The AuSn20/Ni joints were prepared by the reflow soldering technology and then annealed at solid-state temperature to form diffusion couples.The interfacial reactions and the growth kinetics of the intermetallic compo...The AuSn20/Ni joints were prepared by the reflow soldering technology and then annealed at solid-state temperature to form diffusion couples.The interfacial reactions and the growth kinetics of the intermetallic compounds(IMC)at the AuSn20/Ni soldering interface were investigated by scanning electron microscopy(SEM)and electron probe microanalysis(EPMA).The results show that,the(Ni,Au)3Sn2phases are formed at the AuSn20/Ni interface after soldering at583K.The thickness l of the IMC layer monotonically increases with increasing annealing time t according to the relationship l=k(t/t0)n,where the exponent n is0.527,0.476and0.471for393,433and473K annealing,respectively.This indicates that the volume diffusion contributes to the growth of the IMC layer at the AuSn20/Ni interface at solid-sate temperature.The pre-exponential factor K0=1.23×10?7m2/s and the activation enthalpy QK=81.8kJ/mol are obtained from the results of the parabolic coefficient K by a least-squares method.展开更多
基金Project(JPPT-125-GH-039)supported by the Ministry of Science and Technology of ChinaProject(Z109021567)supported by Fundamental Research Funds for the Central Universities,China
文摘The AuSn20/Ni joints were prepared by the reflow soldering technology and then annealed at solid-state temperature to form diffusion couples.The interfacial reactions and the growth kinetics of the intermetallic compounds(IMC)at the AuSn20/Ni soldering interface were investigated by scanning electron microscopy(SEM)and electron probe microanalysis(EPMA).The results show that,the(Ni,Au)3Sn2phases are formed at the AuSn20/Ni interface after soldering at583K.The thickness l of the IMC layer monotonically increases with increasing annealing time t according to the relationship l=k(t/t0)n,where the exponent n is0.527,0.476and0.471for393,433and473K annealing,respectively.This indicates that the volume diffusion contributes to the growth of the IMC layer at the AuSn20/Ni interface at solid-sate temperature.The pre-exponential factor K0=1.23×10?7m2/s and the activation enthalpy QK=81.8kJ/mol are obtained from the results of the parabolic coefficient K by a least-squares method.
