摘要
Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (t_ gel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (T_g) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of T_g as a function of both time and temperature. Consequently, characteristic temperatures such as T_ g0, gelT_ g and T_ g∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.
Curing behavior of a model epoxies system （E-54/AG-80） with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time （tgel） and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature （Tg） and cure degree （a） was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0, gel Tg and Tg∞ were determined. Finally, the Time-Temperature-Transition （TTT） diagram was designed based on the data and equations.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2006年第5期57-62,共6页
Journal of Materials Engineering
