In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile-butadiene-styrene-polycarbonate(ABS-PC)copolymer and the electroless copper plating layer is relatively low.To solve the pr...In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile-butadiene-styrene-polycarbonate(ABS-PC)copolymer and the electroless copper plating layer is relatively low.To solve the problems of poor surface wettability and low surface roughness of the ABS-PC substrate,the N,N-dimethylformamide(DMF)-ethanol(C_(2)H_(5)OH)-water(H_(2)O)system was employed as the swelling system for the ABS-PC substrate.The effects of the DMF volume fraction in the swelling system and the swelling time on the swelling effect of ABS-PC at 35℃ were investigated.KMnO_(4)-H_(2)SO_(4)-H_(2)O system was used as the etching system for ABS-PC substrate under the conditions of the volume ratio of water to sulfuric acid of 1﹕2,with KMnO_(4) content of 30 g/L,etching temperature of 60℃,and etching time of 25 min.The results indicate that dense pores with uniform sized are formed on the surface of the ABS-PC substrate surface after swelling and etching treatments,accompanied by an increase in surface roughness when the swelling temperature is 35℃,the DMF volume fraction in the swelling system is 80%,and the swelling time is 5 min.Furthermore,the content of C element on the surface of the ABS-PC substrate decreased,while that of O element increased,and the surface hydrophilicity is enhanced,which is attributed to two hydrophilic groups,-C=O and-COOH,being generated on the ABS-PC substrate surface,significantly improving the wettability of the ABS-PC substrate surface.Under the combination effects of high surface roughness and strong surface hydrophilicity,the adhesion strength between the ABS-PC substrate surface and the electroless copper plating layer reached to 0.81 kN/m,meeting the adhesion strength requirement of 0.70 kN/m in the industrial production.展开更多
以废打印机壳PC/ABS再生粒子(R-PC/ABS)为基体材料,对苯二酚双(二苯基磷酸脂)(HDP)和梯形倍半硅氧烷(TSQ)为阻燃剂,采用熔融共混制备了无卤阻燃PC/ABS,对其阻燃性能、力学性能、尺寸稳定性和负荷热变形温度(HDT)进行分析,结果发现,TSQ...以废打印机壳PC/ABS再生粒子(R-PC/ABS)为基体材料,对苯二酚双(二苯基磷酸脂)(HDP)和梯形倍半硅氧烷(TSQ)为阻燃剂,采用熔融共混制备了无卤阻燃PC/ABS,对其阻燃性能、力学性能、尺寸稳定性和负荷热变形温度(HDT)进行分析,结果发现,TSQ可以阻燃R-PC/ABS,并且,对力学性能、尺寸稳定性和HDT影响较小,R-PC/ABS/0.8TSQ的LOI为29.8%,阻燃达到3.0 mm V-0和2.0 mm V-1级;HDP可以有效地阻燃R-PC/ABS,但是,对力学性能、尺寸稳定性和HDT的负面影响较大,R-PC/ABS/12HDP的LOI为36.1%,阻燃可达到UL 941.0 mm V-0级,与R-PC/ABS相比,HDT、拉伸强度、弯曲强度、弯曲模量和缺口冲击强度分别降低了20.2℃、26.6%、14.5%、16.9%和60.9%;R-PC/ABS/0.8TSQ/6HDP的LOI为35.7%,阻燃级别达到UL 941.0 mm V-0级,与R-PC/ABS/12HDP相比,模后收缩率(PMS)降低了19.7%,HDT、拉伸强度、弯曲强度、弯曲模量和缺口冲击强度分别提高了13℃、21.0%、11.3%、14.3%和85.9%。展开更多
文摘In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile-butadiene-styrene-polycarbonate(ABS-PC)copolymer and the electroless copper plating layer is relatively low.To solve the problems of poor surface wettability and low surface roughness of the ABS-PC substrate,the N,N-dimethylformamide(DMF)-ethanol(C_(2)H_(5)OH)-water(H_(2)O)system was employed as the swelling system for the ABS-PC substrate.The effects of the DMF volume fraction in the swelling system and the swelling time on the swelling effect of ABS-PC at 35℃ were investigated.KMnO_(4)-H_(2)SO_(4)-H_(2)O system was used as the etching system for ABS-PC substrate under the conditions of the volume ratio of water to sulfuric acid of 1﹕2,with KMnO_(4) content of 30 g/L,etching temperature of 60℃,and etching time of 25 min.The results indicate that dense pores with uniform sized are formed on the surface of the ABS-PC substrate surface after swelling and etching treatments,accompanied by an increase in surface roughness when the swelling temperature is 35℃,the DMF volume fraction in the swelling system is 80%,and the swelling time is 5 min.Furthermore,the content of C element on the surface of the ABS-PC substrate decreased,while that of O element increased,and the surface hydrophilicity is enhanced,which is attributed to two hydrophilic groups,-C=O and-COOH,being generated on the ABS-PC substrate surface,significantly improving the wettability of the ABS-PC substrate surface.Under the combination effects of high surface roughness and strong surface hydrophilicity,the adhesion strength between the ABS-PC substrate surface and the electroless copper plating layer reached to 0.81 kN/m,meeting the adhesion strength requirement of 0.70 kN/m in the industrial production.
文摘以废打印机壳PC/ABS再生粒子(R-PC/ABS)为基体材料,对苯二酚双(二苯基磷酸脂)(HDP)和梯形倍半硅氧烷(TSQ)为阻燃剂,采用熔融共混制备了无卤阻燃PC/ABS,对其阻燃性能、力学性能、尺寸稳定性和负荷热变形温度(HDT)进行分析,结果发现,TSQ可以阻燃R-PC/ABS,并且,对力学性能、尺寸稳定性和HDT影响较小,R-PC/ABS/0.8TSQ的LOI为29.8%,阻燃达到3.0 mm V-0和2.0 mm V-1级;HDP可以有效地阻燃R-PC/ABS,但是,对力学性能、尺寸稳定性和HDT的负面影响较大,R-PC/ABS/12HDP的LOI为36.1%,阻燃可达到UL 941.0 mm V-0级,与R-PC/ABS相比,HDT、拉伸强度、弯曲强度、弯曲模量和缺口冲击强度分别降低了20.2℃、26.6%、14.5%、16.9%和60.9%;R-PC/ABS/0.8TSQ/6HDP的LOI为35.7%,阻燃级别达到UL 941.0 mm V-0级,与R-PC/ABS/12HDP相比,模后收缩率(PMS)降低了19.7%,HDT、拉伸强度、弯曲强度、弯曲模量和缺口冲击强度分别提高了13℃、21.0%、11.3%、14.3%和85.9%。
