Alkali-free SiO_(2)-Al_(2)O_(3)-CaO-MgO with different SiO_(2)/Al_(2)O_(3)mass ratios was prepared by conventional melt quenching method.The glass network structure,thermodynamic properties and elastic modulus changes...Alkali-free SiO_(2)-Al_(2)O_(3)-CaO-MgO with different SiO_(2)/Al_(2)O_(3)mass ratios was prepared by conventional melt quenching method.The glass network structure,thermodynamic properties and elastic modulus changes with SiO_(2)and Al_(2)O_(3)ratios were investigated using various techniques.It is found that when SiO_(2)is replaced by Al_(2)O_(3),the Q^(4) to Q^(3) transition of silicon-oxygen network decreases while the aluminum-oxygen network increases,which result in the transformation of Si-O-Si bonds to Si-O-Al bonds and an increase in glass network connectivity even though the intermolecular bond strength decreases.The glass transition temperature(T_(g))increases continuously,while the thermal expansion coefficient increases and high-temperature viscosity first decreases and then increases.Meanwhile,the elastic modulus values increase from 93 to 102 GPa.This indicates that the elastic modulus is mainly affected by packing factor and dissociation energy,and elements with higher packing factors and dissociation energies supplant those with lower values,resulting in increased rigidity within the glass.展开更多
The low-melting glass of Bi2O_(3)-B2O_(3)-SiO_(2)(BiBSi)system was used for the first time for laser sealing of vacuum glazing.Under the condition of constant boron content,how the structure and properties vary with B...The low-melting glass of Bi2O_(3)-B2O_(3)-SiO_(2)(BiBSi)system was used for the first time for laser sealing of vacuum glazing.Under the condition of constant boron content,how the structure and properties vary with Bi/Si ratio in low-melting glass was investigated.In addition,the relationships between laser power,low-melting glass solder with different Bi/Si ratios and laser sealing shear strength were revealed.The results show that a decrease in the Bi/Si ratio can cause a contraction of the glass network of the low-melting glass,leading to an increase of its characteristic temperature and a decrease of its coefficient of thermal expansion.During laser sealing,the copper ions in the low-melting glass play an endothermic role.A change in the Bi/Si ratio will affect the valence state transition of the copper ions in the low-melting glass.The absorbance of the low-melting glass does not follow the expected correlation with the Bi/Si ratio,but shows a linear correlation with the content of divalent copper ions.The greater the concentration of divalent copper ions,the greater the absorbance of the low-melting glass,and the lower the laser power required for laser sealing.The shear strength of the low melting glass solder after laser sealing was tested,and it was found that the maximum shear strength of Z1 glass sample was the highest up to 2.67 MPa.展开更多
To analyze the impact of bubbles on the mechanical behavior of glasses,by controlling the refining time,we prepared three borosilicate glasses with the same composition and different porosity.By the analysis software ...To analyze the impact of bubbles on the mechanical behavior of glasses,by controlling the refining time,we prepared three borosilicate glasses with the same composition and different porosity.By the analysis software integrated within the optical microscope,the diameter and number of the bubbles on the surface of three borosilicate glasses were quantified.From the hardness and crack initiation resistance(CR),we built the relationship between the porosity and the mechanical performance of these borosilicate glasses.展开更多
基金Supported by the National Key Research Program(No.2024-1129-954-112)National Natural Science Foundation of China(No.52372033)Guangxi Science and Technology Major Program(No.AA24263054)。
文摘Alkali-free SiO_(2)-Al_(2)O_(3)-CaO-MgO with different SiO_(2)/Al_(2)O_(3)mass ratios was prepared by conventional melt quenching method.The glass network structure,thermodynamic properties and elastic modulus changes with SiO_(2)and Al_(2)O_(3)ratios were investigated using various techniques.It is found that when SiO_(2)is replaced by Al_(2)O_(3),the Q^(4) to Q^(3) transition of silicon-oxygen network decreases while the aluminum-oxygen network increases,which result in the transformation of Si-O-Si bonds to Si-O-Al bonds and an increase in glass network connectivity even though the intermolecular bond strength decreases.The glass transition temperature(T_(g))increases continuously,while the thermal expansion coefficient increases and high-temperature viscosity first decreases and then increases.Meanwhile,the elastic modulus values increase from 93 to 102 GPa.This indicates that the elastic modulus is mainly affected by packing factor and dissociation energy,and elements with higher packing factors and dissociation energies supplant those with lower values,resulting in increased rigidity within the glass.
基金Funded by the National Natural Science Foundation of China(No.52472012)Opening Project of State Silica-Based Materials Laboratory of Anhui Province(No.2022KF11)the Research and Development of Glass Powder for Laser Sealing and Its Sealing Technology(No.K24556)。
文摘The low-melting glass of Bi2O_(3)-B2O_(3)-SiO_(2)(BiBSi)system was used for the first time for laser sealing of vacuum glazing.Under the condition of constant boron content,how the structure and properties vary with Bi/Si ratio in low-melting glass was investigated.In addition,the relationships between laser power,low-melting glass solder with different Bi/Si ratios and laser sealing shear strength were revealed.The results show that a decrease in the Bi/Si ratio can cause a contraction of the glass network of the low-melting glass,leading to an increase of its characteristic temperature and a decrease of its coefficient of thermal expansion.During laser sealing,the copper ions in the low-melting glass play an endothermic role.A change in the Bi/Si ratio will affect the valence state transition of the copper ions in the low-melting glass.The absorbance of the low-melting glass does not follow the expected correlation with the Bi/Si ratio,but shows a linear correlation with the content of divalent copper ions.The greater the concentration of divalent copper ions,the greater the absorbance of the low-melting glass,and the lower the laser power required for laser sealing.The shear strength of the low melting glass solder after laser sealing was tested,and it was found that the maximum shear strength of Z1 glass sample was the highest up to 2.67 MPa.
基金Funded by the National Natural Science Foundation of China(No.52172007)。
文摘To analyze the impact of bubbles on the mechanical behavior of glasses,by controlling the refining time,we prepared three borosilicate glasses with the same composition and different porosity.By the analysis software integrated within the optical microscope,the diameter and number of the bubbles on the surface of three borosilicate glasses were quantified.From the hardness and crack initiation resistance(CR),we built the relationship between the porosity and the mechanical performance of these borosilicate glasses.
