The forward gated-diode R-G current method is used to monitor the F-N stressing-induced interface traps of NMOSFET/SOI.This simp le and accurate experiment method can directly give the interface trap density i nduced...The forward gated-diode R-G current method is used to monitor the F-N stressing-induced interface traps of NMOSFET/SOI.This simp le and accurate experiment method can directly give the interface trap density i nduced by F-N stressing effect for characterizing the device's reliability.For the measured NMOS/SOI device with a body structure,an expected power-law relati onship as Δ N it - t 0 4 between the pure F-N stressing-indu ced interface trap density and the accumulated stressing time is obtained.展开更多
Forward gated-diode Recombination-Generation(R-G) current method is applied to an NMOSFET/SOI to measure the stress-induced interface traps in this letter. This easy but accurate experimental method can directly give ...Forward gated-diode Recombination-Generation(R-G) current method is applied to an NMOSFET/SOI to measure the stress-induced interface traps in this letter. This easy but accurate experimental method can directly give stress-induced average interface traps for characterizing the device’s hot carrier characteristics. For the tested device, an expected power law relationship of △Nit-t0.787 between pure stress-induced interface traps and accumulated stressing time is obtained.展开更多
研究了重离子引起漏电退化损伤对1 200 V SiC MOSFET栅极可靠性的影响。结果表明,在Ta离子辐照下,V_(DS)在150 V至200 V时,器件漏电流由纳安增加至微安,通过微光显微镜(EMMI)发现损伤主要集中在器件的主结区。经过168 h的20 V栅压考核,...研究了重离子引起漏电退化损伤对1 200 V SiC MOSFET栅极可靠性的影响。结果表明,在Ta离子辐照下,V_(DS)在150 V至200 V时,器件漏电流由纳安增加至微安,通过微光显微镜(EMMI)发现损伤主要集中在器件的主结区。经过168 h的20 V栅压考核,漏电退化器件栅漏电由几微安升高至百微安,但最大跨导和转移特性均无明显变化。研究同时验证了在负栅压辐照条件下,器件栅极更易发生漏电。综上,本研究为SiC MOSFET辐照后栅极可靠性评估、抗辐照性能加固提出新的视角,对探讨天-地等效的重离子单粒子效应模拟实验方法具有一定参考意义。展开更多
文摘The forward gated-diode R-G current method is used to monitor the F-N stressing-induced interface traps of NMOSFET/SOI.This simp le and accurate experiment method can directly give the interface trap density i nduced by F-N stressing effect for characterizing the device's reliability.For the measured NMOS/SOI device with a body structure,an expected power-law relati onship as Δ N it - t 0 4 between the pure F-N stressing-indu ced interface trap density and the accumulated stressing time is obtained.
基金Sponsored by Motorola-Peking University Joint Project.Contract No.:MSPSDDLCHINA-0004
文摘Forward gated-diode Recombination-Generation(R-G) current method is applied to an NMOSFET/SOI to measure the stress-induced interface traps in this letter. This easy but accurate experimental method can directly give stress-induced average interface traps for characterizing the device’s hot carrier characteristics. For the tested device, an expected power law relationship of △Nit-t0.787 between pure stress-induced interface traps and accumulated stressing time is obtained.
文摘研究了重离子引起漏电退化损伤对1 200 V SiC MOSFET栅极可靠性的影响。结果表明,在Ta离子辐照下,V_(DS)在150 V至200 V时,器件漏电流由纳安增加至微安,通过微光显微镜(EMMI)发现损伤主要集中在器件的主结区。经过168 h的20 V栅压考核,漏电退化器件栅漏电由几微安升高至百微安,但最大跨导和转移特性均无明显变化。研究同时验证了在负栅压辐照条件下,器件栅极更易发生漏电。综上,本研究为SiC MOSFET辐照后栅极可靠性评估、抗辐照性能加固提出新的视角,对探讨天-地等效的重离子单粒子效应模拟实验方法具有一定参考意义。
