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a-Si/c-Si heterojunction solar cells on SiSiC ceramic substrates
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作者 LI Xudong XU Ying CHE Xiaoqi 《Rare Metals》 SCIE EI CAS CSCD 2006年第z1期186-189,共4页
Silicon thin-film solar cells are considered to be one of the most promising cells in the future for their potential advantages, such as low cost, high efficiency, great stability, simple processing, and none-pollutio... Silicon thin-film solar cells are considered to be one of the most promising cells in the future for their potential advantages, such as low cost, high efficiency, great stability, simple processing, and none-pollution. In this paper, latest progress on poly-crystalline silicon solar cells on ceramic substrates achieved by our group was reported. Rapid thermal chemical vapor deposition (RTCVD) was used to deposited poly-crystalline silicon thin films, and the grains of as-grown film were enlarged by Zone-melting Recrystallization (ZMR). As a great change in cell′s structure, traditional diffused pn homojunction was replaced by a-Si/c-Si heterojunction, which lead is to distinct improvement in cell′s efficiency. A conversion efficiency of 3.42% has been achieved on 1 cm2 a-Si/c-Si heterojunction solar cell (Isc=16.93 mA, Voc=310.9 mV, FF=0.6493, AM=1.5 G, 24 ℃), while the cell with diffused homojunction only got an efficiency of 0.6%. It indicates that a-Si emitter formed at low temperature might be more suitable for thin film cell on ceramics. 展开更多
关键词 a-Si/c-Si heterojunction thin film solar cell ceramic substrate
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Interfacial Bonding Strength of TiN Film Coated on Si_3N_4 Ceramic Substrate
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作者 Dejun KONG Yongkang ZHANG +1 位作者 Zhigang CHEN Jinzhong LU 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2007年第4期487-490,共4页
The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope (SEM), and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction (XRD).T... The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope (SEM), and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction (XRD).The hardness of TiN film was measured, and bonding strength of TiN film coated on Si3N4 substrate was measured by scratching method. The formed mechanism of residual stress and the failure mechanism of the bonding interface in the film were analyzed, and the adhesion mechanism of TiN film was investigated preliminarily. The results show that residual stresses of TiN film are all behaved as compressive stress, and TiN film is represented smoothly with brittle fracture, which is closely bonded with Si3N4 substrate. TiN film has high hardness and bonding strength of about 500 MPa, which could satisfy usage requests of the surface of cutting Si3N4 ceramic. 展开更多
关键词 TiN film Bonding strength X-ray diffraction (XRD) Residual stress ceramic substrate
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Corrosion Resistance of Ceramic Coating on Steel Substrate
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作者 XU Qiuhong WANG Zhi SUN Xiang SHI Guopu 《China's Refractories》 CAS 2007年第4期28-31,共4页
Fe/Al2O3 ceramic coating was made by spraying and sol-gel. The corrosion resistance between Fe/Al2O3 ceramic coating and steel 45# was studied. By microscope and X-ray diffraction, the binding and the composition of ... Fe/Al2O3 ceramic coating was made by spraying and sol-gel. The corrosion resistance between Fe/Al2O3 ceramic coating and steel 45# was studied. By microscope and X-ray diffraction, the binding and the composition of the interface were also analyzed. The results showed that Fe/Al2O3 ceramic coating had dense struc- ture, less porosity and better binding with the substrate which was effective to prevent erosive liquor immersing into the inside of ceramic coating. Some substances that distributed homogeneously in Fe/Al2O3 ceramic coating, such as α-Al2O3, FeAlO3 and Fe3Al, could improve the corrosion resistance of this material. 展开更多
关键词 Fe/Al2O3 ceramic coating Steel substrate Corrosion resistance
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Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system
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作者 PARK Su-seong KIM Jae-min +1 位作者 CHUNG Won-jee SHIN O-chul 《Journal of Central South University》 SCIE EI CAS 2011年第3期726-730,共5页
The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes.As a result of testing performance verification of MLCC alignment syste... The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes.As a result of testing performance verification of MLCC alignment system,the average alignment rates are 95% for 3216 chip,88.5% for 2012 chip and 90.8% for 3818 chip.The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%.In other words,the developed MLCC alignment system has been upgraded to a great extent,compared with manual alignment.Based on the successfully developed MLCC alignment system,the optimal transfer conditions have been explored by using RSM.The simulations using ADAMS has been performed according to the cube model of CCD.By using MiniTAB,the model of response surface has been established based on the simulation results.The optimal conditions resulted from the response optimization tool of MiniTAB has been verified by being assigned to the prototype of MLCC alignment system. 展开更多
关键词 multi-layer ceramic capacitor (MLCC) alignment system response surface method (RSM) MiniTAB ADAMS
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Crystallization Kinetics of Nanophase Glass-Ceramics as Magnetic Disk Substrate
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作者 Shengyu JIANG Jiancheng ZHANG Feng GU Yue SHEN Hua WANG 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2006年第2期211-214,共4页
Glass-ceramics containing β-quartz as a main crystal phase based on the system of SiO2-Al2O3-Li2O-K2O-MgO-ZnO were investigated for the application to magnetic storage substrate for higher storage capacity. Parent gl... Glass-ceramics containing β-quartz as a main crystal phase based on the system of SiO2-Al2O3-Li2O-K2O-MgO-ZnO were investigated for the application to magnetic storage substrate for higher storage capacity. Parent glasses were prepared, then nucleated and crystallized at certain temperatures for 3-4 h. The crystallization kinetics of glass-ceramics was also studied. The grain size was estimated by Scherrer formula and image treatment of transmission electron microscopy (TEM). The results showed that the Avrami exponent was determined to be 3.88, the activation energy 189.3+7 k J/tool and the grain size 30-60 nm. A detailed microstructure of the glass-ceramics, including grain distribution and the morphology of nano-crystalline was characterized by TEM, X-ray diffraction (XRD), differential scanning calorimeter (DSC), differential thermal analysis (DTA). The relationship between microstructure and mechanical properties was also discussed. 展开更多
关键词 GLASS-ceramicS KINETICS Disk substrate
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Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules
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作者 Zenjebil Jouini Zarel Valdez-Nava David Malec 《Engineering(科研)》 2016年第9期561-571,共11页
High voltage power modules are used in numerous applications to build high power converters. Technically, these modules are made of different materials and among them, dielectric materials are organic and inorganic. O... High voltage power modules are used in numerous applications to build high power converters. Technically, these modules are made of different materials and among them, dielectric materials are organic and inorganic. Organic insulators (gels) are used to avoid corona discharges in the vicinity of connecting wires and high voltage dies (diodes and transistors) and to protect them from moisture and contaminants. Inorganic insulators (ceramic substrates) are used to insulate the high voltage which dies from the grounded elements and to transfer heat to the heat sink. Despite being used since the late 90s, there is a lack of fundamental knowledge about the electrical properties of these substrates. Consequently, manufacturers tend to assure the reliability by over sizing them. As there are no clear rules for how to do that, failures occur, leading to the converter shutdown. The aim of this study is to bring new information about the understanding of the dielectric strength of ceramic materials used in these modules. We have focused our work on the correlation between the mechanical and the dielectric properties of ceramics by using relevant experiments. We provide new information about the impact of existing cracks on the ceramic dielectric failure, according to the electromechanical breakdown model. Our conclusions bring crucial information about the precautions to be taken during manufacturing and implementation of these substrates in power modules to reduce the likelihood of the particular causes of failure. 展开更多
关键词 High Voltage Power Module ceramic substrate Dielectric Strength Electro-Mechanical Breakdown
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Investigation on plasma-sprayed ZrO_2 thermal barrier coating on nickel alloy substrate 被引量:2
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作者 卢安贤 常鹰 蔡小梅 《Journal of Central South University of Technology》 EI 2002年第4期225-228,共4页
The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY Y 2O 3 stabilized ZrO 2 transition layer and Y 2O 3 stabilized ZrO 2 ceramic layer are prepared on nickel alloy substrates using the plasma spray ... The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY Y 2O 3 stabilized ZrO 2 transition layer and Y 2O 3 stabilized ZrO 2 ceramic layer are prepared on nickel alloy substrates using the plasma spray technique. The relationship among the composition, structure and property of the coatings are investiga ted by means of optical microscope, scanning electronic microscope and the experiments of thermal shock resistance cycling and high temperature oxidation resistance. The results show that the structure design of introdu cing a transition layer between Ni alloy substrate and ZrO 2 ceramic coating guarantees the high quality and properties of the coatings; ZrO 2 coatings doped with a little SiO 2 possesses better thermal shock resistance and more excellent hot corrosion resistance as compared with ZrO 2 coating materials without SiO 2 ;the improvement in performance of ZrO 2 coating doped with SiO 2 is due to forming more dense coating structure by self closing effects of the flaws and pores in the ZrO 2 coatings. 展开更多
关键词 plasma spray Ni alloy substrate transition layer ZrO2 ceramic layer thermal barrier coating
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Influence of dopant concentration on the transparent and thermal properties of Nd_2O_3-doped alumina translucent ceramics
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作者 杨清华 姜本学 +5 位作者 陈水林 姜益光 张攀德 毛小建 张龙 王俊 《Journal of Rare Earths》 SCIE EI CAS CSCD 2017年第9期883-886,共4页
The transparent and thermal developments of high-purity Al_2O_3 doped with different levels of Nd_2O_3 were investigated. Dopant levels ranged from 500–1500 ppm(Nd/Al atomic ratio). The samples were characterized w... The transparent and thermal developments of high-purity Al_2O_3 doped with different levels of Nd_2O_3 were investigated. Dopant levels ranged from 500–1500 ppm(Nd/Al atomic ratio). The samples were characterized with X-ray diffraction(XRD), scanning electron microscopy(SEM), Raman spectroscopy, transmittance spectroscopy and specific heat measurement. Results revealed that with proper Nd doped, Nd^(3+) ions solid dissolved in Al_2O_3 lattice, resulting in small and uniform grain and high bonding vibration, which was beneficial to transparent and thermal properties. With 1000 ppm Nd doped, Al_2O_3 translucent ceramics showed a total transmittance of 89% and thermal conductivity of 41.7 W/m/K, indicating a potential application as substrate for effective heat dissipation and multi emitting surface in LEDs module. 展开更多
关键词 alumina translucent ceramics neodymium dopant thermal conductivity substrate LEDs rare earths
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铝瓷基底厚度变化对In-Ceram全瓷修复体颜色的影响 被引量:2
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作者 吴江 赵雯 +2 位作者 赵湘辉 沈丽娟 高勃 《实用口腔医学杂志》 CAS CSCD 北大核心 2008年第3期325-327,共3页
目的:探讨玻璃渗透铝瓷基底厚度变化对In—Ceram全瓷修复体颜色影响规律,为临床选色、配色提供实验依据。方法:分别制作不同厚度的铝瓷基底,并在此基础上烧结In-Ceram全瓷试件,采用标准D65光源,使用DataColorSF300型分光光度仪,... 目的:探讨玻璃渗透铝瓷基底厚度变化对In—Ceram全瓷修复体颜色影响规律,为临床选色、配色提供实验依据。方法:分别制作不同厚度的铝瓷基底,并在此基础上烧结In-Ceram全瓷试件,采用标准D65光源,使用DataColorSF300型分光光度仪,观测玻璃渗透铝瓷基底厚度变化对In-Ceram全瓷修复体的明度、色相、彩度的影响。结果:当不透明牙本质瓷和牙本质瓷厚度固定时,玻璃渗透铝瓷基底厚度的改变能引起颜色的变化。当铝瓷基底厚度在0.5~0.7mm时,符合临床比色要求,能够较好的提高修复体的颜色复现率。结论:通过对铝瓷基底厚度的调节,可以使In—Ceram全瓷修复体获得较理想的色泽,取得较好的修复效果。 展开更多
关键词 玻璃渗透铝瓷基底 In—ceram全瓷 颜色
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基于陶瓷基板的焊接润湿性及失效机理研究
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作者 陈柱 《电子与封装》 2026年第1期10-16,共7页
焊接过程中焊料会在焊盘表面润湿、流散,其润湿效果与焊料的表面张力、焊盘的表面状态以及焊接条件息息相关。若焊料润湿不良,将直接影响焊接面积、焊接强度,并最终降低焊接产品的可靠性。某陶瓷基板焊接时出现润湿不良现象,采用扫描电... 焊接过程中焊料会在焊盘表面润湿、流散,其润湿效果与焊料的表面张力、焊盘的表面状态以及焊接条件息息相关。若焊料润湿不良,将直接影响焊接面积、焊接强度,并最终降低焊接产品的可靠性。某陶瓷基板焊接时出现润湿不良现象,采用扫描电子显微镜和能谱仪分析了剪切断面的形貌和成分,对焊接界面进行了切片分析,发现润湿不良是焊盘镍层过薄所致,并提出了相应的预防措施。 展开更多
关键词 陶瓷基板 SAC305 润湿性 脆性断裂 金脆 失效分析
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一种基于HTCC工艺的高集成度微波前端系统级封装模块
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作者 钟伟 李智鹏 +2 位作者 李照荣 曾荣 吕俊材 《微波学报》 北大核心 2025年第6期28-35,共8页
针对微波前端功能密度提升需求,文中设计了一种基于高温共烧陶瓷(HTCC)多腔堆叠集成结构的小型化前端系统级封装SiP模块,实现了收发变频、本振产生、发射放大与调制、中频放大等功能的一体化高密度集成。在各腔中通过植入球栅阵列(BGA)... 针对微波前端功能密度提升需求,文中设计了一种基于高温共烧陶瓷(HTCC)多腔堆叠集成结构的小型化前端系统级封装SiP模块,实现了收发变频、本振产生、发射放大与调制、中频放大等功能的一体化高密度集成。在各腔中通过植入球栅阵列(BGA)实现HTCC基板的垂直堆叠,有效提升了集成密度,整体尺寸仅为45 mm×45 mm×10 mm。通过研究多级过渡垂直互连结构与模块内电磁耦合特性,实现了射频信号的低损耗互连传输与内部敏感单元间的高电磁隔离,同时热力有限元仿真结果表明该集成形式具备良好的散热与抗机械振动能力。通过试制获得该SiP样机,实测发射功率大于47.7 dBm,接收噪声系数小于3.5 dB,接收链路增益大于85 dB。该技术为微波前端的高密度、高可靠一体集成提供了一条技术途径。 展开更多
关键词 高温共烧陶瓷 微波前端 基板堆叠 系统级封装
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基于CCGA的射频传输特性分析
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作者 谢书珊 谭良辰 +2 位作者 阮文州 蔡晓波 李福勇 《现代雷达》 北大核心 2025年第5期59-62,共4页
应用球栅阵列类型管脚的陶瓷基封装基板系统级封装具有管脚数量多、应用兼容性好的特点,在数字电路、模拟电路、射频电路系统级封装中有广泛应用。随着集成系统功能的增加,陶瓷基封装基板系统级封装需要更大的尺寸和更多数量的球栅阵列... 应用球栅阵列类型管脚的陶瓷基封装基板系统级封装具有管脚数量多、应用兼容性好的特点,在数字电路、模拟电路、射频电路系统级封装中有广泛应用。随着集成系统功能的增加,陶瓷基封装基板系统级封装需要更大的尺寸和更多数量的球栅阵列管脚,引起陶瓷基封装基板和印制电路板之间因为不同材料间热膨胀系数不一致而导致的热失配随之增大,严重影响球栅阵列互联可靠性。应用铜柱栅格阵列类型管脚代替印制电路板是通过增加陶瓷基封装基板和印制电路板之间的距离,有效减小热失配对连接可靠性的影响。文中针对应用铜柱栅格阵列的射频系统级封装与印制电路板之间的连接,进行热载荷条件下的结构仿真和电性能仿真,并进行实验验证。仿真和实验结果显示,热应力集中在系统级封装几何结构边角位置的根部,文中设计的应用铜柱栅格阵列射频系统级封装,具备有效的抗热失配结构应力能力和优良的射频传输性能。 展开更多
关键词 铜柱栅格阵列 陶瓷基封装基板 系统级封装 热失配
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适合陶粒基质栽培的青菜品种筛选
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作者 孔令娟 李建勇 +3 位作者 张晓文 王齐旭 李大露 李一昕 《长江蔬菜》 2025年第22期37-40,共4页
为筛选出适合设施环境条件和陶粒基质栽培的冬季青菜品种,引进5个青菜品种开展品种比较试验。结果表明,超华盈春粗纤维含量相对较低,且生长速度最快,定植后35 d平均单株毛质量112.10 g,单株净质量100.07 g;金品冬春33株型美观,叶柄呈油... 为筛选出适合设施环境条件和陶粒基质栽培的冬季青菜品种,引进5个青菜品种开展品种比较试验。结果表明,超华盈春粗纤维含量相对较低,且生长速度最快,定植后35 d平均单株毛质量112.10 g,单株净质量100.07 g;金品冬春33株型美观,叶柄呈油绿色,商品性好,品质佳,且单株毛质量较大,这2个品种的综合性状优良,适合陶粒基质设施栽培。 展开更多
关键词 陶粒基质 青菜 品种
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面向高密度数字SiP应用的封装工艺研究 被引量:1
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作者 柴昭尔 卢会湘 +6 位作者 徐亚新 李攀峰 王杰 田玉 王康 韩威 尹学全 《电子与封装》 2025年第1期24-28,共5页
面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实... 面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实现了各芯片之间的高速互连。此外,利用无硅通孔转接板工艺完成了DDR芯片从引线键合到倒装的封装形式的重构,在保证传输距离的同时也保证了芯片封装尺寸的最小化。在35 mm×40 mm的封装尺寸内实现了一个具备数字信号处理功能的最小系统。所涉及到的技术为通用基础技术,可广泛应用于其他高密度封装产品中。 展开更多
关键词 陶瓷基板 多层薄膜 封装重构
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铜-铜键合制备多层陶瓷基板技术研究
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作者 雷振宇 陈浩 +2 位作者 翟禹光 王莎鸥 陈明祥 《电子与封装》 2025年第5期55-61,共7页
为了提高功率器件封装集成度,通过铜-铜热压键合的方式将直接镀铜(DPC)陶瓷基板进行垂直堆叠制备出一种新型多层陶瓷基板。利用电镀工艺对铜表面进行了处理,并探究了铜-铜热压键合的工艺条件。结果表明,在电流密度为2 A/dm^(2)(ASD)时,... 为了提高功率器件封装集成度,通过铜-铜热压键合的方式将直接镀铜(DPC)陶瓷基板进行垂直堆叠制备出一种新型多层陶瓷基板。利用电镀工艺对铜表面进行了处理,并探究了铜-铜热压键合的工艺条件。结果表明,在电流密度为2 A/dm^(2)(ASD)时,可制备出(111)高晶面取向的金属铜,其具有较低的表面粗糙度,有利于铜-铜热压键合。在250℃和24 MPa压力下,采用(111)高晶面电镀铜实现高强度键合(强度高达32.34 MPa),制备出含腔体结构的多层陶瓷基板,并具有较高可靠性。 展开更多
关键词 铜-铜键合 多层陶瓷基板 直接镀铜陶瓷基板 可靠性
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不同粒径磨粒对Si_(3)N_(4)陶瓷基板薄片双面研磨性能的影响
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作者 赵海龙 曹夏 +2 位作者 彭翔 余德平 刘进伟 《宜宾学院学报》 2025年第6期47-52,共6页
为了观察不同粒径的磨粒对Si_(3)N_(4)陶瓷基板薄片研磨加工性能的影响,根据实际生产过程中产生的数据,比较定制化240#、270#和300#粒径尺寸的碳化硼磨粒和碳化硅磨粒在铸铁磨盘上快速减薄Si_(3)N_(4)陶瓷基板薄片时的研磨效率、表面粗... 为了观察不同粒径的磨粒对Si_(3)N_(4)陶瓷基板薄片研磨加工性能的影响,根据实际生产过程中产生的数据,比较定制化240#、270#和300#粒径尺寸的碳化硼磨粒和碳化硅磨粒在铸铁磨盘上快速减薄Si_(3)N_(4)陶瓷基板薄片时的研磨效率、表面粗糙度、TTV值、良品率、磨粒寿命、抗折强度和BOW值.结果表明:在保证表面粗糙度、TTV值、抗折强度等指标的数据点全在规格线以内时,300#碳化硼磨粒的研磨效率最佳,300#碳化硅磨粒的表面质量最佳.为了提升产品加工效率,可以选择300#碳化硼作为磨粒;为了保证产品有更好的质量,可以选择300#碳化硅作为磨粒. 展开更多
关键词 Si_(3)N_(4)陶瓷基板薄片 研磨效率 表面粗糙度 良品率 TTV值 抗折强度 BOW值 磨粒寿命
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微波介质陶瓷的微带天线基板成型工艺研究进展
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作者 陆志鹏 郭宝林 +1 位作者 李海燕 姚庆 《陶瓷学报》 北大核心 2025年第6期1091-1110,共20页
微波介质陶瓷在雷达系统、无线通信等领域具有关键作用,这主要得益于其优异的介电常数、温度稳定性以及超低损耗角正切值等特性。凭借这些优势,微带天线陶瓷基板能够实现精准的电磁波传输。通过控制微观结构均匀性、尺寸精度制造工艺可... 微波介质陶瓷在雷达系统、无线通信等领域具有关键作用,这主要得益于其优异的介电常数、温度稳定性以及超低损耗角正切值等特性。凭借这些优势,微带天线陶瓷基板能够实现精准的电磁波传输。通过控制微观结构均匀性、尺寸精度制造工艺可显著提高其性能表现。此外,在缺陷最小化、规模化生产与成本效益之间的平衡问题,始终是业界亟待攻克的难题。本综述系统分析了五种关键成型方法,包括凝胶注模、流延成型、压制成型、挤出成型、增材制造,重点阐述了五种方法的基本技术机理、相对优势和适用范围,为微带天线基板的制备及优化提供了一定的参考。 展开更多
关键词 微带贴片天线基板 微波介质陶瓷 成型方法
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电动车IGBT模块用镀钛覆铝陶瓷基板的覆接与退火对其性能影响的研究
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作者 王兢 顾高源 +1 位作者 梁超 何锦华 《现代交通与冶金材料》 2025年第S1期240-243,248,共5页
本文采用AlN陶瓷烧结制成了直接敷铝陶瓷基板(DBA),并研究了退火对DBA性能的影响,烧结后的DBA分别在300、400、500℃进行退火处理,发现500℃退火处理后的样品中Ti扩散距离最远。当温度在500℃,退火时间≥4 h时,界面不再存在明显的Ti峰,... 本文采用AlN陶瓷烧结制成了直接敷铝陶瓷基板(DBA),并研究了退火对DBA性能的影响,烧结后的DBA分别在300、400、500℃进行退火处理,发现500℃退火处理后的样品中Ti扩散距离最远。当温度在500℃,退火时间≥4 h时,界面不再存在明显的Ti峰,且剥离强度最高,最高可达15.4 N/mm,耐冷热循环次数最高达到2600次,这可归因为Ti扩散完全固溶至Al中形成更均匀的界面组织与成分。 展开更多
关键词 陶瓷金属化 ALN陶瓷 直接敷铝基板 陶瓷基板
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漫话半导体先进封装技术中的新网版印刷(七)
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作者 熊祥玉 巢亚平 +1 位作者 陈港能 李蓉 《丝网印刷》 2025年第2期15-24,共10页
介绍AMB陶瓷基板的性能,由于其在IGBT中特别优异的特性而广受电子工业、微电子制造领域的青睐。网版印刷工艺的厚膜金属化技术,使厚膜与陶瓷基板的附着性强,达到先进封装技术要求。
关键词 陶瓷基板 网版印刷 厚膜技术
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氧化铍陶瓷流延成型工艺研究
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作者 尚华 王刚 李欢 《昆明学院学报》 2025年第3期35-42,共8页
氧化铍(BeO)陶瓷基板因具有高导热、高强度、高绝缘、低介质损耗以及良好的封装适应性,在微波、电真空、核工业、微电子与光电子等技术领域受到高度重视和广泛应用.由于BeO粉料价格昂贵且物理化学特性较为活泼,限制了BeO流延成型工艺的... 氧化铍(BeO)陶瓷基板因具有高导热、高强度、高绝缘、低介质损耗以及良好的封装适应性,在微波、电真空、核工业、微电子与光电子等技术领域受到高度重视和广泛应用.由于BeO粉料价格昂贵且物理化学特性较为活泼,限制了BeO流延成型工艺的发展,相关成型工艺的研究在国内几乎处于空白状态.采用成熟的BeO陶瓷商业粉料,重点研究了有机溶剂体系、分散剂、粘结剂对BeO流延浆料性能的影响,确定适合BeO流延成型的浆料配方体系及流延工艺.通过该工艺制备出的氧化铍陶瓷生带表面光滑,经烧结后基片热导率高于260 W/m·K,密度大于2.85 g/cm^(2),主要性能均满足国家商用氧化铍陶瓷材料标准,且具有批产制备3英寸以上基片能力,有望得到大规模推广使用. 展开更多
关键词 BeO粉料 BeO浆料 流延成型 BeO陶瓷基片
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