This article presents research focused on developing and scientifically substantiating a technology for producing environmentally friendly glued structures fromwood treated through a two-stage process.Themethodology i...This article presents research focused on developing and scientifically substantiating a technology for producing environmentally friendly glued structures fromwood treated through a two-stage process.Themethodology involves preliminary thermal modification followed by high-frequency low-temperature plasma treatment.Thermal modification enhances performance characteristics such as resistance to rot,lowers hygroscopicity,and increases dimensional stability.However,it can diminish the adhesive properties of wood,complicating the bonding process.To address this challenge,the study introduces high-frequency low-temperature plasma treatment,which activates the wood surface,improving wettability and adhesion while minimizing glue consumption.Experimental results indicate that plasma treatment reduces the contact angle by 46%and adhesive consumption during bonding by 24%,thereby enhancing the environmental friendliness of the glued structures.Furthermore,this dual treatment process increases the shear strength of adhesive joints by 22.7%and bending strength of glued beams by 66.6%,demonstrating a 30%lower carbon footprint compared to conventional methods.The findings affirm the efficacy of this technology in producing building materials,particularly glued beams for large-span structures.展开更多
基金funded by the Technostart competition,Agreement No.12-22(2-22)dated 01 February 2022.
文摘This article presents research focused on developing and scientifically substantiating a technology for producing environmentally friendly glued structures fromwood treated through a two-stage process.Themethodology involves preliminary thermal modification followed by high-frequency low-temperature plasma treatment.Thermal modification enhances performance characteristics such as resistance to rot,lowers hygroscopicity,and increases dimensional stability.However,it can diminish the adhesive properties of wood,complicating the bonding process.To address this challenge,the study introduces high-frequency low-temperature plasma treatment,which activates the wood surface,improving wettability and adhesion while minimizing glue consumption.Experimental results indicate that plasma treatment reduces the contact angle by 46%and adhesive consumption during bonding by 24%,thereby enhancing the environmental friendliness of the glued structures.Furthermore,this dual treatment process increases the shear strength of adhesive joints by 22.7%and bending strength of glued beams by 66.6%,demonstrating a 30%lower carbon footprint compared to conventional methods.The findings affirm the efficacy of this technology in producing building materials,particularly glued beams for large-span structures.
