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Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys 被引量:3
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作者 xujinfeng 《Chinese Science Bulletin》 SCIE EI CAS 2004年第21期2242-2247,共6页
The rapid solidification behavior of Co-Sn al- loys was investigated by melt spinning method. The growth morphology of αCo phase in Co-20%Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of column... The rapid solidification behavior of Co-Sn al- loys was investigated by melt spinning method. The growth morphology of αCo phase in Co-20%Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of columnar αCo dendrite forms near the roller side at low cooling rates. This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstruc- ture characterized by the distribution of equiaxed αCo den- drites in γCo3Sn matrix is subsequently produced. For Co-34.2%Sn eutectic alloy, anomalous eutectic forms within the whole range of cooling rates. The increase of cooling rate has two obvious effects on both alloys: one is the microstruc- ture refinement, and the other is that it produces more crys- tal defects to intensify the scattering of free electrons, leading to a remarkable increase of electrical resistivity. Under the condition that the grain boundary reflection coefficient r approaches 1, the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically. 展开更多
关键词 显微结构表征 电阻率 快速凝固法 CO SN 钴锡合金 枝状生长 冷却速度
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