A two-dimensional kinetic Monte-Carlo(KMC) method was used to approach the thickness distribution of large scale metallic sheet deposited by electron beam physical vapor deposition(EB-PVD) on rotating substrate. The K...A two-dimensional kinetic Monte-Carlo(KMC) method was used to approach the thickness distribution of large scale metallic sheet deposited by electron beam physical vapor deposition(EB-PVD) on rotating substrate. The KMC model involves incident atom attachment, adatom diffusion and adatom detachment. The effective deposition rate and effective incident angle along substrate radial were studied as influencing factors of sheet thickness distribution. The KMC simulation results indicate that incident angle is a very important factor to affect the sheet thickness distribution as well as theory deposition mass. The experiments results show that the KMC model can predict the thickness distribution of large scale sheet deposited by EB-PVD on rotating substrate.展开更多
真空直流断路器弧后介质恢复过程是决定其开断是否成功的重要物理过程,因而受到研究者的广泛关注。该文的主要目标是采用粒子模拟的方法研究真空断路器弧后金属蒸气击穿阶段的发展过程及影响因素,并基于粒子云网格(Particle in Cell)和...真空直流断路器弧后介质恢复过程是决定其开断是否成功的重要物理过程,因而受到研究者的广泛关注。该文的主要目标是采用粒子模拟的方法研究真空断路器弧后金属蒸气击穿阶段的发展过程及影响因素,并基于粒子云网格(Particle in Cell)和蒙特卡罗碰撞(Monte Carlo Collision)相结合的PIC-MCC方法,建立弧后金属蒸气击穿模型,对金属蒸气击穿的发展过程进行空间2维速度3维的仿真模拟,然后讨论触头表面温度、金属蒸气密度、触头开距、电压等重要因素对击穿的影响。模拟结果表明:在一定范围内,增大金属蒸气的密度,击穿发生的更迅速;触头温度越高,击穿更容易发生;暂态恢复电压峰值越高,击穿发生更快。另外,当场强不变时,对于较小开距,击穿反而不太容易发生,当开距较大时,击穿发生的时间几乎不受开距的影响。展开更多
文摘A two-dimensional kinetic Monte-Carlo(KMC) method was used to approach the thickness distribution of large scale metallic sheet deposited by electron beam physical vapor deposition(EB-PVD) on rotating substrate. The KMC model involves incident atom attachment, adatom diffusion and adatom detachment. The effective deposition rate and effective incident angle along substrate radial were studied as influencing factors of sheet thickness distribution. The KMC simulation results indicate that incident angle is a very important factor to affect the sheet thickness distribution as well as theory deposition mass. The experiments results show that the KMC model can predict the thickness distribution of large scale sheet deposited by EB-PVD on rotating substrate.
文摘真空直流断路器弧后介质恢复过程是决定其开断是否成功的重要物理过程,因而受到研究者的广泛关注。该文的主要目标是采用粒子模拟的方法研究真空断路器弧后金属蒸气击穿阶段的发展过程及影响因素,并基于粒子云网格(Particle in Cell)和蒙特卡罗碰撞(Monte Carlo Collision)相结合的PIC-MCC方法,建立弧后金属蒸气击穿模型,对金属蒸气击穿的发展过程进行空间2维速度3维的仿真模拟,然后讨论触头表面温度、金属蒸气密度、触头开距、电压等重要因素对击穿的影响。模拟结果表明:在一定范围内,增大金属蒸气的密度,击穿发生的更迅速;触头温度越高,击穿更容易发生;暂态恢复电压峰值越高,击穿发生更快。另外,当场强不变时,对于较小开距,击穿反而不太容易发生,当开距较大时,击穿发生的时间几乎不受开距的影响。
