We design and fabricate a 128 × 128 AlGaAs/GaAs quantum well infrared photodetector focal plane array （FPA）. The device is achieved by metal organic chemical vapor deposition and GaAs integrated circuit process...We design and fabricate a 128 × 128 AlGaAs/GaAs quantum well infrared photodetector focal plane array （FPA）. The device is achieved by metal organic chemical vapor deposition and GaAs integrated circuit processing technology. A test structure of the photodetector with a mesa size of 300μm × 300μm is also made in order to obtain the device parameters. The measured dark current density at 77K is 1.5 × 10^-3A/cm^2 with a bias voltage of 2V. The peak of the responsivity spectrum is at 8.4μm,with a cutoff wavelength of 9μm. The blackbody detectivity is shown to be 3.95 × 10^8 （cm · Hz^1/2）/W. The final FPA is flip-chip bonded on a CMOS read-out integrated circuit. The infrared thermal images of some targets at room temperature background are successfully demonstrated at 80K operating temperature with a ratio of dead pixels of less than 1%.展开更多
文摘We design and fabricate a 128 × 128 AlGaAs/GaAs quantum well infrared photodetector focal plane array （FPA）. The device is achieved by metal organic chemical vapor deposition and GaAs integrated circuit processing technology. A test structure of the photodetector with a mesa size of 300μm × 300μm is also made in order to obtain the device parameters. The measured dark current density at 77K is 1.5 × 10^-3A/cm^2 with a bias voltage of 2V. The peak of the responsivity spectrum is at 8.4μm,with a cutoff wavelength of 9μm. The blackbody detectivity is shown to be 3.95 × 10^8 （cm · Hz^1/2）/W. The final FPA is flip-chip bonded on a CMOS read-out integrated circuit. The infrared thermal images of some targets at room temperature background are successfully demonstrated at 80K operating temperature with a ratio of dead pixels of less than 1%.
文摘基于Ga N微波功率器件工艺制作了大栅宽Ga N高电子迁移率晶体管（HEMT）管芯,通过负载牵引及建模技术提取了管芯的输入阻抗、输出阻抗。采用二项式多节阻抗匹配变换器实现了宽带功率分配器及合成器电路的制作,通过采用LC网络提升了管芯输入阻抗、输出阻抗,加入了稳定网络,实现了50Ω阻抗匹配。采用高热导率金属陶瓷外壳,提高了器件散热能力。最终研制成功大功率Ga N HEMT内匹配器件,器件采用四胞管芯功率合成技术,总栅宽为40 mm。测试结果表明,频率为4.5~4.8 GHz,脉宽300μs,占空比10%,工作电压VDS为28V,器件的输出功率大于120 W,功率附加效率大于50%,功率增益大于11 d B。
