Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the...Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (t_ gel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (T_g) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of T_g as a function of both time and temperature. Consequently, characteristic temperatures such as T_ g0, gelT_ g and T_ g∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.展开更多
Hydroxy-containing low molecular weight poly（2,6-dimethyl-1,4-phenylene oxide）（r PPO） and self-promoted hydroxycontaining phthalonitrile（HPPH） were prepared by redistribution reaction and the simple nucleophilic...Hydroxy-containing low molecular weight poly（2,6-dimethyl-1,4-phenylene oxide）（r PPO） and self-promoted hydroxycontaining phthalonitrile（HPPH） were prepared by redistribution reaction and the simple nucleophilic displacement of a nitro-substituent from 4-nitrophthalonitrile in a dipolar aprotic solvent respectively. The hydroxy-containing phthalonitriles modified by r PPO were prepared by mechanical blending without compatibilizer, followed by heating. The curing behavior was studied using dynamic rheological analysis, and the results showed that the r PPO-modified phthalonitrile exhibited a large processing window（over-67 °C） and complex viscosity（0.18-0.8 Pa·s） at moderate temperatures. After curing at 300 °C, the resulting polymers showed good thermal stability and high modulus as observed by thermogravimetric analysis（TGA） and dynamic mechanical analysis（DMA）. The dielectric properties and the morphology of r PPO-modified phthalonitrile networks were studied by dielectric analysis and field-emission scanning electron microscopy（SEM）.展开更多
To overcome reliance on molds and the difficulty of fabricating complex geometries with traditional C/C composites,direct ink writing(DIW)with UV/heat dual curing was employed to produce high-performance C/C composite...To overcome reliance on molds and the difficulty of fabricating complex geometries with traditional C/C composites,direct ink writing(DIW)with UV/heat dual curing was employed to produce high-performance C/C composites.The rheological properties of the composite inks were systematically analyzed to assess the effects of phenolic resin(PR)and carbon fiber(CF)content.Results show pronounced shear-thinning behavior and strong thixotropy-both essential for stable DIW.Additionally,UV/heat curing behavior was characterized to provide theoretical insights for optimizing curing parameters.Notably,CF addition is found to significantly attenuate UV light penetration compared to pure PR.As CF content increases,the critical UV irradiation energy rises sharply from 68.47 to 911.19 mJ/cm^(2),necessitating precise adjustments to curing parameters.Preforms were pyrolyzed in a carbon tube furnace to examine pore-formation characteristics,and chemical vapor infiltration(CVI)was applied to filling the resulting pores,yielding C/C composites with a flexural strength of 115.19 MPa.展开更多
The curing behavior of composites significantly influences their performance,making it crucial to understand the curing process.This study experimentally measured specific heat capacity,thermal conductivity,glass tran...The curing behavior of composites significantly influences their performance,making it crucial to understand the curing process.This study experimentally measured specific heat capacity,thermal conductivity,glass transition temperature,coefficient of thermal expansion,and cure shrinkage of materials.A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments.The effects of thickness,heating rate,and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.展开更多
The curing process of epoxy asphalt was analyzed by Fourier transform infrared （FT-IR） spectroscopy. Effect of curing temperature on viscosity of epoxy asphalt, and changes of mechanical properties with curing time ...The curing process of epoxy asphalt was analyzed by Fourier transform infrared （FT-IR） spectroscopy. Effect of curing temperature on viscosity of epoxy asphalt, and changes of mechanical properties with curing time were investigated. The evolution of concentration of epoxy band was followed as a function of the applied curing process.The experimental results indicate that the curing reaction rate of epoxy asphalt is invariable before 70 min at 120 ℃, and it decreases when curing time exceeds 70 min. The viscosity of epoxy asphalt increases slowly with curing time at initial curing stage. But it increases quickly after initial curing stage and the initial curing time decreases as the curing temperature increases, The tensile strength increases slowly at incipient curing stage and increases rapidly when curing time is form 20 min to 70 min. The elongation at break shows a decrease with curing time, but it exceeds 200% after cured.展开更多
Lignin is a natural biopolymer with a complex three-dimensional network, commercially obtained from wasteliquid of paper pulp and bioethanol production, and could be a candidate for preparation of environment-friendly...Lignin is a natural biopolymer with a complex three-dimensional network, commercially obtained from wasteliquid of paper pulp and bioethanol production, and could be a candidate for preparation of environment-friendlybio-based polyphenol material. In the present work, the demethylated wheat straw alkali lignin (D-Lig), preparedby demethylation of wheat straw alkali lignin (Lig) using an in-situ generated Lewis acid, was used to synthesizebio-based phenol formaldehyde resin adhesive (D-LPF) applied in plywood. Effects of synthetic process’s factors,including lignin substitution for phenol, NaOH concentration and molar ratio of formaldehyde to phenol, on thebonding strength and free formaldehyde content of D-LPF were investigated in detail, and the optimum syntheticprocess of D-LPF was obtained as following: Lignin substitution for phenol 60%, NaOH concentration 5.0% andmolar ratio of formaldehyde to phenol 2.0, and under the optimum reaction condition, the D-LPF presented lower free formaldehyde content (0.18%) and higher bonding strength (2.19 MPa), which was better than those ofcontaining-lignin phenol formaldehyde resin adhesive (LPF). Additionally, the curing behavior of the adhesivewas studied by differential scanning calorimetry (DSC) combined with gel time. It can be obtained that D-LPFresin adhesive had the shortest gel time, and fastest curing rate, compared with those of PF and L-PF resin adhesives. The curing kinetics data was fitted well by Kissinger model using non-isothermal DSC method, and theaverage activation energy value was 85.3 kJ/mol, slightly higher than that of commercial PF resin, while lowerthan that of LPF (90.2 kJ/mol). Finally, based on the analytical results of high temperature fourier transform infrared spectroscopy (FTIR), a possible curing mechanism of D-LPF was proposed.展开更多
The curing behavior of lignin-based phenol-formaldehyde (LPF) resin with different contents of nano-crystalline cellulose (NCC) was studied by differential scanning calorimetry (DSC) at different heating rates (5, 10 ...The curing behavior of lignin-based phenol-formaldehyde (LPF) resin with different contents of nano-crystalline cellulose (NCC) was studied by differential scanning calorimetry (DSC) at different heating rates (5, 10 and 20°C/min) and the bonding property was evaluated by the wet shear strength and wood failure of two-ply plywood panels after soaking in water (48 hours at room temperature and followed by 1-hour boiling). The test results indicated that the NCC content had little influence on the peak temperature, activation energy and the total heat of reaction of LPF resin at 5 and 10°C/min. But at 20°C/min, LPF0.00% (LPF resin without NCC) showed the highest total heat of reaction, while LPF0.25% (LPF resin containing 0.25% NCC content) and LPF0.50% (LPF resin containing 0.50% NCC content) gave the lowest value. The wet shear strength was affected by the NCC content to a certain extent. With regard to the results of one-way analysis of variance, the bonding quality could be improved by NCC and the optimum NCC content ranged from 0.25% to 0.50%. The wood failure was also affected by the NCC content, but the trend with respect to NCC content was not clear.展开更多
In order to improve the toughness of the cured aromatic tetrafunctional epoxy resins, a dlmer rarboxylic acid named dlmer fatty acid （DFA） was used to modify an aromatic tetrafunctional epoxy, N, N, N＇, N＇-tetragl...In order to improve the toughness of the cured aromatic tetrafunctional epoxy resins, a dlmer rarboxylic acid named dlmer fatty acid （DFA） was used to modify an aromatic tetrafunctional epoxy, N, N, N＇, N＇-tetraglycidyl-2,2-bis [ 4-（ 4-aminophcuoxy ） phenyl ] propane （TGBAPP）. The curing behaviors of DFA- TGBAPP/MNA （ methyl nadic anhydride） systems were studied by differential scanning calorimetry （DSC） method. And the thermal properties of the cured epoxy resin were investigated with the thermo-gravimetric analysis （TGA） and dynamic mechanical analysis （DMA）. Besides, the toughness was characterized with the impact strength tested by charpy impact testing. The results indicated that the modification would improve the curing reactions, and the curing temperatures were decreased with the increasing content of DFA. The thermal properties were not influenced obviously, and the toughness could be improved when the epoxy resin was modified with DFA.展开更多
文摘Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (t_ gel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (T_g) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of T_g as a function of both time and temperature. Consequently, characteristic temperatures such as T_ g0, gelT_ g and T_ g∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.
基金financially supported by the National Natural Science Foundation of China (Nos. 51203098 and 51173114)
文摘Hydroxy-containing low molecular weight poly（2,6-dimethyl-1,4-phenylene oxide）（r PPO） and self-promoted hydroxycontaining phthalonitrile（HPPH） were prepared by redistribution reaction and the simple nucleophilic displacement of a nitro-substituent from 4-nitrophthalonitrile in a dipolar aprotic solvent respectively. The hydroxy-containing phthalonitriles modified by r PPO were prepared by mechanical blending without compatibilizer, followed by heating. The curing behavior was studied using dynamic rheological analysis, and the results showed that the r PPO-modified phthalonitrile exhibited a large processing window（over-67 °C） and complex viscosity（0.18-0.8 Pa·s） at moderate temperatures. After curing at 300 °C, the resulting polymers showed good thermal stability and high modulus as observed by thermogravimetric analysis（TGA） and dynamic mechanical analysis（DMA）. The dielectric properties and the morphology of r PPO-modified phthalonitrile networks were studied by dielectric analysis and field-emission scanning electron microscopy（SEM）.
基金supported by State Key Laboratory of Powder Metallurgy,Central South University,Changsha,China.
文摘To overcome reliance on molds and the difficulty of fabricating complex geometries with traditional C/C composites,direct ink writing(DIW)with UV/heat dual curing was employed to produce high-performance C/C composites.The rheological properties of the composite inks were systematically analyzed to assess the effects of phenolic resin(PR)and carbon fiber(CF)content.Results show pronounced shear-thinning behavior and strong thixotropy-both essential for stable DIW.Additionally,UV/heat curing behavior was characterized to provide theoretical insights for optimizing curing parameters.Notably,CF addition is found to significantly attenuate UV light penetration compared to pure PR.As CF content increases,the critical UV irradiation energy rises sharply from 68.47 to 911.19 mJ/cm^(2),necessitating precise adjustments to curing parameters.Preforms were pyrolyzed in a carbon tube furnace to examine pore-formation characteristics,and chemical vapor infiltration(CVI)was applied to filling the resulting pores,yielding C/C composites with a flexural strength of 115.19 MPa.
基金supported by the National Natural Science Foundation of China(Grant Nos.12172045,U2241240,and 12221002)the National Program on Key Basic Research Project,China(Grant No.2019-JCJQ-ZD-308-00).
文摘The curing behavior of composites significantly influences their performance,making it crucial to understand the curing process.This study experimentally measured specific heat capacity,thermal conductivity,glass transition temperature,coefficient of thermal expansion,and cure shrinkage of materials.A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments.The effects of thickness,heating rate,and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.
文摘The curing process of epoxy asphalt was analyzed by Fourier transform infrared （FT-IR） spectroscopy. Effect of curing temperature on viscosity of epoxy asphalt, and changes of mechanical properties with curing time were investigated. The evolution of concentration of epoxy band was followed as a function of the applied curing process.The experimental results indicate that the curing reaction rate of epoxy asphalt is invariable before 70 min at 120 ℃, and it decreases when curing time exceeds 70 min. The viscosity of epoxy asphalt increases slowly with curing time at initial curing stage. But it increases quickly after initial curing stage and the initial curing time decreases as the curing temperature increases, The tensile strength increases slowly at incipient curing stage and increases rapidly when curing time is form 20 min to 70 min. The elongation at break shows a decrease with curing time, but it exceeds 200% after cured.
基金This work was supported by the National Natural Science Foundation of China(51473024)by University Science Research General Project of Jiangsu Province(16KJD430001)。
文摘Lignin is a natural biopolymer with a complex three-dimensional network, commercially obtained from wasteliquid of paper pulp and bioethanol production, and could be a candidate for preparation of environment-friendlybio-based polyphenol material. In the present work, the demethylated wheat straw alkali lignin (D-Lig), preparedby demethylation of wheat straw alkali lignin (Lig) using an in-situ generated Lewis acid, was used to synthesizebio-based phenol formaldehyde resin adhesive (D-LPF) applied in plywood. Effects of synthetic process’s factors,including lignin substitution for phenol, NaOH concentration and molar ratio of formaldehyde to phenol, on thebonding strength and free formaldehyde content of D-LPF were investigated in detail, and the optimum syntheticprocess of D-LPF was obtained as following: Lignin substitution for phenol 60%, NaOH concentration 5.0% andmolar ratio of formaldehyde to phenol 2.0, and under the optimum reaction condition, the D-LPF presented lower free formaldehyde content (0.18%) and higher bonding strength (2.19 MPa), which was better than those ofcontaining-lignin phenol formaldehyde resin adhesive (LPF). Additionally, the curing behavior of the adhesivewas studied by differential scanning calorimetry (DSC) combined with gel time. It can be obtained that D-LPFresin adhesive had the shortest gel time, and fastest curing rate, compared with those of PF and L-PF resin adhesives. The curing kinetics data was fitted well by Kissinger model using non-isothermal DSC method, and theaverage activation energy value was 85.3 kJ/mol, slightly higher than that of commercial PF resin, while lowerthan that of LPF (90.2 kJ/mol). Finally, based on the analytical results of high temperature fourier transform infrared spectroscopy (FTIR), a possible curing mechanism of D-LPF was proposed.
文摘The curing behavior of lignin-based phenol-formaldehyde (LPF) resin with different contents of nano-crystalline cellulose (NCC) was studied by differential scanning calorimetry (DSC) at different heating rates (5, 10 and 20°C/min) and the bonding property was evaluated by the wet shear strength and wood failure of two-ply plywood panels after soaking in water (48 hours at room temperature and followed by 1-hour boiling). The test results indicated that the NCC content had little influence on the peak temperature, activation energy and the total heat of reaction of LPF resin at 5 and 10°C/min. But at 20°C/min, LPF0.00% (LPF resin without NCC) showed the highest total heat of reaction, while LPF0.25% (LPF resin containing 0.25% NCC content) and LPF0.50% (LPF resin containing 0.50% NCC content) gave the lowest value. The wet shear strength was affected by the NCC content to a certain extent. With regard to the results of one-way analysis of variance, the bonding quality could be improved by NCC and the optimum NCC content ranged from 0.25% to 0.50%. The wood failure was also affected by the NCC content, but the trend with respect to NCC content was not clear.
基金Shanghai Leading Academic Discipline Project,China(No.s30107)the Program for Professor of Special Appointment(Eastern Scholar)at Shanghai Institutions of Higher Learning,Chinathe Project of Shanghai Science and Technology Committee,China(No.12520500300)
文摘In order to improve the toughness of the cured aromatic tetrafunctional epoxy resins, a dlmer rarboxylic acid named dlmer fatty acid （DFA） was used to modify an aromatic tetrafunctional epoxy, N, N, N＇, N＇-tetraglycidyl-2,2-bis [ 4-（ 4-aminophcuoxy ） phenyl ] propane （TGBAPP）. The curing behaviors of DFA- TGBAPP/MNA （ methyl nadic anhydride） systems were studied by differential scanning calorimetry （DSC） method. And the thermal properties of the cured epoxy resin were investigated with the thermo-gravimetric analysis （TGA） and dynamic mechanical analysis （DMA）. Besides, the toughness was characterized with the impact strength tested by charpy impact testing. The results indicated that the modification would improve the curing reactions, and the curing temperatures were decreased with the increasing content of DFA. The thermal properties were not influenced obviously, and the toughness could be improved when the epoxy resin was modified with DFA.
