-shell structure composites to achieve high thermal conductivity and low thermal expansion simultaneously, which is different from the conventional mixed composites. Notably, a high thermal conductivity(136.3 W m^(-1) K^(-1)) has been achieved in the ScF_(3)@Cu-40 core-shell composite with a low thermal expansion property(4.3×10^(-6) K^(-1)). The mechanism of thermal property and microstructure of the present core-shell composites are systematically studied based on different models. Our proposed approach in this study can be widely applicable to numerous advanced materials, which should simultaneously control thermal conductivity and thermal expansion properties.展开更多
文摘Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.
基金financially supported by the National Key Research and Development Program of China(No.2016YFB0301105)the National Natural Science Foundation of China(No.51804190)+4 种基金the Shandong Provincial Natural Science Foundation,China(No.ZR2021ME240)the Youth Science Funds of Shandong Academy of Sciences,China(No.2020QN0022)the Shandong Province Key Research and Development Plan,China(Nos.2019GHZ019 and 2019JZZY020329)the Jinan Science&Technology Bureau,China(No.2019GXRC030)the Innovation Pilot Project for Fusion of Science,Education and Industry(International Cooperation)from Qilu University of Technology(Shandong Academy of Sciences),China(No.2020KJC-GH03)。
文摘In order to impart electrical conductivity to the magnesium alloy micro-arc oxidation(MAO)coating,the electroless copper plating was performed.Effects of plating temperature and complexing agent concentration on the properties of the electroless copper plating layers were studied by measuring their microstructure,corrosion resistance and electrical conductivity.It was found that the optimized plating temperature was 60°C,and the most suitable value of the complexing agent concentration was 30 g/L.Under this condition,a complete and dense plating layer could be obtained.The formation mechanism of the plating layer on magnesium alloy MAO coating was analyzed.A three-stage model of the plating process was proposed.The square resistance of the plated specimen was finally reduced to 0.03Ω/□after the third stage.Through electroless copper plating,the MAO coated sample obtained excellent electrical conductivity without significantly reducing its corrosion resistance.
文摘In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.
基金Project supported by the National Natural Science Foundation of China (50974042)Scientific Research Special Foundation of Doctor Subject of Chinese Universities (20090042120015)the Fundamental Research Funds for the Central Universities (N090302007)
文摘The amount of Cu coating by chemical plating was investigated based on quadratic regression orthogonal experimental design being adapted to the variation law of temperature, pH value and Ni2+ concentration, and the relevant regression equation was expressed as y=2.1609+0.5295×10-3T2-0.0342P2-0.0265N2+0.0023TP+0.0020TH+0.0199PN-0.0959T+0.3814P-0.2073N. The results showed that the deposition rate augmented with the increasing in temperature, pH value and Ni2+ concentration. The experimental parameters of the optimal coating were temperature 75 °C, pH value 8.5 and Ni2+ concentration 1.2 g/L. The electrochemical tests indicated that the cycle stability increased from 60.66% to 75.58%, indicating that the treated alloy exhibited better corrosion resistance.
基金Project(200501045) supported by Innovation Fund of Guangdong Province of China
文摘The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry curves and anodic polarization curves. Three different oxidation peaks occur at the potentials of -0.62 V (Peak 1), -0.40 V (Peak 2) and -0.17 V (Peak 3) in the anode oxidation process of THPED-containing solution. The reaction at Peak 1, a main oxidation reaction, is the irreversible reaction of adsorbed HCHO with hydrogen evolution. The reaction at Peak 2, a secondary oxidation reaction, is the quasi-reversible reaction of adsorbed HCHO without hydrogen evolution. The reaction at Peak 3 is the irreversible oxidation of anode copper. The current density of Peak 1 increases gradually, that of Peak 2 remains constant and that of Peak 3 decreases with the increase of HCHO concentration. The current density of Peak 3 increases with the increase of THPED concentration and the complexation of THPED promotes the dissolution of anode copper.
基金Sponsored by the National Natural Science Founation of China(Grant No.50301017)
文摘The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively, 2,2＇-bipyridyl and PEG as double stabilizers, the Mo powders are coated with copper successfully with little Cu20 contained, at the same time, Mo-Cu composite powders with copper content of 15 - 85 wt% can be obtained. The optimal values of pH, temperature and HCHO concentration are 12 -13, 60 -65 ℃ and 22 -26 mL/L, respectively.
基金supported by Universiti Sains Malaysia under the Research University Grant (RU. Grant No.1001/PKIMIA/811006)
文摘Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.
基金Project(9140A12060110BQ03)supported by the National Key Laboratory of Science and Technology on Materials under Shock and Impact,China
文摘Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.
基金ProjectsupportedbytheNationalNaturalScienceFoundationofChina (No .60 0 710 0 1)
文摘A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it was dipped directly into PdCl_2 solution instead of the conventional SnCl_2 sensitization followed by PdCl_2 activation. Experimental results showed that the Pd 2+ ions from PdCl_2 solution were coordinated to the amino groups on the glass surface resulting in the formation of N-Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N-Pd complexes were reduced to Pd 0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM-modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.
文摘A copper coating was deposited by electroless plating on the surfaces of urea-formaldehyde microcap- sules containing paraffin （UFP） particles. This composite microcapsule structure had low infrared OR） emissivity and maintained a constant temperature, and could be used in IR stealth applications. The eiectroless copper layer formation and its micro-appearance, and the effect of the copper layer on the IR emissivity and thermal properties of the composite microcapsules were investigated. The IR emissivity of the composite microcapsules at wavelengths of 1-14 μm gradually decreased with increasing copper mass on the surface. After formation of an integrated copper layer, the rate of IR emissivity decrease was lower. This is because the copper coating improves the surface conductivity of the UFP; a high conductivity results in high reflectivity, which leads to a decrease in IR emissivity. The lowest IR emissivity achieved was 0.68. The phase-change enthalpy of the composite microcapsules decreased with increasing amount of copper coated on the surface because of the high density of copper. When the mass increase of the UFP after electroless copper plating was about 300%, the composite microcapsules had low IR emissivity （about 0.8） and a high phase-change enthalpy （80J/g）.
基金Project (50930005) supported by the National Natural Science Foundation of ChinaProject (U0834002) supported by the Key Programof NSFC-Guangdong Joint Funds of China+1 种基金Project (LYM09024) supported by Training Program for Excellent Young Teachers withInnovation of Guangdong University, ChinaProject (2009ZM0121) supported by the Fundamental Research Funds for the CentralUniversities of South China University of Technology,China
文摘A procedure of low temperature solid-phase sintering（LTSS） was carried out to fabricate sintered metal fibrous media（SMFM） with high specific surface area.Stainless steel fibers which were produced by cutting process were first plated with a coarse copper coating layer by electroless plating process.A low-temperature sintering process was then completed at about 800 °C for 1 h under the protection of hydrogen atmosphere.The results show that a novel SMFM with complex surface morphology and high specific surface area（0.2 m2/g） can be obtained in this way.The effect of sintering temperature on the surface morphology and specific surface area of SMFM was studied by means of scanning electron microscopy and Brunauer-Emmett-Teller.The damage of micro-structure during the sintering process mainly contributed to the loss of specific surface area of SMFM and the optimal sintering temperature was 800 °C.
文摘Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.
基金This work was supported by the National Natural Science Foundation of China(Grant Nos.21825102,12004032 and 22001014)the Fundamental Research Funds for the Central Universities,China(Grant Nos.FRF-TP-18-001C2 and FRF-MP-20-40)。
文摘Achieving high performances of high thermal conductivity and low thermal expansion remains a great challenge. In this study,we have designed and synthesized the ScF_(3)@Cu core-shell composites through a general electroless plating method to coat Cu on the surface of negative thermal expansion particles of ScF_(3). A spatially continuous copper network structure is formed in the present core-shell structure composites to achieve high thermal conductivity and low thermal expansion simultaneously, which is different from the conventional mixed composites. Notably, a high thermal conductivity(136.3 W m^(-1) K^(-1)) has been achieved in the ScF_(3)@Cu-40 core-shell composite with a low thermal expansion property(4.3×10^(-6) K^(-1)). The mechanism of thermal property and microstructure of the present core-shell composites are systematically studied based on different models. Our proposed approach in this study can be widely applicable to numerous advanced materials, which should simultaneously control thermal conductivity and thermal expansion properties.
