FIB-SEM(Focused Ion Beam-Scanning Electron Microscope)双束系统是集聚焦离子束和扫描电子显微镜与一体的系统,其最大的优势是可以实现离子束切割或微加工的同时用电子束实时观察的功能。主要介绍FIB-SEM双束系统在PCB及IC载板缺陷...FIB-SEM(Focused Ion Beam-Scanning Electron Microscope)双束系统是集聚焦离子束和扫描电子显微镜与一体的系统,其最大的优势是可以实现离子束切割或微加工的同时用电子束实时观察的功能。主要介绍FIB-SEM双束系统在PCB及IC载板缺陷检测中的常见应用,如盲孔孔底分析、杂物失效分析和晶体结构分析。展开更多
In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moir′e. Focused ion beam(FIB) milling is applied to fabricate micron moir′e gra...In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moir′e. Focused ion beam(FIB) milling is applied to fabricate micron moir′e gratings on the surfaces of constantan wires and the random phase shifting technique is used to process moir′e fringes. The virtual strain method is briefly introduced and used to calculate the real strain of specimens. In order to study the influence of a defect on the electrical failure of the constantan wire, experiments were conducted on two specimens, one with a crack, while the other one without any crack. By comparing the results, we found that the defect makes the critical beam current of electrical failure decrease. In addition, the specimens were subjected to compression after electrical failure, in agreement with the observed crack closure of the specimen. The successful results demonstrate that the moir′e method is effective to characterize the full-field deformation of constantan wires on the polymer membrane, and has a good potential for further application to the deformation measurement of thin films.展开更多
聚焦离子束连续切片扫描电镜(focused ion beam serial block face scanning electron microscopy,FIB-SEM)技术,目前已被广泛应用于小体积细胞或组织样品的三维重构,具有自动化程度高、Z轴分辨高等优点。本文从包埋块样品准备与处理、...聚焦离子束连续切片扫描电镜(focused ion beam serial block face scanning electron microscopy,FIB-SEM)技术,目前已被广泛应用于小体积细胞或组织样品的三维重构,具有自动化程度高、Z轴分辨高等优点。本文从包埋块样品准备与处理、样品区域选定、软件设置前准备、软件参数(离子束加工和电子束扫描)设置、软件运行与图像采集和图像处理等多个方面,详细介绍应用FIB-SEM技术对常温生物包埋块样品进行三维重构的流程和细节,并对某些关键性参数展开讨论。展开更多
文摘FIB-SEM(Focused Ion Beam-Scanning Electron Microscope)双束系统是集聚焦离子束和扫描电子显微镜与一体的系统,其最大的优势是可以实现离子束切割或微加工的同时用电子束实时观察的功能。主要介绍FIB-SEM双束系统在PCB及IC载板缺陷检测中的常见应用,如盲孔孔底分析、杂物失效分析和晶体结构分析。
基金Project supported by the National Natural Science Foundation of China(Nos.11232008,11227801 and 11302082)the Doctoral Program of University of Jinan(No.XBS1307)
文摘In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moir′e. Focused ion beam(FIB) milling is applied to fabricate micron moir′e gratings on the surfaces of constantan wires and the random phase shifting technique is used to process moir′e fringes. The virtual strain method is briefly introduced and used to calculate the real strain of specimens. In order to study the influence of a defect on the electrical failure of the constantan wire, experiments were conducted on two specimens, one with a crack, while the other one without any crack. By comparing the results, we found that the defect makes the critical beam current of electrical failure decrease. In addition, the specimens were subjected to compression after electrical failure, in agreement with the observed crack closure of the specimen. The successful results demonstrate that the moir′e method is effective to characterize the full-field deformation of constantan wires on the polymer membrane, and has a good potential for further application to the deformation measurement of thin films.
文摘聚焦离子束连续切片扫描电镜(focused ion beam serial block face scanning electron microscopy,FIB-SEM)技术,目前已被广泛应用于小体积细胞或组织样品的三维重构,具有自动化程度高、Z轴分辨高等优点。本文从包埋块样品准备与处理、样品区域选定、软件设置前准备、软件参数(离子束加工和电子束扫描)设置、软件运行与图像采集和图像处理等多个方面,详细介绍应用FIB-SEM技术对常温生物包埋块样品进行三维重构的流程和细节,并对某些关键性参数展开讨论。
