In power electronics applications,the selection of condition monitoring methods significantly affects both the precision and complexity of the junction temperature evaluation,which is essential for the reliability ass...In power electronics applications,the selection of condition monitoring methods significantly affects both the precision and complexity of the junction temperature evaluation,which is essential for the reliability assessment of power semiconductor devices.This study begins with a failure mechanism analysis of state-of-the-art power semiconductor devices.Junction temperature measurement methods can be categorized into three distinct approaches:thermal image-based,thermal model-based,and temperature-sensitive electrical parameter(TSEP)-based methods.Their respective advantages and disadvantages are comprehensively compared.Moreover,condition monitoring of the ON-state voltage drop is summarized and benchmarked.ON-state voltage and junction temperature measurements are experimentally demonstrated in a standard three-phase converter,which provides superior measurement accuracy and rapid dynamic response characteristics.Additionally,this investigation is extended to measurement methods for TSEP in wide-bandgap semiconductors.展开更多
Compared to Si devices,the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material.This paper proposes a practical SiC MO...Compared to Si devices,the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material.This paper proposes a practical SiC MOSFET junction temperature monitoring method based on the on-state voltage$\\boldsymbol{V}_{\\mathbf{ds}(\\mathbf{on})}$measurement.In Section II of the paper,the temperature sensitivity of the on-state voltage$\\boldsymbol{V}_{\\mathbf{ds}(\\mathbf{on})}$is characterized.The hardware of the measurement system is set up in Section III,which consists of an On-state Voltage Measurement Circuit(OVMC),the sampling and isolation circuit.Next,a calibration method based on the self-heating of the SiC MOSFET chip is presented in Section IV.In the final Section,the junction temperature is monitored synchronously according to the calibration results.The proposed method is applied to a Buck converter and verified by both an Infrared Radiation(IR)camera and a Finite Element Analysis(FEA)tool.展开更多
文摘In power electronics applications,the selection of condition monitoring methods significantly affects both the precision and complexity of the junction temperature evaluation,which is essential for the reliability assessment of power semiconductor devices.This study begins with a failure mechanism analysis of state-of-the-art power semiconductor devices.Junction temperature measurement methods can be categorized into three distinct approaches:thermal image-based,thermal model-based,and temperature-sensitive electrical parameter(TSEP)-based methods.Their respective advantages and disadvantages are comprehensively compared.Moreover,condition monitoring of the ON-state voltage drop is summarized and benchmarked.ON-state voltage and junction temperature measurements are experimentally demonstrated in a standard three-phase converter,which provides superior measurement accuracy and rapid dynamic response characteristics.Additionally,this investigation is extended to measurement methods for TSEP in wide-bandgap semiconductors.
基金supported by the National Key R&D Program of China(2016YFB0100600)the Key Program of Bureau of Frontier Sciences and Education,Chinese Academy of Sciences(QYZDBSSW-JSC044)。
文摘Compared to Si devices,the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material.This paper proposes a practical SiC MOSFET junction temperature monitoring method based on the on-state voltage$\\boldsymbol{V}_{\\mathbf{ds}(\\mathbf{on})}$measurement.In Section II of the paper,the temperature sensitivity of the on-state voltage$\\boldsymbol{V}_{\\mathbf{ds}(\\mathbf{on})}$is characterized.The hardware of the measurement system is set up in Section III,which consists of an On-state Voltage Measurement Circuit(OVMC),the sampling and isolation circuit.Next,a calibration method based on the self-heating of the SiC MOSFET chip is presented in Section IV.In the final Section,the junction temperature is monitored synchronously according to the calibration results.The proposed method is applied to a Buck converter and verified by both an Infrared Radiation(IR)camera and a Finite Element Analysis(FEA)tool.
