Amorphous indium-gallium-zinc-oxide （a-IGZO） thin-film transistor （TFT） backplane technology is the best candidate for flat panel displays （FPDs）. In this paper, a-IGZO TFT structures are described. The effects ...Amorphous indium-gallium-zinc-oxide （a-IGZO） thin-film transistor （TFT） backplane technology is the best candidate for flat panel displays （FPDs）. In this paper, a-IGZO TFT structures are described. The effects of etch parameters （rf power, dc-bias voltage and gas pressure） on the etch rate and etch profile are discussed. Three kinds of gas mixtures are compared in the dry etching process of a-IGZO thin films. Lastly, three problems are pointed out that need to be addressed in the dry etching process of a-IGZO TFTs.展开更多
In order to improve the light efficiency of the conventional GaN-based light-emitting diodes （LEDs）, the indium tin oxide （ITO） film is introduced as the current spreading layer and the light anti-reflecting layer...In order to improve the light efficiency of the conventional GaN-based light-emitting diodes （LEDs）, the indium tin oxide （ITO） film is introduced as the current spreading layer and the light anti-reflecting layer on the p-GaN surface. There is a big problem with the ITO thin film＇s corrosion during the electrode preparation. In this paper, at least, the edge of the ITO film was lateral corroded 3.5μm width, i.e. 6.43%-1/3 of ITO film＇s area. An optimized simple process, i.e. inductively couple plasma （ICP）, was introduced to solve this problem. The ICP process not only prevented the ITO film from lateral corrosion, but also improved the LED＇s light intensity and device performance. The edge of the ITO film by ICP dry etching is steep, and the areas of ITO film are whole. Compared with the chip by wet etching, the areas of light emission increase by 6.43% at least and the chip＇s lop values increase by 45.9% at most.展开更多
The dry etching characteristic of AlSbTe film was investigated by using a CF/Ar gas mixture.The experimental control parameters were gas flow rate into the chamber,CF/Ar ratio,the Oaddition,the chamber background pres...The dry etching characteristic of AlSbTe film was investigated by using a CF/Ar gas mixture.The experimental control parameters were gas flow rate into the chamber,CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power applied to the lower electrode.The total flow rate was 50 sccm and the behavior of etch rate of AlSbTe thin films was investigated as a function of the CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power.Then the parameters were optimized.The fast etch rate was up to 70.8 nm/min and a smooth surface was achieved using optimized etching parameters of CFconcentration of 4%,power of 300 W and pressure of 80 mTorr.展开更多
High power and high-slope efficiency 650nm band real-refractive-index ridge w aveguide AlGaInP laser diodes with compressive strained MQW active layer are for med by pure Ar ion beam etching process.Symmetric laser me...High power and high-slope efficiency 650nm band real-refractive-index ridge w aveguide AlGaInP laser diodes with compressive strained MQW active layer are for med by pure Ar ion beam etching process.Symmetric laser mesas with high perpendi cularity,which are impossible to obtain by traditional wet etching method due to the use of a 15°-misoriented substrate,are obtained by this dry etching metho d.Laser diodes with 4μm wide,600μm long and 10%/90% coat are fabricated.Th e typical threshold current of these devices is 46mA at room temperature,and a s table fundamental-mode operation over 40mW is obtained.Very high slope efficien cy of 1.4W/A at 10mW and 1.1W/A at 40mW are realized.展开更多
首次报道了HgCdTe微台面焦平面探测列阵成形工艺的干法刻蚀技术有关刻蚀形貌的一些研究结果.从HgCdTe外延材料的特点出发,详细分析了其干法刻蚀适用的RIE(reactive ion etching)设备和刻蚀原理.采用高等离子体密度、低腔体工作压力、高...首次报道了HgCdTe微台面焦平面探测列阵成形工艺的干法刻蚀技术有关刻蚀形貌的一些研究结果.从HgCdTe外延材料的特点出发,详细分析了其干法刻蚀适用的RIE(reactive ion etching)设备和刻蚀原理.采用高等离子体密度、低腔体工作压力、高均匀性和低刻蚀能量的ICP(inductively coupled plasma)增强型RIE技术,研究了不同的工艺气体配比、腔体工作压力、ICP源功率和RF源功率对HgCdTe材料刻蚀形貌的影响,并初步得到了一种稳定的、刻蚀表面清洁、光滑、图形轮廓良好、均匀性较好和刻蚀速率较高的干法刻蚀工艺.展开更多
文摘Amorphous indium-gallium-zinc-oxide （a-IGZO） thin-film transistor （TFT） backplane technology is the best candidate for flat panel displays （FPDs）. In this paper, a-IGZO TFT structures are described. The effects of etch parameters （rf power, dc-bias voltage and gas pressure） on the etch rate and etch profile are discussed. Three kinds of gas mixtures are compared in the dry etching process of a-IGZO thin films. Lastly, three problems are pointed out that need to be addressed in the dry etching process of a-IGZO TFTs.
文摘In order to improve the light efficiency of the conventional GaN-based light-emitting diodes （LEDs）, the indium tin oxide （ITO） film is introduced as the current spreading layer and the light anti-reflecting layer on the p-GaN surface. There is a big problem with the ITO thin film＇s corrosion during the electrode preparation. In this paper, at least, the edge of the ITO film was lateral corroded 3.5μm width, i.e. 6.43%-1/3 of ITO film＇s area. An optimized simple process, i.e. inductively couple plasma （ICP）, was introduced to solve this problem. The ICP process not only prevented the ITO film from lateral corrosion, but also improved the LED＇s light intensity and device performance. The edge of the ITO film by ICP dry etching is steep, and the areas of ITO film are whole. Compared with the chip by wet etching, the areas of light emission increase by 6.43% at least and the chip＇s lop values increase by 45.9% at most.
基金supported by National Key Basic Research Program of China(Nos.2010CB934300,2011CBA00607,2011CB932800)the National Integrated Circuit Research Program of China(No.2009ZX02023-003)+1 种基金the National Natural Science Foundation of China(Nos.60906004, 60906003,61006087,61076121)the Science and Technology Council of Shanghai,China(No.1052nm07000)
文摘The dry etching characteristic of AlSbTe film was investigated by using a CF/Ar gas mixture.The experimental control parameters were gas flow rate into the chamber,CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power applied to the lower electrode.The total flow rate was 50 sccm and the behavior of etch rate of AlSbTe thin films was investigated as a function of the CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power.Then the parameters were optimized.The fast etch rate was up to 70.8 nm/min and a smooth surface was achieved using optimized etching parameters of CFconcentration of 4%,power of 300 W and pressure of 80 mTorr.
文摘High power and high-slope efficiency 650nm band real-refractive-index ridge w aveguide AlGaInP laser diodes with compressive strained MQW active layer are for med by pure Ar ion beam etching process.Symmetric laser mesas with high perpendi cularity,which are impossible to obtain by traditional wet etching method due to the use of a 15°-misoriented substrate,are obtained by this dry etching metho d.Laser diodes with 4μm wide,600μm long and 10%/90% coat are fabricated.Th e typical threshold current of these devices is 46mA at room temperature,and a s table fundamental-mode operation over 40mW is obtained.Very high slope efficien cy of 1.4W/A at 10mW and 1.1W/A at 40mW are realized.
文摘首次报道了HgCdTe微台面焦平面探测列阵成形工艺的干法刻蚀技术有关刻蚀形貌的一些研究结果.从HgCdTe外延材料的特点出发,详细分析了其干法刻蚀适用的RIE(reactive ion etching)设备和刻蚀原理.采用高等离子体密度、低腔体工作压力、高均匀性和低刻蚀能量的ICP(inductively coupled plasma)增强型RIE技术,研究了不同的工艺气体配比、腔体工作压力、ICP源功率和RF源功率对HgCdTe材料刻蚀形貌的影响,并初步得到了一种稳定的、刻蚀表面清洁、光滑、图形轮廓良好、均匀性较好和刻蚀速率较高的干法刻蚀工艺.
