In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile-butadiene-styrene-polycarbonate(ABS-PC)copolymer and the electroless copper plating layer is relatively low.To solve the pr...In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile-butadiene-styrene-polycarbonate(ABS-PC)copolymer and the electroless copper plating layer is relatively low.To solve the problems of poor surface wettability and low surface roughness of the ABS-PC substrate,the N,N-dimethylformamide(DMF)-ethanol(C_(2)H_(5)OH)-water(H_(2)O)system was employed as the swelling system for the ABS-PC substrate.The effects of the DMF volume fraction in the swelling system and the swelling time on the swelling effect of ABS-PC at 35℃ were investigated.KMnO_(4)-H_(2)SO_(4)-H_(2)O system was used as the etching system for ABS-PC substrate under the conditions of the volume ratio of water to sulfuric acid of 1﹕2,with KMnO_(4) content of 30 g/L,etching temperature of 60℃,and etching time of 25 min.The results indicate that dense pores with uniform sized are formed on the surface of the ABS-PC substrate surface after swelling and etching treatments,accompanied by an increase in surface roughness when the swelling temperature is 35℃,the DMF volume fraction in the swelling system is 80%,and the swelling time is 5 min.Furthermore,the content of C element on the surface of the ABS-PC substrate decreased,while that of O element increased,and the surface hydrophilicity is enhanced,which is attributed to two hydrophilic groups,-C=O and-COOH,being generated on the ABS-PC substrate surface,significantly improving the wettability of the ABS-PC substrate surface.Under the combination effects of high surface roughness and strong surface hydrophilicity,the adhesion strength between the ABS-PC substrate surface and the electroless copper plating layer reached to 0.81 kN/m,meeting the adhesion strength requirement of 0.70 kN/m in the industrial production.展开更多
文摘In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile-butadiene-styrene-polycarbonate(ABS-PC)copolymer and the electroless copper plating layer is relatively low.To solve the problems of poor surface wettability and low surface roughness of the ABS-PC substrate,the N,N-dimethylformamide(DMF)-ethanol(C_(2)H_(5)OH)-water(H_(2)O)system was employed as the swelling system for the ABS-PC substrate.The effects of the DMF volume fraction in the swelling system and the swelling time on the swelling effect of ABS-PC at 35℃ were investigated.KMnO_(4)-H_(2)SO_(4)-H_(2)O system was used as the etching system for ABS-PC substrate under the conditions of the volume ratio of water to sulfuric acid of 1﹕2,with KMnO_(4) content of 30 g/L,etching temperature of 60℃,and etching time of 25 min.The results indicate that dense pores with uniform sized are formed on the surface of the ABS-PC substrate surface after swelling and etching treatments,accompanied by an increase in surface roughness when the swelling temperature is 35℃,the DMF volume fraction in the swelling system is 80%,and the swelling time is 5 min.Furthermore,the content of C element on the surface of the ABS-PC substrate decreased,while that of O element increased,and the surface hydrophilicity is enhanced,which is attributed to two hydrophilic groups,-C=O and-COOH,being generated on the ABS-PC substrate surface,significantly improving the wettability of the ABS-PC substrate surface.Under the combination effects of high surface roughness and strong surface hydrophilicity,the adhesion strength between the ABS-PC substrate surface and the electroless copper plating layer reached to 0.81 kN/m,meeting the adhesion strength requirement of 0.70 kN/m in the industrial production.
