This paper describes a 2D/3D vision chip with integrated sensing and processing capabilities.The 2D/3D vision chip architecture includes a 2D/3D image sensor and a programmable visual processor.In this architecture,we...This paper describes a 2D/3D vision chip with integrated sensing and processing capabilities.The 2D/3D vision chip architecture includes a 2D/3D image sensor and a programmable visual processor.In this architecture,we design a novel on-chip processing flow with die-to-die image transmission and low-latency fixed-point image processing.The vision chip achieves real-time end-to-end processing of convolutional neural networks(CNNs)and conventional image processing algo-rithms.Furthermore,an end-to-end 2D/3D vision system is built to exhibit the capacity of the vision chip.The vision system achieves real-timing applications under 2D and 3D scenes,such as human face detection(processing delay 10.2 ms)and depth map reconstruction(processing delay 4.1 ms).The frame rate of image acquisition,image process,and result display is larger than 30 fps.展开更多
Aiming to address the Unmanned Aerial Vehicle(UAV) formation collision avoidance problem in Three-Dimensional(3-D) low-altitude environments where dense various obstacles exist, a fluid-based path planning framework n...Aiming to address the Unmanned Aerial Vehicle(UAV) formation collision avoidance problem in Three-Dimensional(3-D) low-altitude environments where dense various obstacles exist, a fluid-based path planning framework named the Formation Interfered Fluid Dynamical System(FIFDS) with Moderate Evasive Maneuver Strategy(MEMS) is proposed in this study.First, the UAV formation collision avoidance problem including quantifiable performance indexes is formulated. Second, inspired by the phenomenon of fluids continuously flowing while bypassing objects, the FIFDS for multiple UAVs is presented, which contains a Parallel Streamline Tracking(PST) method for formation keeping and the traditional IFDS for collision avoidance. Third, to rationally balance flight safety and collision avoidance cost, MEMS is proposed to generate moderate evasive maneuvers that match up with collision risks. Comprehensively containing the time and distance safety information, the 3-D dynamic collision regions are modeled for collision prediction. Then, the moderate evasive maneuver principle is refined, which provides criterions of the maneuver amplitude and direction. On this basis, an analytical parameter mapping mechanism is designed to online optimize IFDS parameters. Finally, the performance of the proposed method is validated by comparative simulation results and real flight experiments using fixed-wing UAVs.展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
Nighttime navigation faces challenges from limited data and interference,especially when satellite signals are unavailable.Leveraging lunar polarized light,polarization navigation offers a promising solution for night...Nighttime navigation faces challenges from limited data and interference,especially when satellite signals are unavailable.Leveraging lunar polarized light,polarization navigation offers a promising solution for nighttime autonomous navigation.Current algorithms,however,are limited by the requirement for known horizontal attitudes,restricting applications.This study introduces an autonomous 3-D attitude determination method to overcome this limitation.Our approach utilizes the Angle of Polarization(AOP)at night to extract neutral points from the AOP pattern.This allows for the calculation of polarization meridian plane information for attitude determination.Subsequently,we present an optimized Polarization TRIAD(Pol-TRIAD)algorithm to acquire the 3-D attitude.The proposed method outperforms the existing approaches in outdoor experiments by achieving lower Root Mean Square Error(RMSE).For one baseline attitude,it improves pitch by 31.7%,roll by 21.7%,and yaw by 2.6%,while for the attitude with a larger tilt angle,the improvements are 64.4%,30.4%,and 9.1%,respectively.展开更多
Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabricati...Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter(mm)-wave communication system,attracting significant interest in three-dimension(3D) miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic(LTCC) technology,which is fully integrated in a system-in package(SIP) communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic(EM) interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material's dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.展开更多
基金supported in part by the National Key Research and Development Program of China(Grant No.2019YFB2204300)in part by the National Natural Science Foundation of China(Grant Nos.62334008 and 62274154)in part by the Key Program of National Natural Science Foundation of China(Grant No.62134004).
文摘This paper describes a 2D/3D vision chip with integrated sensing and processing capabilities.The 2D/3D vision chip architecture includes a 2D/3D image sensor and a programmable visual processor.In this architecture,we design a novel on-chip processing flow with die-to-die image transmission and low-latency fixed-point image processing.The vision chip achieves real-time end-to-end processing of convolutional neural networks(CNNs)and conventional image processing algo-rithms.Furthermore,an end-to-end 2D/3D vision system is built to exhibit the capacity of the vision chip.The vision system achieves real-timing applications under 2D and 3D scenes,such as human face detection(processing delay 10.2 ms)and depth map reconstruction(processing delay 4.1 ms).The frame rate of image acquisition,image process,and result display is larger than 30 fps.
基金supported in part by the National Natural Science Foundations of China(Nos.61175084,61673042 and 62203046)the China Postdoctoral Science Foundation(No.2022M713006).
文摘Aiming to address the Unmanned Aerial Vehicle(UAV) formation collision avoidance problem in Three-Dimensional(3-D) low-altitude environments where dense various obstacles exist, a fluid-based path planning framework named the Formation Interfered Fluid Dynamical System(FIFDS) with Moderate Evasive Maneuver Strategy(MEMS) is proposed in this study.First, the UAV formation collision avoidance problem including quantifiable performance indexes is formulated. Second, inspired by the phenomenon of fluids continuously flowing while bypassing objects, the FIFDS for multiple UAVs is presented, which contains a Parallel Streamline Tracking(PST) method for formation keeping and the traditional IFDS for collision avoidance. Third, to rationally balance flight safety and collision avoidance cost, MEMS is proposed to generate moderate evasive maneuvers that match up with collision risks. Comprehensively containing the time and distance safety information, the 3-D dynamic collision regions are modeled for collision prediction. Then, the moderate evasive maneuver principle is refined, which provides criterions of the maneuver amplitude and direction. On this basis, an analytical parameter mapping mechanism is designed to online optimize IFDS parameters. Finally, the performance of the proposed method is validated by comparative simulation results and real flight experiments using fixed-wing UAVs.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
基金supported in part by the National Key Research and Development Program of China(Nos.2020YFA0711200,2022YFB4701301)in part by the Defense Industrial Technology Development Program,China(No.JCKY2021601B016)+1 种基金in part by the Fundamental Research Funds for the Central Universities,China(No.YWF-23-JC-07)in part by the National Natural Science Foundation of China(No.62425302)。
文摘Nighttime navigation faces challenges from limited data and interference,especially when satellite signals are unavailable.Leveraging lunar polarized light,polarization navigation offers a promising solution for nighttime autonomous navigation.Current algorithms,however,are limited by the requirement for known horizontal attitudes,restricting applications.This study introduces an autonomous 3-D attitude determination method to overcome this limitation.Our approach utilizes the Angle of Polarization(AOP)at night to extract neutral points from the AOP pattern.This allows for the calculation of polarization meridian plane information for attitude determination.Subsequently,we present an optimized Polarization TRIAD(Pol-TRIAD)algorithm to acquire the 3-D attitude.The proposed method outperforms the existing approaches in outdoor experiments by achieving lower Root Mean Square Error(RMSE).For one baseline attitude,it improves pitch by 31.7%,roll by 21.7%,and yaw by 2.6%,while for the attitude with a larger tilt angle,the improvements are 64.4%,30.4%,and 9.1%,respectively.
基金supported by Research Fund for the Doctoral Program of Higher Education of China(Grant No.20060614021)Sichuan Provincial Fundamental Research of China(Grant No.2008JY0057),Fundamental Research Funds for the Central Universities of China(Grant No.ZYGX2009J091)
文摘Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter(mm)-wave communication system,attracting significant interest in three-dimension(3D) miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic(LTCC) technology,which is fully integrated in a system-in package(SIP) communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic(EM) interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material's dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.