期刊文献+
共找到390篇文章
< 1 2 20 >
每页显示 20 50 100
a-Si/c-Si heterojunction solar cells on SiSiC ceramic substrates
1
作者 LI Xudong XU Ying CHE Xiaoqi 《Rare Metals》 SCIE EI CAS CSCD 2006年第z1期186-189,共4页
Silicon thin-film solar cells are considered to be one of the most promising cells in the future for their potential advantages, such as low cost, high efficiency, great stability, simple processing, and none-pollutio... Silicon thin-film solar cells are considered to be one of the most promising cells in the future for their potential advantages, such as low cost, high efficiency, great stability, simple processing, and none-pollution. In this paper, latest progress on poly-crystalline silicon solar cells on ceramic substrates achieved by our group was reported. Rapid thermal chemical vapor deposition (RTCVD) was used to deposited poly-crystalline silicon thin films, and the grains of as-grown film were enlarged by Zone-melting Recrystallization (ZMR). As a great change in cell′s structure, traditional diffused pn homojunction was replaced by a-Si/c-Si heterojunction, which lead is to distinct improvement in cell′s efficiency. A conversion efficiency of 3.42% has been achieved on 1 cm2 a-Si/c-Si heterojunction solar cell (Isc=16.93 mA, Voc=310.9 mV, FF=0.6493, AM=1.5 G, 24 ℃), while the cell with diffused homojunction only got an efficiency of 0.6%. It indicates that a-Si emitter formed at low temperature might be more suitable for thin film cell on ceramics. 展开更多
关键词 a-Si/c-Si heterojunction thin film solar cell ceramic substrate
在线阅读 下载PDF
Interfacial Bonding Strength of TiN Film Coated on Si_3N_4 Ceramic Substrate
2
作者 Dejun KONG Yongkang ZHANG +1 位作者 Zhigang CHEN Jinzhong LU 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2007年第4期487-490,共4页
The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope (SEM), and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction (XRD).T... The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope (SEM), and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction (XRD).The hardness of TiN film was measured, and bonding strength of TiN film coated on Si3N4 substrate was measured by scratching method. The formed mechanism of residual stress and the failure mechanism of the bonding interface in the film were analyzed, and the adhesion mechanism of TiN film was investigated preliminarily. The results show that residual stresses of TiN film are all behaved as compressive stress, and TiN film is represented smoothly with brittle fracture, which is closely bonded with Si3N4 substrate. TiN film has high hardness and bonding strength of about 500 MPa, which could satisfy usage requests of the surface of cutting Si3N4 ceramic. 展开更多
关键词 TiN film Bonding strength X-ray diffraction (XRD) Residual stress ceramic substrate
在线阅读 下载PDF
Corrosion Resistance of Ceramic Coating on Steel Substrate
3
作者 XU Qiuhong WANG Zhi SUN Xiang SHI Guopu 《China's Refractories》 CAS 2007年第4期28-31,共4页
Fe/Al2O3 ceramic coating was made by spraying and sol-gel. The corrosion resistance between Fe/Al2O3 ceramic coating and steel 45# was studied. By microscope and X-ray diffraction, the binding and the composition of ... Fe/Al2O3 ceramic coating was made by spraying and sol-gel. The corrosion resistance between Fe/Al2O3 ceramic coating and steel 45# was studied. By microscope and X-ray diffraction, the binding and the composition of the interface were also analyzed. The results showed that Fe/Al2O3 ceramic coating had dense struc- ture, less porosity and better binding with the substrate which was effective to prevent erosive liquor immersing into the inside of ceramic coating. Some substances that distributed homogeneously in Fe/Al2O3 ceramic coating, such as α-Al2O3, FeAlO3 and Fe3Al, could improve the corrosion resistance of this material. 展开更多
关键词 Fe/Al2O3 ceramic coating Steel substrate Corrosion resistance
在线阅读 下载PDF
Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system
4
作者 PARK Su-seong KIM Jae-min +1 位作者 CHUNG Won-jee SHIN O-chul 《Journal of Central South University》 SCIE EI CAS 2011年第3期726-730,共5页
The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes.As a result of testing performance verification of MLCC alignment syste... The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes.As a result of testing performance verification of MLCC alignment system,the average alignment rates are 95% for 3216 chip,88.5% for 2012 chip and 90.8% for 3818 chip.The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%.In other words,the developed MLCC alignment system has been upgraded to a great extent,compared with manual alignment.Based on the successfully developed MLCC alignment system,the optimal transfer conditions have been explored by using RSM.The simulations using ADAMS has been performed according to the cube model of CCD.By using MiniTAB,the model of response surface has been established based on the simulation results.The optimal conditions resulted from the response optimization tool of MiniTAB has been verified by being assigned to the prototype of MLCC alignment system. 展开更多
关键词 multi-layer ceramic capacitor (MLCC) alignment system response surface method (RSM) MiniTAB ADAMS
在线阅读 下载PDF
Crystallization Kinetics of Nanophase Glass-Ceramics as Magnetic Disk Substrate
5
作者 Shengyu JIANG Jiancheng ZHANG Feng GU Yue SHEN Hua WANG 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2006年第2期211-214,共4页
Glass-ceramics containing β-quartz as a main crystal phase based on the system of SiO2-Al2O3-Li2O-K2O-MgO-ZnO were investigated for the application to magnetic storage substrate for higher storage capacity. Parent gl... Glass-ceramics containing β-quartz as a main crystal phase based on the system of SiO2-Al2O3-Li2O-K2O-MgO-ZnO were investigated for the application to magnetic storage substrate for higher storage capacity. Parent glasses were prepared, then nucleated and crystallized at certain temperatures for 3-4 h. The crystallization kinetics of glass-ceramics was also studied. The grain size was estimated by Scherrer formula and image treatment of transmission electron microscopy (TEM). The results showed that the Avrami exponent was determined to be 3.88, the activation energy 189.3+7 k J/tool and the grain size 30-60 nm. A detailed microstructure of the glass-ceramics, including grain distribution and the morphology of nano-crystalline was characterized by TEM, X-ray diffraction (XRD), differential scanning calorimeter (DSC), differential thermal analysis (DTA). The relationship between microstructure and mechanical properties was also discussed. 展开更多
关键词 GLASS-ceramicS KINETICS Disk substrate
在线阅读 下载PDF
Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules
6
作者 Zenjebil Jouini Zarel Valdez-Nava David Malec 《Engineering(科研)》 2016年第9期561-571,共11页
High voltage power modules are used in numerous applications to build high power converters. Technically, these modules are made of different materials and among them, dielectric materials are organic and inorganic. O... High voltage power modules are used in numerous applications to build high power converters. Technically, these modules are made of different materials and among them, dielectric materials are organic and inorganic. Organic insulators (gels) are used to avoid corona discharges in the vicinity of connecting wires and high voltage dies (diodes and transistors) and to protect them from moisture and contaminants. Inorganic insulators (ceramic substrates) are used to insulate the high voltage which dies from the grounded elements and to transfer heat to the heat sink. Despite being used since the late 90s, there is a lack of fundamental knowledge about the electrical properties of these substrates. Consequently, manufacturers tend to assure the reliability by over sizing them. As there are no clear rules for how to do that, failures occur, leading to the converter shutdown. The aim of this study is to bring new information about the understanding of the dielectric strength of ceramic materials used in these modules. We have focused our work on the correlation between the mechanical and the dielectric properties of ceramics by using relevant experiments. We provide new information about the impact of existing cracks on the ceramic dielectric failure, according to the electromechanical breakdown model. Our conclusions bring crucial information about the precautions to be taken during manufacturing and implementation of these substrates in power modules to reduce the likelihood of the particular causes of failure. 展开更多
关键词 High Voltage Power Module ceramic substrate Dielectric Strength Electro-Mechanical Breakdown
在线阅读 下载PDF
Investigation on plasma-sprayed ZrO_2 thermal barrier coating on nickel alloy substrate 被引量:2
7
作者 卢安贤 常鹰 蔡小梅 《Journal of Central South University of Technology》 EI 2002年第4期225-228,共4页
The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY Y 2O 3 stabilized ZrO 2 transition layer and Y 2O 3 stabilized ZrO 2 ceramic layer are prepared on nickel alloy substrates using the plasma spray ... The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY Y 2O 3 stabilized ZrO 2 transition layer and Y 2O 3 stabilized ZrO 2 ceramic layer are prepared on nickel alloy substrates using the plasma spray technique. The relationship among the composition, structure and property of the coatings are investiga ted by means of optical microscope, scanning electronic microscope and the experiments of thermal shock resistance cycling and high temperature oxidation resistance. The results show that the structure design of introdu cing a transition layer between Ni alloy substrate and ZrO 2 ceramic coating guarantees the high quality and properties of the coatings; ZrO 2 coatings doped with a little SiO 2 possesses better thermal shock resistance and more excellent hot corrosion resistance as compared with ZrO 2 coating materials without SiO 2 ;the improvement in performance of ZrO 2 coating doped with SiO 2 is due to forming more dense coating structure by self closing effects of the flaws and pores in the ZrO 2 coatings. 展开更多
关键词 plasma spray Ni alloy substrate transition layer ZrO2 ceramic layer thermal barrier coating
在线阅读 下载PDF
Influence of dopant concentration on the transparent and thermal properties of Nd_2O_3-doped alumina translucent ceramics
8
作者 杨清华 姜本学 +5 位作者 陈水林 姜益光 张攀德 毛小建 张龙 王俊 《Journal of Rare Earths》 SCIE EI CAS CSCD 2017年第9期883-886,共4页
The transparent and thermal developments of high-purity Al_2O_3 doped with different levels of Nd_2O_3 were investigated. Dopant levels ranged from 500–1500 ppm(Nd/Al atomic ratio). The samples were characterized w... The transparent and thermal developments of high-purity Al_2O_3 doped with different levels of Nd_2O_3 were investigated. Dopant levels ranged from 500–1500 ppm(Nd/Al atomic ratio). The samples were characterized with X-ray diffraction(XRD), scanning electron microscopy(SEM), Raman spectroscopy, transmittance spectroscopy and specific heat measurement. Results revealed that with proper Nd doped, Nd^(3+) ions solid dissolved in Al_2O_3 lattice, resulting in small and uniform grain and high bonding vibration, which was beneficial to transparent and thermal properties. With 1000 ppm Nd doped, Al_2O_3 translucent ceramics showed a total transmittance of 89% and thermal conductivity of 41.7 W/m/K, indicating a potential application as substrate for effective heat dissipation and multi emitting surface in LEDs module. 展开更多
关键词 alumina translucent ceramics neodymium dopant thermal conductivity substrate LEDs rare earths
原文传递
基于CCGA的射频传输特性分析
9
作者 谢书珊 谭良辰 +2 位作者 阮文州 蔡晓波 李福勇 《现代雷达》 北大核心 2025年第5期59-62,共4页
应用球栅阵列类型管脚的陶瓷基封装基板系统级封装具有管脚数量多、应用兼容性好的特点,在数字电路、模拟电路、射频电路系统级封装中有广泛应用。随着集成系统功能的增加,陶瓷基封装基板系统级封装需要更大的尺寸和更多数量的球栅阵列... 应用球栅阵列类型管脚的陶瓷基封装基板系统级封装具有管脚数量多、应用兼容性好的特点,在数字电路、模拟电路、射频电路系统级封装中有广泛应用。随着集成系统功能的增加,陶瓷基封装基板系统级封装需要更大的尺寸和更多数量的球栅阵列管脚,引起陶瓷基封装基板和印制电路板之间因为不同材料间热膨胀系数不一致而导致的热失配随之增大,严重影响球栅阵列互联可靠性。应用铜柱栅格阵列类型管脚代替印制电路板是通过增加陶瓷基封装基板和印制电路板之间的距离,有效减小热失配对连接可靠性的影响。文中针对应用铜柱栅格阵列的射频系统级封装与印制电路板之间的连接,进行热载荷条件下的结构仿真和电性能仿真,并进行实验验证。仿真和实验结果显示,热应力集中在系统级封装几何结构边角位置的根部,文中设计的应用铜柱栅格阵列射频系统级封装,具备有效的抗热失配结构应力能力和优良的射频传输性能。 展开更多
关键词 铜柱栅格阵列 陶瓷基封装基板 系统级封装 热失配
原文传递
适合陶粒基质栽培的青菜品种筛选
10
作者 孔令娟 李建勇 +3 位作者 张晓文 王齐旭 李大露 李一昕 《长江蔬菜》 2025年第22期37-40,共4页
为筛选出适合设施环境条件和陶粒基质栽培的冬季青菜品种,引进5个青菜品种开展品种比较试验。结果表明,超华盈春粗纤维含量相对较低,且生长速度最快,定植后35 d平均单株毛质量112.10 g,单株净质量100.07 g;金品冬春33株型美观,叶柄呈油... 为筛选出适合设施环境条件和陶粒基质栽培的冬季青菜品种,引进5个青菜品种开展品种比较试验。结果表明,超华盈春粗纤维含量相对较低,且生长速度最快,定植后35 d平均单株毛质量112.10 g,单株净质量100.07 g;金品冬春33株型美观,叶柄呈油绿色,商品性好,品质佳,且单株毛质量较大,这2个品种的综合性状优良,适合陶粒基质设施栽培。 展开更多
关键词 陶粒基质 青菜 品种
在线阅读 下载PDF
面向高密度数字SiP应用的封装工艺研究 被引量:1
11
作者 柴昭尔 卢会湘 +6 位作者 徐亚新 李攀峰 王杰 田玉 王康 韩威 尹学全 《电子与封装》 2025年第1期24-28,共5页
面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实... 面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实现了各芯片之间的高速互连。此外,利用无硅通孔转接板工艺完成了DDR芯片从引线键合到倒装的封装形式的重构,在保证传输距离的同时也保证了芯片封装尺寸的最小化。在35 mm×40 mm的封装尺寸内实现了一个具备数字信号处理功能的最小系统。所涉及到的技术为通用基础技术,可广泛应用于其他高密度封装产品中。 展开更多
关键词 陶瓷基板 多层薄膜 封装重构
在线阅读 下载PDF
铝瓷基底厚度变化对In-Ceram全瓷修复体颜色的影响 被引量:2
12
作者 吴江 赵雯 +2 位作者 赵湘辉 沈丽娟 高勃 《实用口腔医学杂志》 CAS CSCD 北大核心 2008年第3期325-327,共3页
目的:探讨玻璃渗透铝瓷基底厚度变化对In—Ceram全瓷修复体颜色影响规律,为临床选色、配色提供实验依据。方法:分别制作不同厚度的铝瓷基底,并在此基础上烧结In-Ceram全瓷试件,采用标准D65光源,使用DataColorSF300型分光光度仪,... 目的:探讨玻璃渗透铝瓷基底厚度变化对In—Ceram全瓷修复体颜色影响规律,为临床选色、配色提供实验依据。方法:分别制作不同厚度的铝瓷基底,并在此基础上烧结In-Ceram全瓷试件,采用标准D65光源,使用DataColorSF300型分光光度仪,观测玻璃渗透铝瓷基底厚度变化对In-Ceram全瓷修复体的明度、色相、彩度的影响。结果:当不透明牙本质瓷和牙本质瓷厚度固定时,玻璃渗透铝瓷基底厚度的改变能引起颜色的变化。当铝瓷基底厚度在0.5~0.7mm时,符合临床比色要求,能够较好的提高修复体的颜色复现率。结论:通过对铝瓷基底厚度的调节,可以使In—Ceram全瓷修复体获得较理想的色泽,取得较好的修复效果。 展开更多
关键词 玻璃渗透铝瓷基底 In—ceram全瓷 颜色
暂未订购
铜-铜键合制备多层陶瓷基板技术研究
13
作者 雷振宇 陈浩 +2 位作者 翟禹光 王莎鸥 陈明祥 《电子与封装》 2025年第5期55-61,共7页
为了提高功率器件封装集成度,通过铜-铜热压键合的方式将直接镀铜(DPC)陶瓷基板进行垂直堆叠制备出一种新型多层陶瓷基板。利用电镀工艺对铜表面进行了处理,并探究了铜-铜热压键合的工艺条件。结果表明,在电流密度为2 A/dm^(2)(ASD)时,... 为了提高功率器件封装集成度,通过铜-铜热压键合的方式将直接镀铜(DPC)陶瓷基板进行垂直堆叠制备出一种新型多层陶瓷基板。利用电镀工艺对铜表面进行了处理,并探究了铜-铜热压键合的工艺条件。结果表明,在电流密度为2 A/dm^(2)(ASD)时,可制备出(111)高晶面取向的金属铜,其具有较低的表面粗糙度,有利于铜-铜热压键合。在250℃和24 MPa压力下,采用(111)高晶面电镀铜实现高强度键合(强度高达32.34 MPa),制备出含腔体结构的多层陶瓷基板,并具有较高可靠性。 展开更多
关键词 铜-铜键合 多层陶瓷基板 直接镀铜陶瓷基板 可靠性
在线阅读 下载PDF
不同粒径磨粒对Si_(3)N_(4)陶瓷基板薄片双面研磨性能的影响
14
作者 赵海龙 曹夏 +2 位作者 彭翔 余德平 刘进伟 《宜宾学院学报》 2025年第6期47-52,共6页
为了观察不同粒径的磨粒对Si_(3)N_(4)陶瓷基板薄片研磨加工性能的影响,根据实际生产过程中产生的数据,比较定制化240#、270#和300#粒径尺寸的碳化硼磨粒和碳化硅磨粒在铸铁磨盘上快速减薄Si_(3)N_(4)陶瓷基板薄片时的研磨效率、表面粗... 为了观察不同粒径的磨粒对Si_(3)N_(4)陶瓷基板薄片研磨加工性能的影响,根据实际生产过程中产生的数据,比较定制化240#、270#和300#粒径尺寸的碳化硼磨粒和碳化硅磨粒在铸铁磨盘上快速减薄Si_(3)N_(4)陶瓷基板薄片时的研磨效率、表面粗糙度、TTV值、良品率、磨粒寿命、抗折强度和BOW值.结果表明:在保证表面粗糙度、TTV值、抗折强度等指标的数据点全在规格线以内时,300#碳化硼磨粒的研磨效率最佳,300#碳化硅磨粒的表面质量最佳.为了提升产品加工效率,可以选择300#碳化硼作为磨粒;为了保证产品有更好的质量,可以选择300#碳化硅作为磨粒. 展开更多
关键词 Si_(3)N_(4)陶瓷基板薄片 研磨效率 表面粗糙度 良品率 TTV值 抗折强度 BOW值 磨粒寿命
在线阅读 下载PDF
电动车IGBT模块用镀钛覆铝陶瓷基板的覆接与退火对其性能影响的研究
15
作者 王兢 顾高源 +1 位作者 梁超 何锦华 《现代交通与冶金材料》 2025年第S1期240-243,248,共5页
本文采用AlN陶瓷烧结制成了直接敷铝陶瓷基板(DBA),并研究了退火对DBA性能的影响,烧结后的DBA分别在300、400、500℃进行退火处理,发现500℃退火处理后的样品中Ti扩散距离最远。当温度在500℃,退火时间≥4 h时,界面不再存在明显的Ti峰,... 本文采用AlN陶瓷烧结制成了直接敷铝陶瓷基板(DBA),并研究了退火对DBA性能的影响,烧结后的DBA分别在300、400、500℃进行退火处理,发现500℃退火处理后的样品中Ti扩散距离最远。当温度在500℃,退火时间≥4 h时,界面不再存在明显的Ti峰,且剥离强度最高,最高可达15.4 N/mm,耐冷热循环次数最高达到2600次,这可归因为Ti扩散完全固溶至Al中形成更均匀的界面组织与成分。 展开更多
关键词 陶瓷金属化 ALN陶瓷 直接敷铝基板 陶瓷基板
在线阅读 下载PDF
漫话半导体先进封装技术中的新网版印刷(七)
16
作者 熊祥玉 巢亚平 +1 位作者 陈港能 李蓉 《丝网印刷》 2025年第2期15-24,共10页
介绍AMB陶瓷基板的性能,由于其在IGBT中特别优异的特性而广受电子工业、微电子制造领域的青睐。网版印刷工艺的厚膜金属化技术,使厚膜与陶瓷基板的附着性强,达到先进封装技术要求。
关键词 陶瓷基板 网版印刷 厚膜技术
在线阅读 下载PDF
氧化铍陶瓷流延成型工艺研究
17
作者 尚华 王刚 李欢 《昆明学院学报》 2025年第3期35-42,共8页
氧化铍(BeO)陶瓷基板因具有高导热、高强度、高绝缘、低介质损耗以及良好的封装适应性,在微波、电真空、核工业、微电子与光电子等技术领域受到高度重视和广泛应用.由于BeO粉料价格昂贵且物理化学特性较为活泼,限制了BeO流延成型工艺的... 氧化铍(BeO)陶瓷基板因具有高导热、高强度、高绝缘、低介质损耗以及良好的封装适应性,在微波、电真空、核工业、微电子与光电子等技术领域受到高度重视和广泛应用.由于BeO粉料价格昂贵且物理化学特性较为活泼,限制了BeO流延成型工艺的发展,相关成型工艺的研究在国内几乎处于空白状态.采用成熟的BeO陶瓷商业粉料,重点研究了有机溶剂体系、分散剂、粘结剂对BeO流延浆料性能的影响,确定适合BeO流延成型的浆料配方体系及流延工艺.通过该工艺制备出的氧化铍陶瓷生带表面光滑,经烧结后基片热导率高于260 W/m·K,密度大于2.85 g/cm^(2),主要性能均满足国家商用氧化铍陶瓷材料标准,且具有批产制备3英寸以上基片能力,有望得到大规模推广使用. 展开更多
关键词 BeO粉料 BeO浆料 流延成型 BeO陶瓷基片
在线阅读 下载PDF
应用于高清摄像头模组的陶瓷基刚挠结合板工艺研究
18
作者 张长明 王强 +2 位作者 罗春华 黄建国 徐缓 《印制电路信息》 2025年第S1期236-244,共9页
随着科技的发展,空中摄影技术渐兴,无人机航拍广泛应用于测量测绘、实景三维、数字城市、智慧水利、能源监测、环境监测以及应急救援等领域。本文针对航拍无人机高清摄像头模组的高清晰度、高散热、高效采集数据、高速传输需求,研究了... 随着科技的发展,空中摄影技术渐兴,无人机航拍广泛应用于测量测绘、实景三维、数字城市、智慧水利、能源监测、环境监测以及应急救援等领域。本文针对航拍无人机高清摄像头模组的高清晰度、高散热、高效采集数据、高速传输需求,研究了高密度刚挠结合板、陶瓷基片加工等技术;开发了60μm厚度的PP局部开盖技术、氮化铝陶瓷局部金属化工艺、0.3 mm深度的热沉焊盘技术,实现了氮化铝散热高清摄像头模组的高密度刚挠结合板的开发与应用。 展开更多
关键词 氮化铝陶瓷基片 刚挠结合板 局部开盖 热沉焊盘
在线阅读 下载PDF
IPM模块散热片变色研究
19
作者 龚平 陈莉 +1 位作者 顾振宇 潘效飞 《电子与封装》 2025年第2期30-33,共4页
智能功率模块(IPM)封装往往采用散热片外露的形式以提高其与外部环境的热交换效率。散热片通常是由具有高导热率的框架或者基板(如双面覆铜陶瓷基板)制成。由于陶瓷基板的结构特性,基板外露在塑封体外部一侧的铜层在镀锡过程中不会被锡... 智能功率模块(IPM)封装往往采用散热片外露的形式以提高其与外部环境的热交换效率。散热片通常是由具有高导热率的框架或者基板(如双面覆铜陶瓷基板)制成。由于陶瓷基板的结构特性,基板外露在塑封体外部一侧的铜层在镀锡过程中不会被锡层覆盖,因此会出现表面变色问题。对具有双面敷铜陶瓷基板的IPM模块的散热片变色现象展开分析,总结了变色的处理方法、预防措施以及各自的优缺点。研究结果表明,在封装工艺设计中,将处理与预防方法相结合,才能有效解决IPM封装中双面覆铜陶瓷基板散热片的变色问题。 展开更多
关键词 IPM封装 双面覆铜陶瓷基板 变色
在线阅读 下载PDF
不同金属基材及涂层组合对抗核辐射效果的实验研究
20
作者 郭放 姜明泽 +1 位作者 赵东 郑振东 《中华灾害救援医学》 2025年第2期125-130,共6页
目的评估不同金属基材与涂层组合对抗核辐射的效果,探讨无铅和少铅陶瓷涂层在核辐射防护中的应用潜力,为开发环保高效的核辐射防护材料提供科学依据。方法选择铝、铜、不锈钢和钛四种金属基材配合少铅、无铅、复合和纳米陶瓷涂层,使用... 目的评估不同金属基材与涂层组合对抗核辐射的效果,探讨无铅和少铅陶瓷涂层在核辐射防护中的应用潜力,为开发环保高效的核辐射防护材料提供科学依据。方法选择铝、铜、不锈钢和钛四种金属基材配合少铅、无铅、复合和纳米陶瓷涂层,使用喷涂法制备样品,并在80 kV、120 kV、160 kV X射线和137Csγ射线条件下分别测量不同材料的透射剂量率(I)和光子衰减率(μ),计算铅当量以评估屏蔽效果,并对数据进行Pearson相关分析判断数据之间的线性关系。结果在80 kV X射线条件下,在大多数样品中I与μ之间存在正相关性,铅当量与μ之间存在强正相关性。在120 kV X射线条件下,无铅陶瓷涂层样品B2和C2的I均较低,分别为520μSv/h和510μSv/h,而两者μ均较高,分别为0.70 mm^(-1)和0.72 mm^(-1),表明无铅陶瓷涂层样品的屏蔽性能较强,而少铅陶瓷涂层样品D1的I最高,达到710μSv/h,μ为0.35 mm^(-1),铅当量为0.23 mmPb,提示较差的衰减效果。在160 kV X射线条件下,所有样品的I普遍较高,相关系数集中在0.60到0.79之间,说明所有样品表现出较高的I和μ,且μ的增加直接影响I的增加。在137Csγ射线条件下,与X射线相比γ射线的I普遍较低,而μ普遍较高。无铅陶瓷涂层样品B2在137Csγ射线条件下的I为500μSv/h,μ为0.76 mm^(-1),铅当量为0.50 mmPb,表明其对γ射线有较强的衰减作用。相比之下,少铅陶瓷涂层样品D1的I为690μSv/h,μ为0.40 mm^(-1),铅当量为0.26 mmPb,显示对γ射线的透过性较好且衰减效果较弱。结论无铅陶瓷涂层在实验条件下表现出优越的辐射防护能力,尤其对高能X射线和γ射线的屏蔽效果优于传统少铅涂层。 展开更多
关键词 抗核辐射涂层 金属基材 陶瓷材料 核辐射防护
暂未订购
上一页 1 2 20 下一页 到第
使用帮助 返回顶部