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化学镀三元Ni-W-P合金的沉积条件 被引量:6

Electroless Plating of Ni-W-P Alloy
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摘要 介绍在复合络合荆的体系中,用铁族金属诱导共沉积金属钨,得出三元 Ni-W-P 合金镀层的工艺条件,简述镀液成份的作用和对沉积条件的影响,并对镀层的组成、耐蚀性等进行了测试,从而显示了三元合金镀层的优越性。 The technical conditions to obtain the Ni-W-P alloy film was introduced,with the Fe metals as the substrates to induce the codeposition of W in a composite complex system.The functions of the electrolyte composition and their influences to the deposition were also introdnced briefly. The composition of the film and the corrosion resistance of the film were tested.The results show that the Ni—W—P alloy film is of good advantages.
出处 《表面技术》 EI CAS CSCD 1993年第6期247-250,共4页 Surface Technology
关键词 化学镀 沉积条件 镍钨磷合金 Electroless plating Ni-W-P alloy Deposition condition
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