Integrating a heterogeneous structure can significantly enhance the strength-ductility synergy of composites.However,the relationship between hetero-deformation induced(HDI)strain hardening and dislocation activity ca...Integrating a heterogeneous structure can significantly enhance the strength-ductility synergy of composites.However,the relationship between hetero-deformation induced(HDI)strain hardening and dislocation activity caused by heterogeneous structures in the magnesium matrix composite remains unclear.In this study,a dual-heterogeneous TiC/AZ61 composite exhibits significantly improved plastic elongation(PEL)by nearly one time compared to uniform FG composite,meanwhile maintaining a high strength(UTS:417 MPa).This is because more severe deformation inhomogeneity in heterogeneous structure leads to more geometrically necessary dislocations(GNDs)accumulation and stronger HDI stress,resulting in higher HDI hardening compared to FG and CG composites.During the early stage of plastic deformation,the pile-up types of GND in the FG zone and CG zone are significantly different.GNDs tend to form substructures in the FG zone instead of the CG zone.They only accumulate at grain boundaries of the CG region,thereby leading to obviously increased back stress in the CG region.In the late deformation stage,the elevated HDI stress activates the new〈c+a〉dislocations in the CG region,resulting in dislocation entanglements and even the formation of substructures,further driving the high hardening in the heterogeneous composite.However,For CG composite,〈c+a〉dislocations are not activated even under large plastic strains,and only〈a〉dislocations pile up at grain boundaries and twin boundaries.Our work provides an in-depth understanding of dislocation variation and HDI hardening in heterogeneous magnesium-based composites.展开更多
随着AI模型计算、汽车电子智能化、电子产品智能化与微型化的发展进步,为满足印制电路板的接点间距缩小、接点数量提高、配线长度缩短等需求,都需要用到HDI(High Density Interconnector,高密度互联)技术。而HDI微盲埋孔印刷电路板的多...随着AI模型计算、汽车电子智能化、电子产品智能化与微型化的发展进步,为满足印制电路板的接点间距缩小、接点数量提高、配线长度缩短等需求,都需要用到HDI(High Density Interconnector,高密度互联)技术。而HDI微盲埋孔印刷电路板的多层互联,均通过化学镀铜与电镀填孔解决。通过对比测试,我司发现化学镀铜会影响到电镀填孔性能。本文将分析化学镀铜添加剂对电镀填孔的影响机理,并介绍一款可以实现环保、稳定,不妨碍化铜后直接电镀填孔需求的化学镀铜体系IC2。展开更多
0引言高密度互连(high density interconnector,HDI)板出现至今已30多年,在此期间HDI板市场不断扩大,技术也不断提升。HDI板制造工艺技术种类繁多,部分因不合时宜而被淘汰了,部分得到培育而成熟延续了。因此,了解一些HDI板制造技术演变...0引言高密度互连(high density interconnector,HDI)板出现至今已30多年,在此期间HDI板市场不断扩大,技术也不断提升。HDI板制造工艺技术种类繁多,部分因不合时宜而被淘汰了,部分得到培育而成熟延续了。因此,了解一些HDI板制造技术演变知识,会对掌握HDI板技术有所启示与帮助。展开更多
基金support from the National Natural Science Foundation of China(No:52061040)China Postdoctoral Science Foundation(No:2021M692512)+1 种基金Opening Project of Material Corrosion and Protection Key Laboratory of Sichuan Province(No:2023CL01)Open Projects of Key Laboratory of Advanced Technologies of Materials,Ministry of Education China,Southwest Jiaotong University(No:KLATM202003).
文摘Integrating a heterogeneous structure can significantly enhance the strength-ductility synergy of composites.However,the relationship between hetero-deformation induced(HDI)strain hardening and dislocation activity caused by heterogeneous structures in the magnesium matrix composite remains unclear.In this study,a dual-heterogeneous TiC/AZ61 composite exhibits significantly improved plastic elongation(PEL)by nearly one time compared to uniform FG composite,meanwhile maintaining a high strength(UTS:417 MPa).This is because more severe deformation inhomogeneity in heterogeneous structure leads to more geometrically necessary dislocations(GNDs)accumulation and stronger HDI stress,resulting in higher HDI hardening compared to FG and CG composites.During the early stage of plastic deformation,the pile-up types of GND in the FG zone and CG zone are significantly different.GNDs tend to form substructures in the FG zone instead of the CG zone.They only accumulate at grain boundaries of the CG region,thereby leading to obviously increased back stress in the CG region.In the late deformation stage,the elevated HDI stress activates the new〈c+a〉dislocations in the CG region,resulting in dislocation entanglements and even the formation of substructures,further driving the high hardening in the heterogeneous composite.However,For CG composite,〈c+a〉dislocations are not activated even under large plastic strains,and only〈a〉dislocations pile up at grain boundaries and twin boundaries.Our work provides an in-depth understanding of dislocation variation and HDI hardening in heterogeneous magnesium-based composites.
文摘随着AI模型计算、汽车电子智能化、电子产品智能化与微型化的发展进步,为满足印制电路板的接点间距缩小、接点数量提高、配线长度缩短等需求,都需要用到HDI(High Density Interconnector,高密度互联)技术。而HDI微盲埋孔印刷电路板的多层互联,均通过化学镀铜与电镀填孔解决。通过对比测试,我司发现化学镀铜会影响到电镀填孔性能。本文将分析化学镀铜添加剂对电镀填孔的影响机理,并介绍一款可以实现环保、稳定,不妨碍化铜后直接电镀填孔需求的化学镀铜体系IC2。
文摘0引言高密度互连(high density interconnector,HDI)板出现至今已30多年,在此期间HDI板市场不断扩大,技术也不断提升。HDI板制造工艺技术种类繁多,部分因不合时宜而被淘汰了,部分得到培育而成熟延续了。因此,了解一些HDI板制造技术演变知识,会对掌握HDI板技术有所启示与帮助。
