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Synthesis and properties of a novel perfluorinated polyimide with high toughness,low dielectric constant and low dissipation factor
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作者 Hangqian Wang Yao Zhang +4 位作者 xialei lv Jinhui Li Kuangyu Wang Guoping Zhang Rong Sun 《Industrial Chemistry & Materials》 2025年第5期587-595,共9页
With the development of high-frequency communication technologies,polyimide(PI)materials with a low dielectric constant(Dk)and low dissipation factor(Df)are urgently needed to reduce signal crosstalk and other transmi... With the development of high-frequency communication technologies,polyimide(PI)materials with a low dielectric constant(Dk)and low dissipation factor(Df)are urgently needed to reduce signal crosstalk and other transmission problems.The introduction of a trifluoromethyl group is a common strategy to reduce Dk and Df,but the bulky trifluoromethyl group would diminish stacking density and consequently lead to inferior mechanical properties.Herein,a novel diamine monomer,2,3,4,5,6-pentafluororo-3,5-bis(4-aminophenoxy)-1,1-biphenyl(5FBODA),was designed and synthesized using simple reactions.Subsequently,fluorinated diamine and dianhydride were copolymerized with 5FBODA to obtain a series of fluorinated polyimide(FPI)with excellent dielectric properties and good mechanical performances,particularly high elongation at break.The pentafluorophenyl side group showed an obvious electronwithdrawing effect and made the charge of the structure more balanced,which reduced the molecular polarization rate and charge concentration to some extent,significantly helping in reducing Dk at high frequency.As the 5FBODA content increased,the large lateral group restricted the movement of the main chain,constrained the dipole polarization,thereby effectively diminishing their Df.Moreover,when 20-30%5FBODA was added,the pentafluorophenyl side group increased the intermolecular forces,thereby enhancing the elongation at break while maintaining good thermal properties.These FPIs exhibited remarkable advantages for advanced microelectronic packaging applications,providing an innovative solution for the development of next-generation high-performance electronic materials. 展开更多
关键词 Wafer level packaging Fluorinated polyimide Low dielectric High toughness
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Efficient,deep red phosphorescent OLEDs using 1,2,4-thiadiazole core-based novel bipolar host with low efficiency roll-off 被引量:1
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作者 Runda GUO Wenzhi ZHANG +2 位作者 Qing ZHANG xialei lv Lei WANG 《Frontiers of Optoelectronics》 EI CSCD 2018年第4期375-384,共10页
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