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GaN As/InGaAs Superlattice Solar Cells with High N Content in the Barrier Grown by All Solid-State Molecular Beam Epitaxy
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作者 卢建娅 郑新和 +4 位作者 王乃明 陈曦) 李宝吉 陆书龙 杨辉 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第5期111-114,共4页
We demonstrate nearly i e V GaN0.03As0.97 /In0.09 Ga0.91As strain-compensated short-period superlattice solar cells by all solid-state molecular beam epitaxy. The optimal period thickness for the superlattice growth i... We demonstrate nearly i e V GaN0.03As0.97 /In0.09 Ga0.91As strain-compensated short-period superlattice solar cells by all solid-state molecular beam epitaxy. The optimal period thickness for the superlattice growth is achieved to realize high structural quality. Meanwhile, the annealing conditions are optimized to realize a pho- toluminescence (PL) at a low temperature. However, no PL signal is detected at room temperature, which could be reflected by a lower open-circuit voltage of the fabricated devices. The GaN0.03As0.97/In0.09Ga0.91As super- lattice solar cells show a reasonably-high short-circuit current density (Jsc) of over lOmA/cm2. Eurthermore, a concentration behavior is measured, which shows a linear relationship between Jsc and concentration ratios. The extrapolated ideality factor and saturated current density by the concentration action are in good agreement with that extracted by the dark case of the p-i-n diodes. 展开更多
关键词 ingaas GaN as/ingaas Superlattice Solar Cells with High N Content in the Barrier Grown by All Solid-State Molecular Beam Epitaxy
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An 88 nm gate-length In_(0.53)Ga_(0.47)As/In_(0.52)Al_(0.48)As InP-based HEMT with f_(max) of 201 GHz 被引量:1
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作者 钟英辉 王显泰 +4 位作者 苏永波 曹玉雄 金智 张玉明 刘新宇 《Journal of Semiconductors》 EI CAS CSCD 2012年第7期39-42,共4页
An 88 nm gate-length In0.53Ga0.47As/In0.52Alo.48As InP-based high electron mobility transistor (HEMT) was successfully fabricated with a gate width of 2× 50 μm and source-drain space of 2.4μm. The T-gate was ... An 88 nm gate-length In0.53Ga0.47As/In0.52Alo.48As InP-based high electron mobility transistor (HEMT) was successfully fabricated with a gate width of 2× 50 μm and source-drain space of 2.4μm. The T-gate was defined by electron beam lithography in a trilayer of PMMA/A1/UVIII. The exposure dose and the development time were optimized, and followed by an appropriate residual resist removal process. These devices also demonstrated excellent DC and RF characteristics: the extrinsic maximum transconductance, the full channel cur- rent, the threshold voltage, the current gain cutoff frequency and the maximum oscillation frequency of the HEMTs were 765 mS/mm, 591 mA/mm, -0.5 V, 150 GHz and 201 GHz, respectively. The HEMTs are promising for use in millimeter-wave integrated circuits. 展开更多
关键词 HEMT GATE-LENGTH gate recess INP InA1as/ingaas
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